GB8800657D0 - Internal location - Google Patents
Internal locationInfo
- Publication number
- GB8800657D0 GB8800657D0 GB8800657A GB8800657A GB8800657D0 GB 8800657 D0 GB8800657 D0 GB 8800657D0 GB 8800657 A GB8800657 A GB 8800657A GB 8800657 A GB8800657 A GB 8800657A GB 8800657 D0 GB8800657 D0 GB 8800657D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- internal location
- location
- internal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8701951A GB8701951D0 (en) | 1987-01-29 | 1987-01-29 | Integrated circuit package |
Publications (2)
Publication Number | Publication Date |
---|---|
GB8800657D0 true GB8800657D0 (en) | 1988-02-10 |
GB2203893A GB2203893A (en) | 1988-10-26 |
Family
ID=10611385
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8701951A Pending GB8701951D0 (en) | 1987-01-29 | 1987-01-29 | Integrated circuit package |
GB8800657A Pending GB2203893A (en) | 1987-01-29 | 1988-01-13 | Integrated circuit package |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8701951A Pending GB8701951D0 (en) | 1987-01-29 | 1987-01-29 | Integrated circuit package |
Country Status (1)
Country | Link |
---|---|
GB (2) | GB8701951D0 (en) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3877064A (en) * | 1974-02-22 | 1975-04-08 | Amp Inc | Device for connecting leadless integrated circuit packages to a printed-circuit board |
FR2493602A1 (en) * | 1980-10-31 | 1982-05-07 | Thomson Csf | COMPONENT ENCAPSULATION CASE BOARD, WITH COPLANAR ELECTRODES AND SEMICONDUCTOR DEVICE THUS ENCAPSULATED |
-
1987
- 1987-01-29 GB GB8701951A patent/GB8701951D0/en active Pending
-
1988
- 1988-01-13 GB GB8800657A patent/GB2203893A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
GB2203893A (en) | 1988-10-26 |
GB8701951D0 (en) | 1987-03-04 |
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