GB945115A - Improvements in or relating to methods of, and devices for, the soldering of semi-conductor crystals - Google Patents

Improvements in or relating to methods of, and devices for, the soldering of semi-conductor crystals

Info

Publication number
GB945115A
GB945115A GB1680560A GB1680560A GB945115A GB 945115 A GB945115 A GB 945115A GB 1680560 A GB1680560 A GB 1680560A GB 1680560 A GB1680560 A GB 1680560A GB 945115 A GB945115 A GB 945115A
Authority
GB
United Kingdom
Prior art keywords
tube
crystal
soldering
wire
bulb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1680560A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronics UK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL239127 priority Critical
Application filed by Philips Electronics UK Ltd filed Critical Philips Electronics UK Ltd
Publication of GB945115A publication Critical patent/GB945115A/en
Application status is Expired legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01032Germanium [Ge]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01075Rhenium [Re]

Abstract

945,115. Soldering. PHILIPS ELECTRICAL INDUSTRIES Ltd. May 12, 1960 [May 12, 1959], No. 16805/60. Heading B3R. [Also in Division H1] In a method of soldering a semiconductor crystal to a disc on the end of a wire sealed through a glass bulb a plate of solder is held between the crystal and disc by pressing a tube slidable relative to the bulb against the crystal. A non-oxidizing atmosphere is supplied to the interior of the bulb through the tube and then heat required for the soldering operation is supplied via the tube and wire simultaneously. In one method the bulb is mounted open end uppermost with the solder plate and crystal on the disc and the tube inserted into the bulb and pressed against the crystal. The soldering operation may alternatively be carried out in the apparatus illustrated in Fig. 4 which comprises a tube 30 with a recess 38 (Fig. 4a) in its upper end for holding the crystal and solder. The position of this tube and associated parts through which non-oxidizing gas is supplied, shown in more detail in Fig. 4a, is determined by an adjustable stop 39. The apparatus also comprises a fixed heating coil 52, a pivotally mounted open - sided heating coil 61 described with reference to Figs. 4b and 4c (not shown) and mechanical means for applying pressure to the wire. In operation the crystal and solder are first placed in that order in recess 38. Pressure member 70 is raised and coil 61 swung into position 61b by an upward movement of cam-operated rod 47 against the resilience of spring 49 to enable the glass bulb 5 (Fig. 2a) to be placed over tube 30 with disc 4 located in recess 38. Further movement of the cam allows rod 47 to assume its original position with the coil embracing the wire in position 61a and the pressure member 70 bearing on the end of the wire. To avoid shock loads on the wire during this movement the end section of the pressure member may be resiliently mounted as shown in Fig. 4d. After the bulb has been flushed out by a flow of non-oxidizing gas through tube 30 coils 52 and 61 are energized to supply heat via tube 30 and the wire, respectively, to complete the soldering. A machine for mass production, shown in Fig. 5, includes a rotating table 75 carrying a multiplicity of apparatus 76 of the above type to which crystals and solder plates are automatically fed from containers 78, 79, respectively. The glass bulbs, carried in holders 85, are positioned in the apparatus by arm 90 and, after soldering, are removed therefrom and replaced in the holders by arm 92. The stepping movement of the holders by a pawl mechanism is synchronized with the movement of the tube to allow this.
GB1680560A 1959-05-12 1960-05-12 Improvements in or relating to methods of, and devices for, the soldering of semi-conductor crystals Expired GB945115A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
NL239127 1959-05-12

Publications (1)

Publication Number Publication Date
GB945115A true GB945115A (en) 1963-12-23

Family

ID=19751726

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1680560A Expired GB945115A (en) 1959-05-12 1960-05-12 Improvements in or relating to methods of, and devices for, the soldering of semi-conductor crystals

Country Status (4)

Country Link
CH (1) CH384084A (en)
DE (1) DE1133832B (en)
GB (1) GB945115A (en)
NL (2) NL239127A (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2859394A (en) * 1953-02-27 1958-11-04 Sylvania Electric Prod Fabrication of semiconductor devices
US2736847A (en) * 1954-05-10 1956-02-28 Hughes Aircraft Co Fused-junction silicon diodes
NL109558C (en) * 1955-05-10 1900-01-01

Also Published As

Publication number Publication date
NL239127A (en)
NL102017C (en)
DE1133832B (en) 1962-07-26
CH384084A (en) 1964-11-15

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