GB2552807A - A planar LED light source module - Google Patents
A planar LED light source module Download PDFInfo
- Publication number
- GB2552807A GB2552807A GB1613752.3A GB201613752A GB2552807A GB 2552807 A GB2552807 A GB 2552807A GB 201613752 A GB201613752 A GB 201613752A GB 2552807 A GB2552807 A GB 2552807A
- Authority
- GB
- United Kingdom
- Prior art keywords
- light source
- housing
- source module
- led light
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/0031—Reflecting element, sheet or layer
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0036—2-D arrangement of prisms, protrusions, indentations or roughened surfaces
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0051—Diffusing sheet or layer
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0053—Prismatic sheet or layer; Brightness enhancement element, sheet or layer
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0058—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide
- G02B6/0061—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide to provide homogeneous light output intensity
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0091—Positioning aspects of the light source relative to the light guide
Abstract
An LED light source module 10 for a lighting unit comprising a housing 3, PCB 9, row/s of LEDs 8 and optical layers 1, 4-6 coupled to the LEDs 8. The optical layers 1, 4-6 are slidable with respect to one another when bent and may comprise a light guide plate 5, a specular reflector film 6, a diffuser 4 and a brightness enhancement film (BEF) 1. Each optical layer may comprise one or more low friction thin films. The lighting unit may comprise a pressure sensitive adhesive 2 for attaching the BEF 1 to the internal rim of the housing 3. The housing edges may be flush with the BEF for mounting onto a surface. Mounting means may include using stretch release tape, an optically clear adhesive film or a thermally conductive adhesive backplane 7 attachable to the housing 3. The PCB 9 and housing 3 may be flexible.
Description
(54) Title of the Invention: A planar LED light source module Abstract Title: A planar LED light source module (57) An LED light source module 10 for a lighting unit comprising a housing 3, PCB 9, row/s of LED’s 8 and optical layers 1,4-6 coupled to the LED’s 8. The optical layers 1,4-6 are slidable with respect to one another when bent and may comprise a light guide plate 5, a specular reflector film 6, a diffuser 4 and a brightness enhancement film (BEF) 1. Each optical layer may comprise one or more low friction thin films. The lighting unit may comprise a pressure sensitive adhesive 2 for attaching the BEF 1 to the internal rim of the housing 3. The housing edges may be flush with the BEF for mounting onto a surface. Mounting means may include using stretch release tape, an optically clear adhesive film or a thermally conductive adhesive backplane 7 attachable to the housing 3. The PCB 9 and housing 3 may be flexible.
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Title
A planar LED light source module
Field
The present invention relates to a LED light source module for a luminaire.
More particularly, the invention relates to providing a flexible LED light source module for producing a surface of white light.
Background
There has been much research into the development of light sources which produce a surface of white light for a luminaire, instead of the more conventional point light sources, such as LED, incandescent and HID lamps (more commonly referred to as bulbs by consumers). One known technology achieves this through the creation of a square array of light emitting diodes (LEDs) mounted on a PCB. A mixing chamber then mixes and converges the LED light, while a diffuser reduces the glare from individual LEDs and provides a uniform panel luminance. However, this design suffers from the drawback that it requires a deep luminaire (typically 3-8cm in depth), due to a considerable volume being required by the mixing chamber.
Another technique makes use of edge-lit LED technology to create such a light source. However, this approach also requires a thick luminaire, and thus its use is limited to larger scale recessed luminaires and backlighting applications, such as for TVs and PC monitors. Furthermore, it requires the fabrication of a complete luminaire. Thus, it is not possible to create new luminaire designs using this technology.
It is an object of the present invention to provide a LED light source which produces a surface of white light which overcomes at least one of the above mentioned problems.
Summary
Accordingly to the invention there is provided, as set out in the appended claims, a light emitting diode, LED, light source module for a luminaire comprising:
a printed circuit board, PCB;
at least one row of LEDs mounted on the PCB;
a plurality of optical layers coupled to the LEDs for emitting a surface of light and a housing;
wherein the optical layers are slidable with respect to one another when bent.
In one embodiment, each optical layer comprises one or more low friction thin films.
In one embodiment, the optical layers comprise:
a light guide plate layer;
a specular reflector film, SR layer;
a diffuser layer; and a brightness enhancement film, BEF layer.
In one embodiment, the housing comprises an internal rim, and wherein the module further comprises a pressure sensitive adhesive for attaching the BEF to the internal rim of the housing.
In one embodiment, the edges of the housing are flush with the BEF for direct mounting of the module onto a surface.
In one embodiment, the LED light source module further comprises an attachment means for mounting the module to a surface.
In one embodiment, the attachment means comprises a thermal conductive adhesive backplane film attachable to the housing.
In one embodiment, the attachment means comprises a stretch release tape attachable to the housing.
In one embodiment, the attachment means comprises an optically clear adhesive film attachable to the BEF.
In one embodiment, the housing comprises a flexible plastic.
In one embodiment, the housing has a Young Modulus in the range of 0.1 to 2.0 GPa.
In one embodiment, the PCB comprises a flexible PCB.
In one embodiment, the flexible PCB comprises a PCB provided with plurality of slots to improve flexibility.
In one embodiment, the at least one row of LEDs comprises a plurality of ultra-thin LEDs.
In one embodiment, the thickness of the module is less than 3mm.
In one embodiment, the module is bendable about one or both of its x and y axes.
In one embodiment, the housing comprises a recessed groove for receiving wiring for the module.
In one embodiment, the wiring is configurable to emerge from the recessed groove diagonally from the corner of the housing and/or coincident to the edge of the housing and/or perpendicular to the back surface of the housing.
Brief Description of the Drawings
The invention will be more clearly understood from the following description of an embodiment thereof, given by way of example only, with reference to the accompanying drawings, in which:Figure 1 shows a perspective view of the LED light source module of the invention;
Figure 2 shows a exploded view of the light source module of Figure 1;
Figure 3 shows a section through the light source module of Figure 1;
Figure 4 shows a recessed groove provided on the housing for the wiring;
Figure 5 shows one configuration of the wiring in the recessed groove;
Figure 6 shows an alternative configuration of the wiring in the recessed groove; and
Figure 7 shows another alternative configuration of the wiring in the recessed groove.
Detailed Description of the Drawings
The present invention provides a LED light source module for a luminaire that produces white light from a surface which is flexible and ultra-thin.
In accordance with the described embodiment shown in the figures, the module 10 comprises a flexible printed circuit board (PCB) 9, a plurality of rows of ultrathin LEDs in the form of a LED subassembly 8 mounted on the PCB 9, and a plurality of optical layers coupled to the LED subassembly 8, all of which are contained in a flexible housing 3.
The optical layers comprise a light guide plate layer 5, a specular reflector film (SR) layer 6, a diffuser layer 4, and a brightness enhancement film (BEF) layer
1. Each optical layer comprises at least one low friction, ultra- thin film such that the optical layers can slide over each other when bent. As a result, the module provides flexibility and can be bendable about one or both of its x and y axes.
In the described embodiment of the invention, the LGP 5 is a thin plastic plate that contains thousands of features in the form of tiny bumps and ridges. These features allow for light extraction from the plastic plate, and thus prevent the occurrence of total internal reflection. Thus, total internal refraction occurs within the LGP 5 until the light hits one of these features. The LGP 5 is also adapted to maximise the uniformity of the light extracted by the features. Thus, the LGP 5 is designed so that there are fewer features near the LEDs, and an increasing number of features as the distance away from the LEDs increases.
The SR 6 is adapted to reflect any light received from the LGP 5 upwards towards the emission plane. The diffuser 4 increases the uniformity of the light emitting surface (LES), and also influences the photometry of the light source by effecting the amount of light emitted off-angle from the normal of the LES. However, it should be noted in this regard that the BEF 1 has a greater effect on this photometry, while the diffuser 4 is primarily for uniformity.
The BEF 1 contains prism shaped features that refract light moving at a high angle to the normal of the module to bring it closer to the normal. This improves the photometic properties of the module, by increasing the directivity of the light while maintaining adequate diffusion.
A pressure sensitive adhesive (PSA) 2 attaches the BEF 1 to the housing 3. In the described embodiment of the invention, the PSA 2 takes the form of a double sided adhesive tape.
The multiple LEDs forming the LED subassembly 8 provide a high total light output for the module. The LEDs are soldered onto the flexible PCB 9 via surface mounted technology (SMT), and are connected to allow for a single point for the power supply to enter the module. The PCB 9 connects the LED subassembly 8 to the external power supply and is designed to transform the supplied current and voltage to the optimal power supply for each individual LED. The external power supply is a standard LED constant current driver. The driving voltage and current are dependant on the number and type of LEDs, aswell as the target light output from the module. In one embodiment of the invention, the LED subassembly 8 comprises ultra thin warm white (3000k) or neutral white (4000k) LED chips.
The housing 3 is a flexible plastic. In one embodiment of the invention, the housing has a Young Modulus within the range of 0.1 GPa to 2.0 GPa. In the described embodiment of the invention, the flexibility is optimized through the use of slots provided in the PCB 9. The housing 3 may also coloured white, in order to maximise internal reflectivity.
The module of the present invention is designed so that there is no raised bezel on the light emitting surface. This is achieved through the provision of an internal rim on the housing (not shown). This rim acts as both a light shield to define the active area, as well as a surface to attach to the BEF 1. The BEF 1 can then be attached to the housing through the PSA 2. In the described embodiment of the invention, the housing edges are flush with the BEF 1. This prevents peeling of the BEF from the module during handling and over a lifetime. In one embodiment of the invention, the module has a thickness of less than 3mm.
In use, light emitted by the LED subassembly 8 directly enters into the LGP 5. The LGP 5 reflects and refracts the light in the perpendicular direction to the incoming light source, and allows the light to escape from the plate. Approximately half of the light initially leaves the LGP 5 in a downwards direction, at which point the light is reflected upwards again by the SR 6. Light that leaves the LGP 5 in the upwards direction, either as a result of one of the features on the LGP 5, or from being reflected by the SR 6, then enters the diffuser 4. Once the light is diffused through the diffuser 4, it is emitted out of the module through the BEF 1 as a surface of light.
The module 10 of the present invention may be mounted either at the back or front. In one embodiment of the invention, the module 10 is mounted at the back via an attachment means in the form of a backplane 7 comprising a thermally conductive self adhesive plastic film. This back film therefore allows for both effective thermal management and reduced total thickness. This enables the attachment of the module to be permanent or semi-permanent. In addition, the attachment of the module does not require any additional tools and does not effect the external finish of the module.
In an alternative embodiment, the module is mounted at the back via a stretch release tape (not shown). This material allows great flexibility for detaching the module.
For front mounting, an optically clear adhesive film (OCA) may be used. It comprises a double sided adhesive film that allows maximum light transfer for when the module is mounted onto a transparent material, such as glass or plastic. This OCA layer covers the entire front face, over the BEF layer 1.
A recessed groove is provided on the housing 3 for the wiring of the module which has dimensions less than the thickness of the module, with the groove ensuring the wiring does not protrude above the backplane 7. In one embodiment of the invention, the groove 11 is provided with filleted openings to the housing sides, as shown in Figure 4. This design facilitates a number of different configurations options for the wiring, so as to minimize the visual impact of the wiring depending on the desired use of the module, such as for example in lighting fixtures, furniture, walls or ceilings.
Figures 5 to 7 show a number of alternative wiring configurations for the module. In Figure 5, the wiring 12 is arranged in the groove 11 so that it emerges diagonally from the corner of the housing 3, such as at a nominal 45 degree angle. In Figure 6, the wiring 12 is arranged in the groove 11 so that it emerges coincident to the edge of the housing 3. This is made possible by the filleted openings in the groove 11, such that the wiring can be bent around these openings to go from a diagonal to a coincident direction to the edges of the housing. In Figure 7, the wiring 12 is arranged in the groove 11 so that it emerges set back a few millimetres from the corner of the housing 3 and perpendicular to its surface. This configuration enables the wiring to be passed through an aperture in a surface to which the module is to be attached, and the wiring will then be hidden behind the module once the module is attached to the surface. As a result, there is no visible wiring to be seen on the module, so creating an appealing aesthetic finish.
One aspect of providing these different wiring configurations is to provide robust strain relief, preventing stress and fracture where the external wiring connects to the PCB of the module. This is achieved using a high strength resin or glue which anchors the base of the wiring within the groove 11 before it emerges from the housing 3.
The performance and lifetime of LEDs is severely impacted by overheating. Accordingly, a path for thermal transfer away from the LED subassembly is always necessary. Thus, the use of thermal tapes on the back of the housing and the design of using multiple low power LEDs improves the thermal performance of the module. In one embodiment of the module, graphite is used to further improve thermal spreading and increase thermal conductivity between the LEDs and the backplane. The graphite is positioned as a layer between the LED subassembly 8 and the adhesive backplane 7.
The present invention provides numerous advantages when compared to existing technology for producing a surface of white light. Firstly, due to its flexibility, the module is suitable for complex and aesthetic luminaire design and mounting in a way that cannot be achieved with existing technologies, such as for example attachment to curved surfaces.
Furthermore, the ultra thin design reduces the total required size for the luminaire. As a result, the invention can be used in small spaces, such as under a shelf or in a drawer. Through the use of multiple rows of LEDs for small area illumination, the light output relative to the dimensions of the module is also very high and does not cause glare associated with point light sources. Furthermore, the LEDs are thermally managed in order to maintain their performance.
The fabrication costs of the module of the invention are also lower when compared to existing OLED lighting modules of similar form factor, and of inferior efficacy and lifetime performance.
The module of the present invention does not require secondary optical controls to provide a comfortable, low glare light source. The module also has the advantage that it can be powered through the use of existing LED driver technology, and integrated with current LED lighting ecosystems.
As a result of the bezel-less design, the module may be directly mounted onto transparent surfaces. It also enhances the aesthetic appearance of the module. In addition, the fact that the module may be mechanically mounted using adhesive films results in simplified installation for the luminaire manufacturer.
It will further be appreciated that the present invention is not limited to use with a luminaire, and can be used as a standalone module too. It therefore has applications in any area where a small uniform surface of light is required. Such areas include use as a microscope backlight, in decorative applications in furniture, for illuminated signage, and in medical and industrial equipment. The present invention also has applications where space is limited, such as in automotive or aerospace interiors.
Claims (18)
1. A light emitting diode, LED, light source module for a luminaire comprising: a printed circuit board, PCB;
at least one row of LEDs mounted on the PCB;
a plurality of optical layers coupled to the LEDs for emitting a surface of light and a housing;
wherein the optical layers are slidable with respect to one another when bent.
2. The LED light source module of Claim 1, wherein each optical layer comprises one or more low friction thin films.
3. The LED light source module of Claim 1 or Claim 2, wherein the optical layers comprise:
a light guide plate layer; a specular reflector film, SR layer; a diffuser layer; and a brightness enhancement film, BEF layer.
4. The LED light source module of Claim 3, wherein the housing comprises an internal rim, and wherein the module further comprises a pressure sensitive adhesive for attaching the BEF to the internal rim of the housing.
5. The LED light source module of Claim 4, wherein the edges of the housing are flush with the BEF for direct mounting of the module onto a surface.
6. The LED light source module of any of the preceding claims, further comprising an attachment means for mounting the module to a surface.
7. The LED light source module of Claim 6, wherein the attachment means comprises a thermal conductive adhesive backplane film attachable to the housing.
8. The LED light source module of Claim 6, wherein the attachment means comprises a stretch release tape attachable to the housing.
9. The LED light source module of Claim 6, wherein the attachment means comprises an optically clear adhesive film attachable to the BEF layer.
10. The LED light source module of any of the preceding claims, wherein the housing comprises a flexible plastic.
11. The LED light source module of any of the preceding claims, wherein the housing has a Young Modulus in the range of 0.1 to 2.0 GPa.
12. The LED light source module of any of the preceding claims, wherein the PCB comprises a flexible PCB.
13. The LED light source module of Claim 12, wherein the flexible PCB comprises a PCB provided with plurality of slots to improve flexibility.
14. The LED light source module of any of the preceding claims wherein the at least one row of LEDs comprises a plurality of ultra-thin LEDs.
15. The LED light source module of any of the preceding claims, wherein the thickness of the module is less than 3mm.
16. The LED light source module of any of the preceding claims, wherein the module is bendable about one or both of its x and y axes.
17. The LED light source module of any of the preceding claims, wherein the housing comprises a recessed groove for receiving wiring for the module.
18. The LED light source module of Claim 17, wherein the wiring is configurable to emerge from the recessed groove diagonally from the corner of the housing and/or coincident to the edge of the housing and/or perpendicular to the back surface of the housing.
Intellectual
Property
Office
Application No: GB1613752.3 Examiner: Nadeem Khan
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1613752.3A GB2552807B (en) | 2016-08-10 | 2016-08-10 | A planar LED light source module |
| PCT/EP2017/070256 WO2018029285A1 (en) | 2016-08-10 | 2017-08-09 | A planar led light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1613752.3A GB2552807B (en) | 2016-08-10 | 2016-08-10 | A planar LED light source module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2552807A true GB2552807A (en) | 2018-02-14 |
| GB2552807B GB2552807B (en) | 2019-03-20 |
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ID=59772589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1613752.3A Expired - Fee Related GB2552807B (en) | 2016-08-10 | 2016-08-10 | A planar LED light source module |
Country Status (2)
| Country | Link |
|---|---|
| GB (1) | GB2552807B (en) |
| WO (1) | WO2018029285A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2570900B (en) * | 2018-02-08 | 2021-03-03 | Hanbury Matthew | A planar LED light source module |
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| US20110128756A1 (en) * | 2009-11-30 | 2011-06-02 | Cho Joo-Woan | Backlight assembly |
| US20140036534A1 (en) * | 2012-08-02 | 2014-02-06 | Samsung Display Co., Ltd. | Optical sheet guide member, and backlight unit having the optical sheet guide member |
| US20160282549A1 (en) * | 2013-07-01 | 2016-09-29 | Sharp Kabushiki Kaisha | Illumination device, display device, and television receiving device |
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| JP3601460B2 (en) * | 2000-04-28 | 2004-12-15 | 住友化学工業株式会社 | Manufacturing method of large light guide plate |
| GB2479590B (en) * | 2010-04-16 | 2016-08-10 | Zeta Specialist Lighting | Light guide panel assembly |
| CN201811017U (en) * | 2010-07-15 | 2011-04-27 | 张力诚 | Luminaire structure |
| CN201731362U (en) * | 2010-07-20 | 2011-02-02 | 上海亮硕光电子科技有限公司 | Ultra-long ultra-thin LED panel lamp |
| JP5576504B2 (en) * | 2010-12-10 | 2014-08-20 | 京セラ株式会社 | Light source device and display device |
| KR20130049087A (en) * | 2011-11-03 | 2013-05-13 | 팀켐 컴퍼니 | Structure of thermal conductive flexible printed circuit board |
| CN103133918B (en) * | 2011-11-23 | 2015-11-11 | 财团法人工业技术研究院 | Surface light source and flexible surface light source |
| DE112013002944T5 (en) * | 2012-06-13 | 2015-02-19 | Innotec, Corp. | Flexible hollow fiber optic cable |
| KR101465564B1 (en) * | 2012-08-22 | 2014-11-26 | 주식회사 그림자 | Thermal conductive adhesive comprising thermal conductive composite powder, thermal dissipation tape of thin film type comprising thereof and method of preparation the same |
| KR101503038B1 (en) * | 2014-08-20 | 2015-03-16 | 주식회사 에스티씨 | Vehicle Lamp of Slim Type with 3D Multi-level Effect |
-
2016
- 2016-08-10 GB GB1613752.3A patent/GB2552807B/en not_active Expired - Fee Related
-
2017
- 2017-08-09 WO PCT/EP2017/070256 patent/WO2018029285A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110128756A1 (en) * | 2009-11-30 | 2011-06-02 | Cho Joo-Woan | Backlight assembly |
| US20140036534A1 (en) * | 2012-08-02 | 2014-02-06 | Samsung Display Co., Ltd. | Optical sheet guide member, and backlight unit having the optical sheet guide member |
| US20160282549A1 (en) * | 2013-07-01 | 2016-09-29 | Sharp Kabushiki Kaisha | Illumination device, display device, and television receiving device |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2552807B (en) | 2019-03-20 |
| WO2018029285A1 (en) | 2018-02-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20200810 |