GB2547346A - Heat transfer assemblies - Google Patents

Heat transfer assemblies

Info

Publication number
GB2547346A
GB2547346A GB1703612.0A GB201703612A GB2547346A GB 2547346 A GB2547346 A GB 2547346A GB 201703612 A GB201703612 A GB 201703612A GB 2547346 A GB2547346 A GB 2547346A
Authority
GB
United Kingdom
Prior art keywords
heat transfer
porous element
transfer assemblies
moveable
diaphragm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB1703612.0A
Other versions
GB201703612D0 (en
GB2547346B (en
Inventor
John Baldwin Graham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GE Aviation Systems Ltd
Original Assignee
GE Aviation Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GE Aviation Systems Ltd filed Critical GE Aviation Systems Ltd
Publication of GB201703612D0 publication Critical patent/GB201703612D0/en
Publication of GB2547346A publication Critical patent/GB2547346A/en
Application granted granted Critical
Publication of GB2547346B publication Critical patent/GB2547346B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat transfer assembly (10, 110, 210, 310) for transferring heat from a heat generating electrical element(12, 112, 212, 312) and having a porous element (14, 114, 214, 314) having a portion configured to contact the heat generating element (12, 112, 212, 312) and a moveable diaphragm (18, 118, 218, 318) having a portion adjacent the porous element (14, 114, 214, 314) and where the diaphragm (18, 118, 218, 318) is moveable between an extended position towards the porous element (14, 14, 214, 314) and a retracted position away from the porous element (14, 114, 214, 314).
GB1703612.0A 2014-09-10 2014-09-10 Heat transfer assemblies Active GB2547346B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/GB2014/052740 WO2016038321A1 (en) 2014-09-10 2014-09-10 Heat transfer assemblies

Publications (3)

Publication Number Publication Date
GB201703612D0 GB201703612D0 (en) 2017-04-19
GB2547346A true GB2547346A (en) 2017-08-16
GB2547346B GB2547346B (en) 2019-09-04

Family

ID=51585127

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1703612.0A Active GB2547346B (en) 2014-09-10 2014-09-10 Heat transfer assemblies

Country Status (3)

Country Link
US (1) US10514214B2 (en)
GB (1) GB2547346B (en)
WO (1) WO2016038321A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202015103789U1 (en) * 2015-07-17 2015-07-31 Abb Technology Ag Surface temperature sensor
US10267568B2 (en) * 2016-05-11 2019-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Programmable ultrasonic thermal diodes
TWI623686B (en) * 2017-02-20 2018-05-11 研能科技股份有限公司 Air cooling heat dissipation device
US10723437B2 (en) 2017-05-30 2020-07-28 The Boeing Company System for structurally integrated thermal management for thin wing aircraft control surface actuators
US20230146766A1 (en) * 2021-11-10 2023-05-11 Dell Products L.P. Cooling system with a porous foam heat exchanger and a positive displacement air pump

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10244805A1 (en) * 2002-09-26 2004-04-08 Sma Regelsysteme Gmbh Open-pored heat sink cast, sintered or foamed from a heat-conductive material for a heat exchanger maintains contact with an object to be cooled
US20090050299A1 (en) * 2007-08-21 2009-02-26 Tektronix, Inc. Cooling facility for an electronic component

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2443845A1 (en) * 2001-04-23 2002-10-31 P. Lee Kang Enhancement of fluid replacement in porous media through pressure modulation
JP3828036B2 (en) * 2002-03-28 2006-09-27 三菱電機株式会社 Manufacturing method and manufacturing apparatus for resin mold device
CN104618958B (en) * 2007-06-21 2020-07-07 交互数字技术公司 IC for use in transceiver and IC configured to perform measurement reporting
US8616266B2 (en) * 2008-09-12 2013-12-31 Rockwell Collins, Inc. Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid
CN203194082U (en) * 2013-04-09 2013-09-11 苏州百丰电子有限公司 Micro piezoelectric heat dissipation device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10244805A1 (en) * 2002-09-26 2004-04-08 Sma Regelsysteme Gmbh Open-pored heat sink cast, sintered or foamed from a heat-conductive material for a heat exchanger maintains contact with an object to be cooled
US20090050299A1 (en) * 2007-08-21 2009-02-26 Tektronix, Inc. Cooling facility for an electronic component

Also Published As

Publication number Publication date
US20170307308A1 (en) 2017-10-26
GB201703612D0 (en) 2017-04-19
US10514214B2 (en) 2019-12-24
GB2547346B (en) 2019-09-04
WO2016038321A1 (en) 2016-03-17

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