GB2530664A

GB2530664A - Docking station with a heat sink

Info

Publication number: GB2530664A
Application number: GB1516053.4A
Authority: GB
Inventors: Jonathan Neil Kennedy
Original assignee: CODEX DIGITAL
Current assignee: CODEX DIGITAL
Priority date: 2014-09-11
Filing date: 2015-09-10
Publication date: 2016-03-30
Anticipated expiration: 2035-09-10
Also published as: GB201516053D0; GB201416096D0; GB2530664B

Abstract

A docking station 10 for a device 16, comprising a bracket 12 for receiving the device; and a heat sink 14. The docking station is configurable in an engaged configuration wherein the heat sink and bracket are positioned such that a device receivable in the bracket is in thermal contact with the heat sink, and a disengaged configuration wherein the heat sink and bracket are positioned such that a device receivable in the bracket is not in thermal contact with the heat sink. The heat sink is configured to move from the disengaged configuration to the engaged configuration upon insertion of a device into the bracket. The direction of movement of the heat sink may be normal to the direction of insertion of the device. There may be a compressive means between the heat sink and the device to hold the device in place.

Description

Docking station with a heat sink

Field of invention

The present invention relates to a device docking station. Specifically, the invention relates to device docking station with a heat sink.

Background summary

Devices, such as capture drives for storing visual and audio recording data, can be used conveniently to transport data from one piece of equipment to another. When such devices are engaged with a piece of equipment, for example, to write data to the capture drive or to download data stored on them, they must be configured to work as reliably as possible. High definition audio-visual equipment typically records data at a high rate which is subsequently written to a capture device. In order maintain data integrity it is preferred that such data is stored in a lossless format. Heat dissipation is important for use with electronic devices, such as capture drives, since the devices generate thermal energy, which, if not effectively dissipated, will have a deleterious effect on the operation of the devices, typically reducing the speed at which data can be recorded. Accordingly, thermal management of such devices, when placed in docking stations, in an issue that needs to be considered. Heat sinks may be used to dissipate thermal energy to ensure optimal performance of a device, Heat sinks are typically large metallic blocks, with fins to create a large surface area, In order for heat sinks to effectiv&y channel thermal energy away from the electronic devices, good thermal contact must be made between the heat sink and the hot areas of the electronic devices.

Further, devices are often wholly inserted into the piece of equipment with which they are to be used, for example, inserted into a camera, in order to protect them from the surrounding ambient conditions (which reduces exposure to rain and dust, for example, but which also increases the temperature of the immediate surrounding area due to confinement of the thermal energy). This may accentuate the negative effects that arise from the generated thermal energy.

In known systems insertion of devices into the equipment with which they are being used (for example insertion of a capture drive into a docking station) typically involves sliding a portion of the device over a surface of the heat sink, Whilst this may result in good thermal contact between the heat sink and the device, it may also lead to damage of the device, for example through scratching, which is undesirable.

In order to mitigate for at least some of the above described problems, there is provided a docking station for a device, the docking station comprising: a bracket for receiving a device; and a heat sink; wherein the docking station is configurable in an engaged configuration and a disengaged configuration, wherein in the engaged configuration the heat sink and bracket are positioned relative to each other, so that a device receivable in the bracket is in thermal contact with the heat sink and wherein in the disengaged configuration, the heat sink and bracket are positioned relative to each other, so that a device receivable in the bracket is not in thermal contact with the heat sink and wherein the heat sink is configured to move from the disengaged configuration to the engaged configuration by insertion of a device in a first direction into the bracket, thereby to bring the device into thermal contact with the heat sink.

Advantageously, the present invention avoids the need for a device to be slid against a heat sink, and therefore avoids damaging the surface of the device. Further, it is the action of insertion that causes the heat sink to move into an engaged position, rather than the device to move into an engaged position, therefore a device can be inserted into a stationary preferred position and the heat sink moved into contact with it, which mitigates the need for further movement of the device after it has been inserted into the docking station, which is useful, since it avoids unnecessary movement of connections between the device and the docking station, which could otherwise affect device connectivity and performance over time.

Brief description of the figures

A preferred embodiment of the description will now be described, by way of example only, with reference to the following figures, in which: Figure IA is a cross-sectional view of the docking station in a disengaged configuration, according to an aspect of the invention; Figure lB is a cross-sectional view of the docking station of Figure IA in which the docking station is in the engaged configuration; Figure 2A is a side view of the disengaged configuration of the docking station, according to an aspect of the invention; Figure 2B is a side view of the docking station of Figure 2A in which the docking station is in an engaged configuration; Figure 3B is a side view of the disengaged configuration of the docking station, according to an aspect of the invention; and Figure 3B is a side view of the docking station of Figure 3A in which the docking station is in an engaged configuration.

Detailed description of an embodiment

Figures IA and tB show a cross-sectional view of a docking station in a disengaged and engaged configuration respectively.

The docking station is an apparatus for receiving a device, such the device connects to other devices via connections in the docking station, thereby to permit the functionality of the device inserted into the docking station. For example, where the device is a capture device, it may be inserted into a docking station in order to download data stored on a capture device to a computing system, for further processing, for example, for high-definition video data editing purposes.

In the disengaged configuration a device to be inserted into the docking station is not in thermal contact with the heat sink of the docking station, conversely in the engaged configuration the device is fully inserted into docking station and is in thermal contact with the heat sink of the docking station. When the device is in thermal contact with the heat sink, thermal energy generated in the device is transferred to the heat sink directly, thereby providing efficient dissipation of thermal energy away from the device, In other words thermal energy transfer between the heat sink and device is effected.

Figure IA shows a cross-sectional view of the disengaged configuration of the docking station 10 according to an aspect of the invention.

There is shown the docking station 10 comprising a bracket 12 and a heat sink 14 in a disengaged configuration. As shown in Figure lAthe device 16 that is partially inserted into the bracket 12 is not in thermal contact with the heat sink 14.

In the disengaged configuration, the device 16 is separated from the heat sink N by separation 18. In the volume space defined by the separation 18 between the device 16 and the heat sink 14, are compressible pads 22 which are attached to the heat sink 14, The heat sink 14 also comprises a back wall 20. The back wall 20 extends from the heat sink 14 into the area surrounded by the bracket 12, in which area the device 16 is positioned. The back wall 20 is positioned in a first position relative to the bracket 12.

Figure lB shows a cross-sectional view of the engaged configuration of the docking station of Figure 1A.

There is shown the docking station 10 of Figure 1A, with the same features of Figure IA. In Figure lB there is shown a device 16 that is inserted into the bracket 12, such that the device 16 is in the engaged configuration of the docking station 10.

In the engaged configuration of the docking stationlO, the heat sink 14 is positioned relative to the bracket 12 such that a device 16 received in the bracket 12 is in thermal contact with the heat sink 14, thus allowing the transfer of thermal energy from the device 16 to the heat sink 14 thereby cooling the device, In the engaged configuration of the docking station 10, compressible pads 22 are compressed such that separation 18 of the disengaged configuration of the docking station 10 is no longer present. The compressible pads 22 provide increased friction between the device 16 and the heat sink 14 at the areas of the heat sink N covered by the compressible pads 22. The compressible pads prevent relative movement of the device 16 and the heat sink 14 in the engaged configuration of the docking station 10. Advantageously the use of the compressible pads provides the frictional component in a manner which does not scratch or cause damage to the device 16. The back wall 20 of the heat sink 14 is positioned in a second position relative to the bracket 12.

In use, the docking station 0 moves between the disengaged configuration and the engaged configuration, as described with reference to Figures 1A and lB above. In order to move between the configurations, a device 16 is inserted into the bracket 12 in a first direction (the direction being indicated by the direction of the arrow 24 in a substantially horizontal direction). As the device 16 is inserted into the bracket 12 in the first direction, the device 16 comes into contact with the back wall 20 that is positioned in a first position relative to the bracket 12. As the device 16 is further inserted into the bracket 12, the back wall 20 is urged from a first position relative to the bracket 12, shown as the disengaged position in Figure IA to a second position relative to the bracket 12, shown as the engaged position in Figure lB.

Since the back wall 20 is attached to the heat sink 14, movement of the back wall 20 from the disengaged first position relative to the bracket 12 shown in Figure 1A to the engaged second position relative to the bracket 12 shown in Figure lB causes the heat sink 14 to move from a disengaged first position relative to the bracket 2 shown in Figure A to an engaged second position relative to the bracket 12 shown in Figure lB.

The heat sink 14 moves from a disengaged first position relative to the bracket 12 shown in Figure 1A to an engaged second position relative to the bracket 12 shown in Figure lB. As well as moving in the first direction 24 upon insertion of the device 16, there is a component of motion of the heat sink 14 in a second direction 26 (the direction of the second component of motion being indicated by the arrow 26 being substantially vertical, and normal to first direction 24). Accordingly, the overall result of inserting the device 16 into the bracket 12 in the first direction 24 is that the heat sink 14 travels from the first position relative to the bracket 12 shown in Figure 1A to the second position relative to the bracket 12 shown in Figure lB with two components of motion, one in the first direction 24 and one in the second direction 26 (wherein the first and second components of motion are normal to each other), thereby contacting the device 12 in a direction substantially parallel to the second direction 26, such that the heat sink 14 does not slide over the surface of the device 12 before it is in thermal contact with it. The physical relocation of the heat sink 14 within the docking station due to it travelling between a disengaged first position relative to the bracket 12 and an engaged second position relative to the bracket results provides an advantageous way of bringing the heat sink 14 and device 16 into thermal contact without damaging the surface of the device 6. Further, it is the action of insertion that causes the heat sink 14 to move into an engaged position, rather than the device 16 to move into an engaged position, therefore a device 16 can be inserted into a stationary preferred position and the heat sink 14 moved into contact with it, which mitigates the need for further movement of the device 16 after it has been inserted into the docking station 10, which is useful, since it avoids unnecessary movement of connections between the device and the docking station, which could otherwise affect device connectivity and performance over time.

When the back wall 20 is in the second position relative to the bracket 12, the heat sink 14 is at a position where the compressible pads 22 of the heat sink 14 will have been fully compressed against the device 16 and the heat sink 14 is in thermal contact with a device 16 that has been inserted into the area defined by the bracket 12. Once in the engaged configuration of the docking station 10, the device t6 is operable such that it is thermally coupled with the heat sink 14 to allow for the transfer of thermal energy from the device 16 to the heat sink 14. As devices such as capture devices are known to have their performance affected by the heat generated by the devices, the engaged configuration of the docking station 10 enables improved device performance.

The device 16 is retained in the engaged configuration of the docking station tO by detents between the device 16 and the bracket 12. A detent arm 23 is shown in Figure IA. The detent arm 23 is a sprung feature. When the device 16 is fully inserted into the bracket 12, the detent arm 23 springs into recesses (not shown) formed in the device 16 and hold it in place in the engaged second position relative to the bracket 12. In order to extract the device 16 from the bracket 12, a force must be supplied in order to overcome the gripping force effected by the detents. Only one detent arm 23 is shown in Figure IA, however, there may be more than one detent and more than one detent arm 23 used in order to retain the device 16 in the bracket 12 in the second configuration of the heat sink 14 relative to the bracket 12.

Overcoming the gripping force of the detents allows the device 16 to be extracted from the bracket 12.

When in the disengaged configuration of the docking station 10, a separation 18 is maintained between the heat sink 14 and the device t6. As the device 16 is inserted into the bracket 12, the distance of the separation 18 may vary, However, only once heat sink 14 has been moved and the apparatus is in the engaged configuration, do the heat sink P1 and the device 16 touch and there is no separation 18. Advantageously, by only coming into thermal contact once the heat sink 14 has been moved in conjunction with the back wall 20 from a first position relative to the bracket 12 to a second position relative to the bracket 12, the device 16 and heat sink 14 do not slide across one another and therefore do not scratch and/or damage one another, rather, movement of the device 16 in a first direction 24 causes the heat sink 14 to move in a second direction 26, substantially normal to the first direction 24.

Furthermore, the moving part of the docking station lOis the heat sink t4 and not the bracket 12 that receives the device 16, therefore connections to the device can also be maintained in a fixed position, thereby reducing wear to components associated with connectivity of the device 16.

In a preferred embodiment, in the engaged configuration of the docking station 10, the device 16 and the heat sink t4 are in thermal contact when they are in direct physical contact with one another, such that thermal energy is directly transferred from the device 16 to the heat sink 14. However, in other embodiments, in the engaged configuration of the docking station 10, the device 16 and the heat sink 14 are in thermal contact when they are in sufficiently close proximity such that there is improved thermal energy transfer between the device 16 and the heat sink 14 compared with the natural dissipation of thermal energy from the device 16 to its surrounding environment, Such improved thermal energy transfer between the device 16 and the heat sink 14 may occur when there is a small gap between the device 16 and the heat sink t4 such that they are substantially touching to the extent that more efficient thermal transfer between the device 16 and the heat sink 14 is achieved.

Figures 2A and 2B show a side view of a docking station 10 in a disengaged and engaged configuration respectively. In the disengaged configuration a device is not in thermal contact with the heat sink of the docking station 10, in the engaged configuration a device is in thermal contact with the heat sink of the docking station 10. The side view of Figure 2A corresponds to the cross-sectional view of Figure 1A, the side view of Figure 2B corresponds to the cross-sectional view of Figure lB.

In Figures 2A and 2B, thrther details regarding the mechanism for moving the docking station 10 between the disengaged configuration of the docking station 10 and the engaged configuration of the docking station 10 are shown.

Figure 2A is a side view of the disengaged configuration of a docking station 10 in accordance with an aspect of the invention. There is shown the bracket 12 and the heat sink 14. The bracket 12 has sides 46. The sides 46 comprise apertures 44. The apertures 44 are slots that are inclined with respect to the horizontal plane and first direction 24 of insertion of the device 16 into the docking station 10. The heat sink t4 comprises pins 42. The pins 42 are projections that extend away from the heat sink 14 and through the apertures 44 of the sides 46 of the bracket 12, thereby coupling the heat sink t4 and the bracket 12 such that relative movement of the heat sink 14 and the bracket 12 is limited to the freedom of movement of the pins 42 within the apertures 44. There is shown only one side 46 of the bracket 12, however, there is a second side 46, which is a mirror image of the side 46 shown, the second side 46 being substantially parallel to the side 46 show, such that in the example of Figure 2A and Figure 2B, the bracket comprises four apertures 44 and the heat sink 14 comprise four pins 42.

The apertures 44 shown in Figure 2A are slots that are inclined with respect to the first direction 24, the first direction 24 being the direction which a device 16 is moved in when it is inserted into the docking station 10. In use, a device 16 is inserted into the bracket 12 in a first direction 24. The insertion of device 16 forces the back wall 20 of the heat sink 14 from a first position shown in Figure 2A to a second position shown in Figure 2B, relative to the bracket 12. Since the heat sink 14 is confined in its freedom of movement with respect to the bracket t2 by the apertures 44, forcing the device 16 in the first direction 24 causes the heat sink 14 pins to move within the confines of the apertures 44. The apertures 44 are arranged such that the heat sink 14 is forced in a direction with a component of motion in the first direction 24 and also a component of motion in a second direction 26, substantially normal to the first direction 24. Accordingly, the heat sink 14 moves from a disengaged position, as illustrated in Figure 2A, to an engaged position of the docking station 10. Once the heat sink 14 has been brought into contact with the device 16, it does not travel any further relative to the device 16. Advantageously, the heat sink 14 moves and is brought into contact with the device 16 that is located in a fixed position with respect to bracket 12. There is no relative movement between the heat sink 14 and the device 16 once they are in contact, but the heat sink 14 and device 16 may move in tandem, for example, as part of the mechanism to lock the heat sink 14 in position. Advantageously, the heat sink t4 and the device 16 do not slide over one another and do not scratch or damage the surface of either the device 16 or the heat sink 14. Furthermore, the bracket 12 and device 16 do not need to move, rather the heat sink 14, which may be a relatively heavy component, such as a block of metal, which may comprise fins, moves, The electrical connections between device 16 and connections

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associated with the fixed bracket 12 means that repeated insertion and retraction of a device 16 into the bracket 12 does not require electrical contacts to move. This prevents gradual deterioration and worsened connectivity of such parts in the event that move.

Figure 2B shows the engaged configuration of the docking station 10. In the engaged configuration of the docking station 10, the pins 42 of the heat sink 14 are in a second position with respect to the apertures 44 of the bracket 12 side 46. In the second position with respect to the apertures, forcing the device 16 in the first direction 24 causes the lower side 43 of apertures 44 to flex away from the device 16. There are shown compression springs 53 that are compressed from an uncompressed state (see Figure 2B) to a compressed state upon flexing of the lower side 43 of the apertures 44, The flexed lower sides 43 of aperture 44 create a clamping force that locks the device 16 in position with respect to the heat sink N, as shown in Figure 2B. The lower side 43 of the apertures 44 is shown in the flexed state in Figure 2B. In the flexed state, a force is applied substantially in the direction 26, so that the heat sink 14 is forced towards the device 16, in order to provide good thermal contact.

In order to move from the engaged configuration of the docking station 10 to the disengaged configuration of the docking station 10, the device 16 is retracted from the bracket 12. The gripping force generated by the detents must be overcome in order to extract the device t6 from the bracket 1 2. When in the engaged configuration of the docking station 0, the compressive pads 22 bias against the device 16, thereby preventing the heat sink 12 slipping and travelling in a reverse direction.

In use, when the device is pulled out from the bracket, due to the clamping force between heat sink 14 and the device 16, the heat sink 14 and the device to initially move as one i.e. there is no relative motion between the device 16 and heat sink 14. As the device 6 and the heat sink 14 move the angled nature of the apertures 44 means that the clamping force between the device 16 and the heat sink 14 is gradually reduced. Without compressive pads 22, the point where this clamping force becomes zero would be the point where the surfaces of the heat sink 14 and device 6 were just about to separate. Because the user is pulling the device 16 back, at this point the device 16, without the compressive pads 22, would then slide across the heat sink 14. This could result in scratches to the exterior of the device 16 since the device 16 and the heat sink t4 are in contact, though due to the reduced clamping force there is little frictional force between the components. Advantageously, as the compressive pads 22 are slightly proud of the heat sink 14 surface when in the disengaged configuration, there is still a small clamping force and therefore friction between the compressive pads 22 and the device 16 even after the device 16 and heat sink 14 are no longer in contact. This ensures that the device 16 and heat sink 14 continue to move as one, for a short distance, even though they are no longer in direct contact. Such a configuration therefore helps ensure that the exterior of the device 16 is not scratched when it is removed from the bracket 12. Once the device 16 has moved further back and the angled apertures 44 have moved the heat sink 14 frirther away from the device 16 the compressive pads 22 lose contact with the device 16 and the device 16 can be fully extracted from the bracket 12.

Figures 3A and 3B show a side view of a docking station 10 in a disengaged and engaged configuration respectively, in accordance with an embodiment of the invention. In the disengaged configuration a device is not in thermal contact with the heat sink of the docking station to, in the engaged configuration a device is in thermal contact with the heat sink of the docking station 10. The side view of Figure 3A is an alternative embodiment of the implementation of the disengaged position described with reference to Figure 2A and the side view of Figure 3B is an alternative embodiment of the implementation of the engaged position described with reference to Figure 2B.

In Figures 3A and 3B, ifirther details regarding the mechanism for moving the docking station 10 between the disengaged configuration of the docking station 10 and the engaged configuration of the docking station tO are shown.

Figure 3A is a side view of the disengaged configuration of a docking station 10 in accordance with an aspect of the invention, There is shown the bracket 12 and the heat sink 14. The bracket 12 has sides 46. The sides 46 comprise apertures 44. The apertures 44 are slots that include portions that are inclined with respect to the horizontal plane and first direction 24 of insertion of the device 16 into the docking station 10. The heat sink 14 comprises pins 42. The pins 42 are projections that extend away from the heat sink 14 and through the apertures 44 of the sides 46 of the bracket U, thereby coupling the heat sink 14 and the bracket 12 such that relative movement of the heat sink 14 and the bracket 12 is limited to the freedom of movement of the pins 42 within the apertures 44. The sides 46 also comprise apertures 64 formed in a rigid lever 63 that pivots around a lever pivot 61 that is attached to the sides 46. There is shown only one side 46 of the bracket 12, however, there is a second side 46, which is a mirror image of the side 46 shown, the second side 46 being substantially parallel to the side 46 show, such that in the example of Figure 3A and Figure 3B, the bracket comprises four apertures 44 and two further apertures 64, and the heat sink 14 S comprise six pins 42.

The apertures 44 shown in Figure 3A are slots that include portions that are inclined with respect to the first direction 24, the first direction 24 being the direction which a device 16 is moved in when it is inserted into the docking station 10. In use, a device 16 is inserted into the bracket 12 in a first direction 24. The insertion of device 16 forces the back wall 20 of the heat sink 14 from a first position shown in Figure 3A to a second position shown in Figure 3B, relative to the bracket 12. Since the heat sink 14 is confined in its freedom of movement with respect to the bracket 12 by the apertures 44, forcing the device 16 in the first direction 24 causes the heat sink 14 pins to move within the confines of the apertures 44 and to follow the curved portion of the apertures 44 shown at Figure 3A. The apertures 44 are arranged such that the heat sink 14 is forced in a direction with a component of motion in the first direction 24 and also a component of motion in a second direction 26, substantially normal to the first direction 24. Further, forcing the device 16 in the first direction 24 causes rigid lever 63 to rotate around lever point 61. This results in extension spring 74 stretching.

Subsequently, the rigid lever 63 provides a force to push the heat sink 14 in the second direction 26, thereby applying a clamping force between the heat sink 14 and the device 16.

Accordingly, the heat sink 14 moves from a disengaged position, as illustrated in Figure 3A, to an engaged position of the docking station 10 shown at Figure 3B. Once the heat sink 14 has been brought into contact with the device 16, it does not travel any further relative to the device 16. Advantageously, the heat sink 14 moves and is brought into contact with the device 16 that is located in a fixed position with respect to bracket 12. There is no relative movement between the heat sink 14 and the device 16 once they are in contact, but the heat sink 14 and device 16 may move in tandem, for example, as part of the mechanism to lock the heat sink 14 in position. Advantageously, the heat sink t4 and the device 16 do not slide over one another and do not scratch or damage the surface of either the device 16 or the heat sink 14. Furthermore, the bracket 12 and device 16 do not need to move, rather the heat sink 14, which may be a relatively heavy component, such as a block of metal, which may comprise fins, moves. The electrical connections between device 16 and connections associated with the fixed bracket 12 means that repeated insertion and retraction of a device 16 into the bracket 12 does not require electrical contacts to move. This prevents gradual deterioration and worsened connectivity of such parts in the event that move.

Figure 3B shows the engaged configuration of the docking station 10. In the engaged configuration of the docking station 10, the pins 42 of the heat sink 14 are in a second position with respect to the apertures 44, 64 of the bracket 12 side 46. In the second position with respect to the apertures 44, 64, forcing the device 16 in the first direction 24 causes the rigid lever 63 to pivot with respect to the device 6, There are shown extension springs 73 that are extended from a non-extended state (see Figure 3A) to an extended state upon rotation of the rigid lever 63 around the lever point 61. The shape of the rigid lever 63 is such that as it rotates around lever point 61 upon insertion of a device 16, a clamping force that locks the device 6 in position with respect to the heat sink 14 is provided, as shown in Figure 3B. The rigid lever 63 is shown in the rotated state in Figure 3B. In the rotated state, a force is applied substantially in the direction 26, so that the heat sink 14 is forced towards the device 16, in order to provide good thermal contact.

In use, when the device is pulled out from the bracket, due to the clamping force between heat sink 14 and the device 16, the heat sink 14 and the device to initially move as one i.e. there is no relative motion between the device 16 and heat sink 14. As the device 6 and the heat sink 14 move the angled nature of the apertures 44, 64 means that the clamping force between the device 16 and the heat sink 14 is gradually reduced. Without compressive pads 22, the point where this clamping force becomes zero would be the point where the surfaces of the heat sink 14 and device 6 were just about to separate. Because the user is pulling the device 16 back, at this point the device 16, without the compressive pads 22, would then slide across the heat sink 14. This could result in scratches to the exterior of the device 16 since the device 16 and the heat sink t4 are in contact, though due to the reduced clamping force

U

there is little frictional force between the components. Advantageously, as the compressive pads 22 are slightly proud of the heat sink 14 surface when in the disengaged configuration, there is still a small clamping force and therefore friction between the compressive pads 22 and the device 16 even after the device 16 and heat sink 14 are no longer in contact. This ensures that the device 16 and heat sink 14 continue to move as one, for a short distance, even though they are no longer in direct contact. Such a configuration therefore helps ensure that the exterior of the device 16 is not scratched when it is removed from the bracket 12. Once the device 16 has moved further back and the angled apertures 44, 64 have moved the heat sink 14 further away from the device 16 the compressive pads 22 lose contact with the device 16 and the device 16 can be fully extracted from the bracket 12.

Therefore as the docking station tO transitions between the engaged and disengaged configurations (as per Figures IA-IB, 2A-2B and 3A-3B respectively) the compressive pads 22 provide a frictional component between the heat sink 14 and device 16, and this friction is maintained even once the heat sink 14 and device 16 are slightly separated, ensuring that no relative motion can occur between heat sink 14 and device 16.

Thus the compressible pads 22 prevent an initial relative movement of the heat sink 14 and the device 16 whilst the docking station 10 transitions between the engaged and the disengaged configuration of the docking station 10. This occurs as when the heat sink t4 and device 16 initially separate the compressible pads 22 expand, and thus the pads remain in contact with the device whilst the docking station 10 is in the disengaged configuration. As the separation 18 gap increases as the heat sink t4 moves from the engaged to disengaged configuration, the compressible pads 22 no longer contact the device 16.

To facilitate the movement of the heat sink t4 from an engaged position relative to the bracket U to a disengaged position relative to the bracket 12, a further resilient biasing means 52 is provided. The resilient biasing means 52 is an extension spring that has one end attached to the bracket 12 and one end attached to the heat sink 14. Accordingly, the spring of the further resilient biasing means 52 is stretched upon insertion of the device 16 into the bracket 12. Once the device 6 has been inserted into the bracket 12, it is retained in position by the detents. Once the retaining force of the detents is overcome, the resilient biasing means 52 pulls the heat sink 14 back from the second position relative to the bracket 12 in the

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engaged configuration to the first position relative to the bracket 12 in the disengaged configuration.

Preferably the device 16 is retained in the second position relative to the bracket 12 by detents. However, in further examples, other mechanisms can be used to retain the device 16 in the second position relative to the bracket 12.

Preferably the compressible pads 22 are attached to the heat sink, however, in further examples, the compressible pads 22 are attached to the device 6. In further examples, compressible pads 22 are not used. In further examples, compressible pads 22 may be any type of device or material that can be used to ensure that there is no relative movement of the heat sink 14 and the device to in the engaged configuration of the docking station tO. For example, a boss and hole mechanism could be used to achieve a physical lock between the heat sink 14 and the device 16 in the engaged configuration of the docking station 10.

Preferably the pins 42 are circular in cross section, which allows for ease of movement with respect to the apertures 44, however, any cross section that allows movement of the heat sink 14 relative to the bracket 12 can be used.

Preferably the heat sink 14 comprises pins 42 and the bracket 12 comprises apertures 44, however, in other embodiments, the heat sink 14 may comprise the apertures 44 and the bracket 12 may comprise the pins 42. Other configurations of supporting the heat sink 14 such that insertion of a device to into the bracket t2 causes the heat sink 14 to move towards, and form thermal contact with, the device 16 may be envisaged, such as separate supporting means for the heat sink 14 that are not connected to the bracket 12.

Preferably when the heat sink 14 and the device 16 are in thermal contact with one another in the engaged configuration of the docking station JO, the heat sink 14 and the device 16 are in direct physical contact with each other. However, in other examples, the heat sink 14 and the device 10 are still considered to be in thermal contact with one another if they are in sufficient physical proximity such that there is improved thermal energy transfer from the device 6 to the heat sink P1, In further examples, the heat sink 14 and the device 16 are considered to be in thermal contact with one another if they are separated by sufficiently conducting material such that there is improved thermal energy transfer between the device Pt 16 and the heat sink 14 compared with the natural dissipation of thermal energy from the device 16 to its surrounding environment.

Preferably the apertures 44 are slots, however, any configuration of aperture that enables the S heat sink t4 to be directed towards the device 16 upon insertion of the device 16 into the bracket 12 may be used. Preferably the apertures 44 and lower sides 43 are formed of a flexible section of plastic moulding to provide a leaf spring, thereby to provide a force to clamp the heat sink t4 in position relative to the device 16. Preferably compression springs 53 are not included when generating a clamping force. However, in further examples, the clamping force is generated by compression springs 53 alone without the lower sides 43 being flexible, In further examples, the clamping force may be produced by any suitable element that produces a clamping force, such as a dedicated compression spring or an extension spring.

Preferably there are four apertures 44 and four pins 42, however, any number of apertures 44 and 42 that permit the above described functionality may be used.

Preferably the resilient biasing means 52 is an extension spring, however other resilient biasing means 52 that provide a force to facilitate movement from the second engaged position of the heat sink 14 relative to the bracket 12 to the first disengaged position of the heat sink 14 relative to the bracket 12 are usable, to ensure that the heat sink N is in the disengaged first position relative to the bracket 12 when there is no device 16 inserted in the docking station 10, In further embodiments, a leaf spring or radial spring is used, In further embodiments, a force to push the heat sink 14 away from the bracket 12 is provided instead of a force to pull the heat sink 14 away from the bracket 12, upon suitable arrangement of the resilient biasing means 52 with respect to the heat sink 14 and the bracket 12, Preferably the docking station 0 is arranged for substantially horizontal insertion of devices 16 with respect to the ground. However, in further examples, the docking station 10 is arranged for any angle of insertion of devices 16 that is convenient, In particular, the docking station 10 is arranged for vertical insertion of devices. Advantageously, the use of resilient biasing means 52 ensures that the heat sink 14 returns to a disengaged position relative to the bracket 12, regardless of the orientation of the docking station 10.

The present invention therefore provides an effective mechanism in which a device such as a capture device may be inserted into a docking bay, and is brought into thermal contact with a heat sink without scratching the device. Such a mechanism ensures the optimal performance of the capture device, whilst ensuring that the device remains blemish free.

Advantageously, the docking station provides the means to insert a device, such as a capture device, into a piece of equipment in order to read or write data, so that the device operates effectively. The docking station may be part of a larger unit. For example, the docking station may form part of a transfer station that enables the capture device to be communicated with by other pieces of equipment, such that data may be download from or to the capture device. Such a transfer station may allow for multiple devices, such as capture devices, to be inserted, such that data may be transferred from one capture device to another, There may be multiple docking stations for capture devices of the same type to transfer data between those capture devices, or there may be capture devices of different types, thereby to facilitate data management across multiple-proprietary platforms.

Further, the docking station may form part of a larger, modular system that enables different pieces of equipment to be brought together, in order to effect synergistic operations. For example, the docking station may form part of a hub comprising a transfer station as well as other modules, The docking station may be used in conjunction with other processing and storage hardware, as part of a larger system, Further, such a docking station may be used as part of a system for audio and/or visual recording, Integration into audio/visual recording equipment, such as portable cameras, facilitates, for example, the recording of data using a thermally efficient system based on a movable heat sink, The subsequent removal and transfer of the capture device to a docking station that forms part of a transfer module, such that the data can be manipulated remotely from the recording equipment, benefits from the advantages of the invention at both the recording of the data and the transfer of the data. Accordingly, the docking station may be integrated as part of a portable device,

Claims

Claims 1 A docking station for a device, the docking station comprising: a bracket for receiving a device; and S a heat sink; wherein the docking station is configurable in an engaged configuration and a disengaged configuration, wherein in the engaged configuration, the heat sink of the docking station and bracket are positioned relative to each other, so that a device receivable in the bracket is in thermal contact with the heat sink of the docking station, and wherein in the disengaged configuration, the heat sink of the docking station and bracket are positioned relative to each other, so that a device receivable in the bracket is not in thermal contact with the heat sink of the docking station and wherein said heat sink of the docking station is configured to move from the disengaged configuration, wherein the heat sink of the docking station is not in thermal contact with the device, to the engaged configuration by insertion of the device in a first direction into the bracket, thereby to bring the heat sink of the docking station into thermal contact with the device.
2. The docking station according to claim I, wherein insertion of a device in the first direction causes the heat sink to move in a second direction that is different to the first direction, thereby to move the heat sink from the disengaged configuration to the engaged configuration and to bring the device into thermal contact with the heat sink.
3. The docking station according to claim 2, wherein the second direction is substantially normal to the first direction.
4 The docking station according to any preceding claim, wherein the heat sink comprises compressive means. n j
5, The docking station according to claim 4, wherein, the compressive means is arranged between the heat sink and a device receivable in the bracket. Vi
6. The docking station according to claim 4 or 5, wherein the compressive means provides a frictional force that prevents relative movement of the heat sink and the device.
7. The docking station according to claim 5, wherein the compressive means maintains a separation between a device insertable into the bracket and the heat sink, when in the disengaged configuration and are compressed thereby to remove the separation between the device insertable into the bracket and the heat sink when the heat sink is moved to the engaged configuration.
8. The docking station according to claim 7, wherein the compressive means provides a frictional force that prevents relative movement of the heat sink and the device in the disengaged configuration whilst the compressive means is in contact with the device.
9. The docking station according to claim 7 or 8, wherein the compressive means provides a frictional force that prevents relative movement of the heat sink and the device in the engaged configuration.
10. The docking station according to any preceding claim, wherein the docking station further comprises a locking mechanism, wherein the locking mechanism is configured to maintain a device receivable in the bracket, in the bracket, when in the engaged configuration.
11 The docking station according to any preceding claim, wherein the docking station further comprises resilient biasing means, wherein the resilient biasing means are arranged to force the heat sink from the engaged configuration to the disengaged configuration.
12. The docking station according to any preceding claim, wherein the docking station comprises a pin and aperture arangement, wherein one of the pin or aperture is fixed to the bracket for receiving a device and the other of the pin or aperture is fixed to the heat sink and wherein the pin and aperture arrangement defines the freedom of movement of the heat sink and the bracket for receiving a device between the disengaged configuration and the engaged configuration.
13. The docking station according to any preceding claim, wherein the heat sink comprises a back wall, wherein, in use, insertion of a device into the bracket for receiving a device forces the back wall in the first direction resulting in movement of the heat sink from the disengaged configuration to the engaged configuration.
14. The docking station according to claim 12 or 13, wherein the aperture provides a path of movement between the disengaged configuration and the engaged configuration.
15, The docking station according to claim 14, wherein the path of movement is inclined with respect to the first direction.
16. A transfer station comprising the docking station of any preceding claim.
17. A modular apparatus comprising the docking station of any preceding claim.
18. An audio and/or visual recording device comprising the docking station of any preceding claim,
19. A portable device comprising the docking station of any preceding claim.N