GB9313756D0 - A method of encapsulating a component - Google Patents

A method of encapsulating a component

Info

Publication number
GB9313756D0
GB9313756D0 GB939313756A GB9313756A GB9313756D0 GB 9313756 D0 GB9313756 D0 GB 9313756D0 GB 939313756 A GB939313756 A GB 939313756A GB 9313756 A GB9313756 A GB 9313756A GB 9313756 D0 GB9313756 D0 GB 9313756D0
Authority
GB
United Kingdom
Prior art keywords
encapsulating
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB939313756A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avery Weigh Tronix Ltd
Original Assignee
GEC Avery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEC Avery Ltd filed Critical GEC Avery Ltd
Priority to GB939313756A priority Critical patent/GB9313756D0/en
Publication of GB9313756D0 publication Critical patent/GB9313756D0/en
Priority to GB9413175A priority patent/GB2280314B/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
GB939313756A 1993-07-02 1993-07-02 A method of encapsulating a component Pending GB9313756D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB939313756A GB9313756D0 (en) 1993-07-02 1993-07-02 A method of encapsulating a component
GB9413175A GB2280314B (en) 1993-07-02 1994-06-30 A method of encapsulating a component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB939313756A GB9313756D0 (en) 1993-07-02 1993-07-02 A method of encapsulating a component

Publications (1)

Publication Number Publication Date
GB9313756D0 true GB9313756D0 (en) 1993-08-18

Family

ID=10738221

Family Applications (2)

Application Number Title Priority Date Filing Date
GB939313756A Pending GB9313756D0 (en) 1993-07-02 1993-07-02 A method of encapsulating a component
GB9413175A Expired - Fee Related GB2280314B (en) 1993-07-02 1994-06-30 A method of encapsulating a component

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB9413175A Expired - Fee Related GB2280314B (en) 1993-07-02 1994-06-30 A method of encapsulating a component

Country Status (1)

Country Link
GB (2) GB9313756D0 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4635356A (en) * 1984-12-28 1987-01-13 Kabushiki Kaisha Toshiba Method of manufacturing a circuit module

Also Published As

Publication number Publication date
GB2280314A (en) 1995-01-25
GB9413175D0 (en) 1994-08-24
GB2280314B (en) 1997-04-16

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