GB2481241A

GB2481241A - Baking apparatus with heat conducting elements

Info

Publication number: GB2481241A
Application number: GB1010183.0A
Authority: GB
Inventors: Mary Jo Mckinnon
Original assignee: Individual
Current assignee: Individual
Priority date: 2010-06-17
Filing date: 2010-06-17
Publication date: 2011-12-21
Also published as: GB201010183D0

Abstract

There is provided baking apparatus 100 comprising a support member 120 that is fitted with one or more heat conduction spikes or prongs 110 that extend into a baking mixture. The support member may be manufactured from a non-stick material such as a silicon mat. The prongs may extend through the support member from a baking substrate such as a base of a baking tin.

Description

Apparatus for Baking and Associated Methods

Technical Field

This invention relates to the field of apparatus for baking, associated apparatus and methods. In particular, but not exclusively, the invention relates to apparatus for aiding baking of articles, such as cakes, breads, and the like, and associated methods.

Background

When baking articles, such as cakes or breads, an initial baking mixture or dough is generally placed in, or on, a baking tray (e.g. a sheet pan), or tin, and then heated (e.g. placed in an oven, or the like) to bake. In certain circumstances the baking mixture is expected to rise when heated, for example, when the baking mixture is comprised with a leavening agent. However, when baking, it can be that the baking mixture rises by different amounts over the article, which can result in a characteristic doming of the article, whereby a central region rises to a greater extent than an edge or perimeter region.

When subsequently the baked article is used to produce a finished product, such as a cake, or the like, it can be that the domed portion of the article is preferably removed to provide a flat surface. This removed domed portion is commonly discarded, resulting in an undesirable amount of waste of material, as well as incurring significant extra preparation time. This is particularly true in commercial kitchens, such as those provided in restaurants, patisseries, or the like. In addition, in commercial environments, ovens tend to be able to accommodate larger baking trays, or tins, and therefore the doming can be more pronounced, as can the resultant waste. In the case of cakes, such a fruit cakes, whose ingredients can be considered to be comparatively expensive, the cost of discarding material can have a significant effect on the cost of the final product.

This background serves to set a scene to allow a skilled reader to better appreciate the following description. Therefore, none of the above discussion should necessarily be taken as an acknowledgement that that discussion is part of the state of the art or is common general knowledge. One or more aspects/embodiments of the invention may or may not address one or more of the background issues.

Summary

According to a first aspect of the invention there is provided baking apparatus configured to aid baking of an article from a baking mixture, the apparatus comprising a support member having one or more conduction elements extending from the support member, each conduction element configured to extend into, and to conduct thermally to, a baking mixture.

The apparatus may aid consistent rising of a baking mixture when baked. The apparatus may comprise a plurality of conduction elements.

The support member may be configured to be placed under a baking mixture. The support member may be configured to be positioned between a baking substrate and a baking mixture. The baking substrate may be one or more of: baking tray; sheet pan; baking tin; over shelf; cooking plate (e.g. hob, hotplate, etc.). The apparatus may be sized to fit within a baking substrate, such as a standard size baking tin, or tray (e.g. 6 inches, 8 inches, etc). The support member may be sized to fit within a baking substrate, such as a standard size baking tin, or tray (e.g. 6 inches, 8 inches, etc). The support member may be configured to be positioned with a baking substrate to allow for ease of positioning of conduction elements. For example, the support member may fit within (e.g. neatly within) a baking tray to allow for positioning of the conduction element(s).

The support member may comprise a non-stick material. The support member may comprise polytetrafluoroethylene (PTFE). The support member may comprise a mat, such as a silicon mat. A face, such as an upper face, of the support member which may be configured to face a baking mix may be non-stick, such as comprising a silicon mat, or provided with a PTFE coating, or the like. A face, such as a lower face, of the support member which may be configured to face a baking substrate, may be non-stick, such as comprising a silicon mat, or provided with a PTFE coating, or the like.

The support member may be flexible. The support member may comprise PTFE coated paper. The support member may comprise parchment paper.

One, some or all conduction elements may comprise a non-stick material (e.g. PTFE coating, or the like). One, some, or all of the conduction elements may be flexible. One, some or all of the conduction elements may comprise metal. One, some or all the conduction elements may comprise ceramic.

The support member may be comprised with a baking substrate, such as a baking tin or tray, etc. (e.g. being comprised with a base of a baking tray, or tin, etc.). The support member may be configured to be removable (e.g. attachable/detachable) from a baking substrate. The support member may be the base of a baking substrate. The apparatus may include the baking substrate.

Some or all of the conduction elements may be in communication with a conduction substrate. The conduction substrate may be comprised with (e.g. within) the support member. Some or all of the conduction elements may be in communication with conduction plates, each conduction plate being associated with a particular conduction element.

Some or all of the conduction elements may be configured to extend from the support member, and through the support member. The support member may comprise apertures through which the conduction elements may be located/positioned. The support member may comprise apertures through which the conduction elements may be removably located/positioned. The support member may comprise at least one aperture at a central region.

One or more conduction element may be configured to be associated with, and extend from, the support member. The apertures may allow for the conduction elements to be associated with the support member. The conduction substrate, or conduction plates, may allow for the conduction elements to be associated with the support member. The conduction elements may be configured to be located with the support member, such as by using a location element, plate, lug, or the like. The location element may be configured to be positioned with respect to a lower face of the support member in order to associate a conduction element with the support member. The location element may be configured to abut a lower face of the support member.

Locatable/positionable conduction elements may allow for one or more of: ease of cleaning of the apparatus; ease of stowing of the apparatus; a user defined configuration of conduction elements.

One, some or all of the conduction elements may be attachable/detachable with the support member. The support member may comprise one or more attachment regions, each attachment region being configured to attach with a conduction element. The attachable/detachable conduction element may allow for one or more of: ease of cleaning of the apparatus; ease of stowing of the apparatus; a user defined configuration of conduction elements.

One, some or all of the conduction elements may be configured to be movable between a first configuration and a second configuration. In the first configuration, each conduction element may be oriented to extend into a baking mixture. In the second configuration, each conduction element may be oriented with the support member to allow for stowing of the apparatus. One, some or all of the conduction elements may be configured to be substantially parallel, or flat, with respect to the support member in the second configuration. One, some or all of the conduction elements may be configured to resiliently move from first configuration to the second configuration. That is to say that some or all of the conduction elements may try to adopt the first configuration when not being urged to the second configuration.

The conduction elements may provide an even pattern with respect to the support member (e.g. a uniform configuration, e.g. providing a common spacing between respective conduction elements). The conduction elements may be configured to be more populated at an edge region of the support member than at a central region of the support member. The conduction elements may be configured to be more populated at a central region of the support member than at an edge region of the support member.

The apparatus may be configured such that at least one conduction element is configured at, or in, a central region, e.g. a central region of the apparatus/support member, or a central region with respect to a baking substrate when the apparatus is in use with that baking substrate. The apparatus may be configured such that further conduction elements are provided around the central region conduction element. The further conduction elements may be evenly provided around the central conduction element. The number of conduction elements may be commensurate with the size of apparatus, or commensurate with the size of the intended baking substrate with which the apparatus might be used.

One, some or all of the conduction elements may have a thickness (e.g. cross-sectional thickness) of roughly 1 cm, or less. One, some or all of the conduction elements may have a thickness of roughly 0.5 cm, or less. One, some or all of the conduction elements may have a thickness of roughly 0.3 cm, or less. The conduction elements may have a thickness of roughly 0.3 cm. One, some or all of conduction elements may be configured as pins, which may be cylindrical. One, some or all conduction elements may taper inwardly away from the support member, e.g. at a tapering portion. One, some or all of conduction elements may be configured with two or more fins, each fin configured to provide a surface region for conducting heat to a baking mixture. One, some or all of the conduction elements may be configured with a single fin to provide a surface region.

The apparatus may be sized for use with particular baking substrates (e.g. tins, trays, etc.), baking mixtures, or intended baked articles. The dimensions of the support member may be provided such that it fits within a baking substrate (e.g. tin, tray, etc.).

The dimensions of support member may be provided such that it substantially overlaps with a baking substrate. The dimensions of support member may be provided such that it fits within, and substantially overlaps with the base of, a baking substrate.

One, some or all of the conduction elements may be sized for use with a particular baking substrate (e.g. tin, tray), baking mixture, or intended baked article. The particular sizing may allow for the conduction elements to extend into a baking mixture a particular distance. One, some or all conduction elements may be greater than about 1 cm long, or greater than about 2 cm long, or greater than about 3 cm long, or greater than about 4 cm long, or greater than about 5 cm long, or greater than about 7 cm long, or greater than about 10cm long. One, some or all conduction elements may be configured to extend into a baking mixture by about 1 cm or more, or greater than about 2 cm, or greater than about 3 cm, or greater than about 4 cm, or greater than about 5 cm, or greater than about 7 cm, or greater than about 10 cm. One, some, or all of the conduction elements may be configured to be roughly 6.5 cm long.

The baking apparatus may be for use in baking articles such as breads, or cakes, or the like. The apparatus may be for use in an oven. The baking apparatus may be for use with baking mixtures comprising leavening agent(s). In other words, the apparatus may be for use baking mixtures intended to rise when heated (e.g. in an oven).

The apparatus may be configured for use with industrial baking substrates, such as industrial tins, trays, ovens, etc. The apparatus may be washable, such as dishwasher washable. The apparatus may be re-usable. Some or all of the apparatus may be disposable. For example, the support member may be provided by parchment paper, PTFE coated paper, or the like, and may be disposable, while the conduction elements may be re-usable. The conduction elements may be disposable, but the support member may be re-usable.

The apparatus may be comprised with a baking mixture. The apparatus may be provided to an end user, such as a baker, of consumer, comprised with a baking mixture, to allow for baking of baked article(s).

According to a second aspect of the invention there is a support member for baking apparatus configured to aid baking of an article from a baking mixture, the support member configured to be associated with one or more conduction elements such that an associated conduction element extends into, and to conduct thermally to, a baking mixture.

The apparatus may aid consistent rising of a baking mixture when baked. The support member may be configured for use with a plurality of conduction elements.

The support member may have one or more apertures to allow one or more conduction elements to be associated with the support member (e.g. positioning through the apertures). The support member may have one or more attachment regions, to allow the one or more conduction elements to be attached and associated with the support member.

According to a third aspect of the invention there is provided one or more conduction elements for baking apparatus configured to aid baking of an article from a baking mixture, the one or more conduction elements configured to be associated with and extend from a support member into a baking mixture in order to conduct thermally into a baking mixture.

The apparatus may aid consistent rising of a baking mixture when baked.

According to a fourth aspect of the invention there is provided a baking substrate configured to aid baking of an article from a baking mixture, the substrate comprising one or more conduction elements extending from a support member of the substrate, each conduction element configured to extend into, and to conduct thermally to, a baking mixture.

The baking substrate may be a baking tin, baking tray, sheet pan, oven shelf, hotplate, or the like. The baking substrate may be provided by packaging of a baking mixture.

According to a fifth aspect there is apparatus for baking an article from a baking mixture, the apparatus comprising one or more conduction elements configured to extend into, and to conduct thermally to, a baking mixture.

The conduction elements may be configured to be associated with a baking substrate.

The conduction elements may be configured to be placed on (e.g. extend from) a baking substrate.

The one or more conduction elements may extend from a support member of the apparatus. The apparatus may comprise a plurality of conduction elements. The apparatus may comprise any one or more of the features of the first aspect.

According to a sixth aspect of the invention there is use of any of the first to fifth aspects in order to bake an article.

According to a seventh aspect of the invention, there is provided one or more baked articles having been baked using apparatus according to any of the features of the first to fifth aspects.

According to an eighth aspect of the invention, there is provided a baking pack comprising a plurality of apparatus according to any of the features of the first to fifth aspects. Some or all of the apparatus may be sized differently (e.g. support members and/or conduction elements sized differently). Some or all of the apparatus may be sized according to standard sizing (e.g. sized according to different standard sized baking substrates, such as tins, trays (e.g. for use with 6 inch tins, 8 inch tins, etc., etc.).

According to a ninth aspect of the invention there is provided a kitchen comprising one or more apparatus according to any of the features of the first to fifth aspects.

According to a tenth aspect of the invention, there is provided a method of baking an article, the method comprising: providing apparatus comprising a support member having one or more conduction elements extending from the support member and configured to extend into a baking mixture according to any of the features of the first aspect; and associating a baking mixture with the support member such that the one or more conduction elements extend into, and conduct thermally to, the mixture to allow for baking of the article.

The method may comprise baking the mixture to provide a baked article.

The support member may comprise a non-stick material, such as a silicon mat, PTFE.

The method may comprise placing the baking mixture on the support member such that the one or more conduction elements extend into the mixture. The method may comprise placing the support member on the baking mixture such that the one or more conduction elements extend into the mixture.

The method may include placing the support member on a baking substrate, such as a baking tray. Placing the support member on a baking substrate may be prior to placing the baking mixture on the support member.

The method may comprise associating the baking mixture with the support member such that some or all of the conduction elements are covered, or substantially covered, by the mixture.

The method may be for baking articles such as breads, or cakes, or the like. The method may comprise baking the mixture in an oven. The baking mixture may comprise leavening agents. In other words, the method may comprise baking the baking mixture to provide a risen baked article (e.g. when heated in an oven).

The method may comprise selecting a particular support member based on the size or amount of baking mixture to bake. The method may comprise selecting a particular support member based on the intended size of baked article.

The method may comprise removing the apparatus from the baked article. The method may comprise inverting the baked article and removing the apparatus.

The method may be for use in industrially or commercially baking articles.

According to an eleventh aspect of the invention, there is a method of baking an article, the method comprising: providing apparatus comprising one or more conduction elements configured to extend into a baking mixture according to any of the features of the fifth aspect; and associating a baking mixture with the one or more conduction elements such that the one or more conduction elements extend into the mixture.

The method may comprise baking the mixture to provide a baked article.

The method may comprise any of the features of the tenth aspect.

According to a twelfth aspect of the invention there is provided a baking apparatus configured to aid baking of an article from a baking mixture comprising a leavening agent, the apparatus comprising a support member having a plurality of conduction elements extending from the support member, each conduction element configured to extend into a baking mixture to conduct thermally into a baking mixture.

According to a thirteenth aspect of the invention there is provided a baking apparatus configured to aid baking of an article from a baking mixture comprising a leavening agent, the apparatus comprising a non-stick mat having a plurality of apertures, through which there are provided respective conduction pins, the conduction pins being configured to extend from the support member and configured to extend into a baking mixture to conduct thermally into a baking mixture.

According to a fourteenth aspect of the invention, there is provided a method of baking an article, the method comprising: providing apparatus comprising a non-stick mat having one or more conduction elements extending from the support member and configured to extend into a baking mixture according to the thirteenth aspect; and associating a baking mixture with the non-stick mat such that the one or more conduction elements extend into the mixture.

The method may comprise baking the mixture to provide a baked article.

The method may comprise removing one or more conduction elements after baking to allow for cleaning and/or storage.

According to a fifteenth aspect of the invention there is provided baking apparatus comprising a support member having one or more conduction elements extending from the support member, each conduction element configured to extend into a baking mixture to conduct thermally into a baking mixture.

The invention includes one or more corresponding aspects, embodiments or features in isolation or in various combinations whether or not specifically stated (including claimed) in that combination or in isolation. For example, it will readily be appreciated that features recited as optional with respect to the first aspect may be additionally applicable with respect to any of the twelfth aspect, etc., without the need to explicitly and unnecessarily list those various combinations and permutations here.

Corresponding means for performing one or more of the discussed functions are also

within the present disclosure.

It will be appreciated that one or more embodiments/aspects may be useful in aiding baking of a baking mixture. Such embodiments/aspects may allow for consistent rising of a baking mixture, when baked. In other words, such embodiments/aspects may allow for a baked article to rise to a similar, or substantially the same, height across the baked article. The embodiments/aspects may reduce the effect of doming of the baked article, where a central region is higher than a surrounding edge region.

The above summary is intended to be merely exemplary and non-limiting.

Brief Description of the Figures

A description is now given, by way of example only, with reference to the accompanying drawings, in which:-Figure 1 shows an example of apparatus comprising a support member and conduction elements; Figure 2a to 2d shows various exemplary stages of the apparatus of Figure 1 in use, while Figure 2e shows an article baked without using the apparatus; Figure 3 shows various exemplary cross-sections of apparatus of Figure 1; Figures 4, 5, 6 and 7 show further embodiments of apparatus, similar to that of Figure 1; Figure 8 shows further embodiments of conduction elements; Figure 9 shows different sizes of apparatus for use with different sizes of baking trays or tins; Figure 10 shows an embodiment of conduction elements for use with a baking substrate; and Figure 11 shows a further example of apparatus for use with a baking substrate.

Description of Specific Embodiments

Figure 1 shows an example of apparatus 100 for baking. The apparatus 100 comprises a support member 120 and a plurality of conduction elements 110. Here, the conduction elements 110 extend from a surface region 120a of the support member and are configured in an ordered pattern. In other words, a common spacing is provided between each conduction element 110. The surface region 1 20a in this example can be considered to be an upper face of the support member 120.

The support member 120 can be considered to be a non-stick member, or matting. In this example, the support member 120 is provided by a silicon mat or silicon baking sheet. However, the support member may be any form of structure, such as a metallic member, PTFE coated member (e.g. PTFE coated paper), or the like.

The conduction elements 110 are provided by pins, which in this example are cylindrical. Here, the elements are 3 cm long, or greater. In some examples, the pins taper (i.e. taper inwardly at a tapering portion away from surface region 120a on the support member 120), for example, taper to a point. The conduction elements 110 are configured such that they can conduct thermal energy (i.e. heat). Here, the conduction elements 110 are metallic, such as stainless steel or aluminium. The elements 110 are also provided with a polytetrafluoroethylene (PTFE) coating. Apart from the tapering portion, in this example, each conduction element can be considered to have a thickness (i.e. cross-sectional thickness) of less than roughly 0.5 cm, such as roughly 0.3 cm.

The support member 110 of the apparatus 100 is sized such that fits on, and substantially overlaps with, the base of a baking substrate 130, which in this example is a baking tin, a cross-section of which is shown in Figure 2a. Examples of baking substrates include baking tins, sheet pans, baking trays, hotplates, oven shelves, hobs, etc. The support member 120 is configured such that a lower face faces the baking substrate 130, while an upper face faces a baking mixture.

It will be appreciated by a skilled reader that baking substrates 130 such as tins, or baking trays, or the like, are generally provided in standard sizes, or dimensions. As a result, the apparatus 100 can be provided in sizes that are commensurate with the size of such tins, trays, etc. Such an apparatus allows for the ease of location of the conduction member 110 with respect to the baking substrate 130. In some examples, the perimeter of the apparatus may abut, or nearly abut, with an inner perimeter of a baking tin or tray. In further examples, the apparatus/support member may be configured such that it extends, (either partially or fully) up inner sides of a baking substrate 130.

In use, and as exemplified in Figure 2b, a baking mixture 140, such as that used for bread or cakes, or the like, is poured into the baking substrate 130 and associated with the apparatus 100. Here, the baking mixture 140 is for providing a cake and comprises a leavening agent, such as bicarbonate soda, yeast, etc. The baking mixture 140 is poured on the apparatus 100, such that it covers the support member 120 and the conduction elements 110. Of course, in further examples, the baking mixture 140 may only cover a portion of the support member 120, and may or may not cover completely the conduction elements 11 0.

In addition, it will be appreciated that in some examples, the apparatus 100 may be associated with the baking mixture 140 after the baking mixture 140 has been placed in the baking substrate 130. In other words, the baking mixture 140 is first placed on the baking substrate 130, and then apparatus 100 is placed on top of the baking mixture 140/substrate 130. In such examples, each conduction element 110 would extend down into the baking mixture 130. The support member 120 may rest upon the baking mixture 140, and/or may be supported by the baking substrate 130 (e.g. the sides of a baking tin).

The baking substrate 130, apparatus 100, and baking mixture 140 is then heated (e.g. in an oven) in order to produce a baked article 150, as is shown in Figure 2c. The conduction elements 110 are able to conduct heat into the baking mixture 140 during baking. The result is that, by using the apparatus 100, the effect of doming of the baked article is reduced when compared to not using the apparatus 100. A skilled reader will appreciate that doming occurs when where a central region of the baked article 150 is higher (e.g. significantly higher) than a surrounding edge region. In this case, using the apparatus 100 means that the finished baked article 150 has a tendency to rise to a similar height, or substantially the same height, across the baked article 150, as is exemplified in Figure 2c. In any event, the tendency for the baked article to have a characteristic domed portion is reduced when compared to baking an article without using the apparatus 100.

Figure 2e shows an example of an article 155 having been baked without using the apparatus 100. In this case, the baking mixture 130 has been placed on the baking substrate 120. As can been seen, the resultant article 155 has the characteristic domed portion 157. In order to prepare the article 155 to allow it to be produced into a final product, the article 155 is cut at an upper section 159 to remove the domed portion 157.

A skilled reader will appreciate that reducing the effect of doming of a baked article 150 may be useful in situations when a flat finished product is to be provided, and the domed portion would otherwise be discarded (e.g. when producing ganache covered products), resulting in an undesirable amount of waste of material, as well as time. The desire to provide a flat, or level, finished product occurs when baking cakes.

In this example described in Figures 2a to 2d, the conduction elements 110 are in communication with the support member 120, which is in communication with the baking substrate 130, and thermal energy is able to conduct into the baking mixture 140 from the support member 120 and baking substrate 130.

After the article 150 has been baked, the baking substrate 130 can be inverted to allow the article 150 to be removed. In other examples, when the baking substrate 130 provided by an oven shelf, or hotplate, or the like, the article 150 comprised with the apparatus 100 can be removed from the substrate 130.

Subsequently, the apparatus 100 can be removed from the article 150. In this example, the article 150 is easily removable from the substrate 130 because the support member does not stick to the substrate 130. Additionally, the apparatus 100 can be easily removable from the article 150 because the support member does not stick to the article 150. The conduction elements 130 are also configured to be non-stick to facilitate ease of removal (e.g. by using a non-stick coating, such as PTFE).

All the conduction elements 110 can be removed from the baked article 150 by pulling at the support member 100. In this example, the support member 120 is flexible (e.g. resiliently flexible), which can help with removing of the apparatus 100 from the article 150. Of course, in other embodiments the support member may be rigid (e.g. when using a metallic sheet). In some examples, the conduction elements 110 are also flexible (e.g. resiliently flexible) to aid ease of removal. The conductions elements may be configured such that they are suitable for use with particular baking mixtures (e.g. fruit cake mixture). For example, the conduction elements may be configured such that 1 0 they resist buckling or distorting when used with baking mixtures (e.g. particular baking mixtures).

The apparatus 100 is configured such that it can be re-used, for example, washed and re-used. However, a skilled reader will appreciate that in some embodiments, some or all of the apparatus 100 may be disposable. For example, the support member 120 may be provided by parchment paper, PTFE coated paper, or the like, which is replaced after each use. In some examples, the support member may be provided by a sheet of parchment paper, PTFE paper, or the like, while the conduction elements are provided by metallic elements (e.g. aluminium elements) whereby the complete apparatus 100 is configured to be disposable after use.

In further examples, the apparatus 100 may be provided with a baking mixture. For example, the apparatus 100 may be comprised with packaging of a baking mixture 140 for a user to bake an article 150. In those examples, the support member 120 may be provided by metallic packaging, or the like.

Figure 3 shows various exemplary cross-sections of the apparatus 100 showing the support member 120 and conduction elements 110. Figure 3a shows a configuration of the apparatus 100 in which the conduction elements 110 pass into the support member to allow for conduction of heat from the support member 120 to the conduction elements 110 and subsequently the baking mixture 140. In some examples, the conduction elements 110 and support member are provided by the same material, and may be provided as a unitary apparatus 100.

Figure 3b shows exemplary apparatus 100 in which the support member 120 comprises a conduction substrate 190, in communication with the conduction elements (all the conduction elements 110 in the example shown in Figure 3b) to allow for thermal conduction to the elements 110. Here, the conduction substrate 190 is metallic too.

Figure 3c shows a further example, in which the conduction elements 110 pass through (i.e. completely through) the support member 120. In this embodiment, each conduction element 110 has a conduction plate 195 associated therewith, configured to allow for conducting heat to the conduction elements 110.

Figure 3d shows an example of the apparatus 100 in which the conduction elements are configured to be associated with the support member 120. Here, the conduction elements are removable from the support member 120 using apertures 180 provided in the support member 120. In this example, each conduction element 110 has a conduction plate 195 in a similar manner to that shown in Figure 3c, which additionally serves to associate (e.g. locate) the conduction element with to the support member 120. Of course, in some example, each conduction element may not have a conduction plate 195, as such, but may have some other locating element, such as a plate, lug, form-fitting element, or the like, to allow them to be removably associated with the support member 120. In this example, the plate abuts with the support member (e.g. a lower face of the support member 120) in order to allow for positioning of the conduction elements 11 0.

It will readily be appreciated that the removable conduction elements 110 may allow for one or more of: ease of cleaning of the apparatus 100; ease of stowing of the apparatus 100; a user defined configuration of conduction elements 110. Similarly, while the examples in Figure 3c and 3d have been shown with conduction plates 195, the same apparatus 100 may be provided with a conduction substrate 190, attached to some or all of the conduction elements 110.

Figures 4a and 4b show further examples of apparatus 300 for baking, comprising a support member 320 and a plurality of conduction elements 310, similar to that described in relation to Figure 1. However, Figure 4a shows the apparatus 300 in which the conduction elements 310 are more populated at an edge region 360 of the support member 320 than at a central region 370 of the support member 320. Figure 4b shows a configuration of the apparatus 300 in which the conduction elements 310 are configured to be more populated at the central region 370 of the support member 320 than at the edge region 360 of the support member 320. Such particular configurations may suit different particular baking conditions.

Figures 4c to 4e show further examples of the apparatus 300. Here, the configuration of conduction elements 310 is commensurate with the size of apparatus 300. In Figure 4c, a single conduction element 310 is provided at a central region 370. Such a configuration may be used for a baking substrate of roughly 6 inches (i.e. diagonally measuring six inches across a base). Figure 4d shows apparatus 300 that is larger than that of Figure 4c (eg. for use with a baking substrate of roughly 8 or 9 inches).

Here, a single conduction element 310 is again provided at a central region 370, but further conduction elements 310 are configured around the central conduction element.

In this case, each further conduction element 310 can be considered to be spread from the central conduction element 310 by a common, or even, spacing. In a similar manner, Figure 4e shows a further larger apparatus 300, in which further conduction elements 310 are provided, but again spread evenly from a central conduction element.

Figure 5 shows a further example of apparatus 400 comprising a support member 420 and conduction elements 410. Here, the conduction elements 410 are configured to be movable between a first configuration and a second configuration. In the first configuration, each conduction element 410 is oriented to extend into a baking mixture 140. In the second configuration, each conduction element 410 is oriented with the support member 420 to allow for stowing of the apparatus 400. In this embodiment, each conduction element 410 is configured to move, or bend, (e.g. resiliently move or bend) from first configuration to the second configuration such that they are substantially parallel, or flat, with respect to the support member 420. Such a configuration of apparatus 100 may allow for ease of storage.

Figure 6 shows a further example of apparatus 500, comprising a support member 520 and conduction elements 510. In this example, the conduction elements 510 are configured to be attachable/detachable with attachment regions 580 of the support member 520. The attachment regions 580 in this example provide complementary interference mating with the conduction elements 51 0.

It will readily be appreciated that the attachable/detachable conduction elements 510 may allow for one or more of: ease of cleaning of the apparatus; ease of stowing of the apparatus; a user defined configuration of conduction elements 510.

Figure 7a shows an exemplary cross-section of apparatus 200 comprising a support member 220 and a plurality of conduction elements 210, similar to that described in relation to Figure 1. However, in this example, the apparatus 200 is comprised with a baking substrate 230, such as a baking tray, tin, oven shelf, packaging, etc. Here, the support member 220 is provided by a base portion of the substrate 230. Figure 7b shows a similar example, in which the support member 220 is removable from the baking substrate 230. Such a configuration permits ease of removal of the apparatus from a baked article, in a similar manner to that described in Figure 2d.

While in the above example, the conduction members 110, 210, 310, 410, 510 have been described as pins, it will readily be appreciated that alternative elements are possible. Figure 8 shows various plan views of alternative conduction elements 61 Oa, 610b, 610c. In this case, each conducting element 610a-610c comprises fins 615a, 61 Sb, 61 Sc to allow for conduction of heat into the baking mixture 140. The use of such fins 615a, 615b, 6lSc allows for an increase in surface area, and an increase in conduction. It will be appreciated that the conduction elements 61 Sa-61 Sc be tapered, which may allow for ease of removal.

Figure 9 shows three apparatus 100, 300, 400, 500 similar to those described above.

In this case, the conduction elements have been omitted for clarity. Each apparatus 100, 300, 400, 500 is sized with a particular standard size of baking substrate 130 (e.g. tin, tray, shelf, etc.). In some cases, the apparatus can be provided as a pack (e.g. pack of three, four five, etc. apparatus).

Figure 10 shows conduction elements 310 for use with a baking substrate 130. Here, the conduction elements are configured to allow a user to associate them with the baking substrate 130. In this example, a support member is not used.

It will be appreciated that while in the above examples, the apparatus, support members, baking substrates, etc, have been shown as substantially rectangular, this is exemplary only, and the above described embodiments would be equally applicable to further shaped apparatus, support members, baking substrates (e.g. round shaped).

Furthermore, Figure 11 a shows a further example of apparatus 1000. The conduction members have not been shown for clarity. In this example, the support member comprises a base portion 1010, configured to overlap with the base of a baking substrate 130, as well as side portions 1020. Here, the side portions 1020 are of a non-stick material too (e.g. silicon mat, PTFE paper, etc.). The base portion 1010 and side portions may be provided as a unitary support member.

Figure 11 b shows the apparatus 1 000 in use with a baking substrate 130 in which the side portions 1020 are configured to extend along (either partially or fully) the inner walls of a baking substrate 130. A skilled reader will readily appreciate that such an apparatus 1000 may allow for the ease of removal, etc. of the apparatus, as well as inhibiting potential sticking of the baking mixture to the baking substrate 130 when baked.

Similarly, it will be appreciated by the skilled reader that the apparatus, support members, conduction elements, etc. may have other functions in addition to those mentioned above. Similarly, in view of the foregoing description, it will be evident to a person skilled in the art that various modifications may be made within the scope of the invention and that aspects of the invention may consist of any individual feature or combination of features for particular embodiments, and it this description is expressly intended to disclose those further examples. For example, the embodiment described in relation to Figure 7 may be provided with removable conduction elements in a manner described in relation to Figure 3d, or the apparatus described in relation to any of Figures 1, 4, 5, etc. may have side portion 1020 as described in with reference to Figure 11, and so on, without the need to provide further examples here.

Claims

Claims 1. Baking apparatus configured to aid baking of an article from a baking mixture, the apparatus comprising a support member having one or more conduction elements extending from the support member, each conduction element configured to extend into, and to conduct thermally to, a baking mixture in order to aid consistent rising of a baking mixture when baked.
2. Apparatus according to claim 1, wherein the support member comprises a non-stick material and is configured to be positioned between a baking substrate and a baking mixture.
3. Apparatus according to claim 1 or 2, wherein the support member is a silicon mat.
4. Apparatus according to claim 1 or 2, wherein the support member is comprised with a baking substrate, such as being comprised with a base of a baking tray, or tin.
5. Apparatus according to claim 4, wherein the support member is configured to be removable from the baking substrate.
6. Apparatus according to any of the claims 1 to 3, wherein the conduction element(s) are configured to extend through the support member.
7. Apparatus according to claim 6 wherein the conduction element(s) are removably associatable with the support member using apertures in the support member.
8. Apparatus according to claim 7, wherein the conduction element(s) comprises a locating element to allow the conduction element(s) to be associated with respect to the support member.
9. Apparatus according to any of the preceding claims wherein the conduction element(s) are attachable/detachable with the support member.
10. Apparatus according to any of the preceding claims, wherein the conduction element(s) are configured with two or more fins, each fin configured to provide a surface region for conducting heat to a baking mixture.
11. Apparatus according to any preceding claim, wherein the apparatus is sized for use with a particular standard baking substrate, such that the support member is provided so as to substantially overlap with a base of that standard baking substrate.
12. Apparatus according to any preceding claim, wherein the conduction element(s) are configured to extend into a baking mixture a particular distance of greater than about 3 cm.
13. A support member for baking apparatus configured to aid baking of an article from a baking mixture, the support member configured to be associated with one or more conduction elements such that an associated conduction element extends, and to conduct thermally to, a baking mixture in order to aid consistent rising of a baking mixture when baked.
14. A support member according to claim 13 having one or more apertures to allow one or more conduction elements to be associated with the support member.
15. One or more conduction elements for baking apparatus configured to aid baking of an article from a baking mixture, the one or more conduction elements configured to be associated with and extend from a support member into a baking mixture in order to conduct thermally into a baking mixture in order to aid consistent rising of a baking mixture when baked.
16. A baking substrate configured to aid baking of an article from a baking mixture, the baking substrate comprising one or more conduction elements extending from a support member of the substrate, each conduction element configured to extend into, and conduct thermally to, a baking mixture in order to aid consistent rising of a baking mixture when baked.
17. Use in baking an article of the apparatus according to any of the claims ito 12, or the support member of claims 13 or 14, or the conduction element(s) of claim 15, or the baking substrate of claim 16.
18. One or more baked articles having been baked using apparatus according to any of the claims 1 to 12.
19. A baking pack comprising a plurality of apparatus according to any of the claims 1 to 12, some or all of the apparatus sized differently according to standard sizing of baking substrate.
20. A kitchen, such as a commercial kitchen, comprising one or more apparatus according to any of the claims ito 12.
21. A method of baking an article, the method comprising: providing apparatus comprising a support member having one or more conduction elements extending from the support member and configured to extend into a baking mixture according to any of the claims 1 to 12; and associating a baking mixture with the support member such that the conduction element(s) extend into the mixture in order to allow for baking and to aid consistent rising of an article.
22. The method of claim 21 further comprising baking the mixture to provide a baked article.
23. The method according to claim 21 or 22, wherein the support member comprises a non-stick material, such as a silicon mat.
24. The method according to claim 21, 22 or 23 wherein the method comprises placing the baking mixture on the support member such that the conduction elements extend into the mixture.
25. The method according to claim 23, comprising placing the support member on a baking substrate prior to placing the baking mixture on the support member.
26. The method according to any of the claims 21 to 25, wherein the method comprises associating the baking mixture with the support member such that some or all of the conduction elements are covered, or substantially covered, by the mixture.
27. The method according to any of the claims 21 to 26, comprising removing one or more conduction elements after baking to allow for cleaning and/or storage.
28. A method of baking an article, the method comprising: providing apparatus for aiding baking of an article from a baking mixture comprising one or more conduction elements configured to extend into a baking mixture and to conduct thermally into the baking mixture in order to aid baking of the baking mixture; and associating a baking mixture with the one or more conduction elements such that the one or more conduction elements extend into the mixture in order to aid consistent rising when baked.
29. Apparatus, support members, and/or conduction elements substantially as described herein, with reference to the accompanying Figures.
30. Methods substantially as described herein, with reference to the accompanying Figures.