GB2449522A - Temperature controlled equipment cabinet comprising an absorption refrigerator system with an evaporator pipe located within a fluid containing enclosure - Google Patents
Temperature controlled equipment cabinet comprising an absorption refrigerator system with an evaporator pipe located within a fluid containing enclosure Download PDFInfo
- Publication number
- GB2449522A GB2449522A GB0805660A GB0805660A GB2449522A GB 2449522 A GB2449522 A GB 2449522A GB 0805660 A GB0805660 A GB 0805660A GB 0805660 A GB0805660 A GB 0805660A GB 2449522 A GB2449522 A GB 2449522A
- Authority
- GB
- United Kingdom
- Prior art keywords
- cabinet
- enclosure
- evaporator pipe
- wall
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000010521 absorption reaction Methods 0.000 title claims abstract description 12
- 239000012530 fluid Substances 0.000 title description 3
- 238000005057 refrigeration Methods 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 238000012546 transfer Methods 0.000 claims abstract description 14
- 238000009413 insulation Methods 0.000 claims abstract description 12
- 238000010276 construction Methods 0.000 claims abstract description 3
- 239000000284 extract Substances 0.000 claims abstract description 3
- 238000001816 cooling Methods 0.000 abstract description 9
- 238000009826 distribution Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004026 adhesive bonding Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 238000009792 diffusion process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000013529 heat transfer fluid Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B15/00—Sorption machines, plants or systems, operating continuously, e.g. absorption type
- F25B15/10—Sorption machines, plants or systems, operating continuously, e.g. absorption type with inert gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B17/00—Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/02—Evaporators
- F25B39/026—Evaporators specially adapted for sorption type systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/04—Condensers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
- F25D11/025—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures using primary and secondary refrigeration systems
Abstract
A temperature controlled equipment cabinet comprises a diffusion-absorption refrigeration system 5. An evaporator pipe 4 of the refrigeration system extends through a wall 9 of the cabinet and passes through a sealed enclosure 3 which contains a heat transfer liquid 12. The sealed enclosure extends across and forms part of an internal surface 15 of the cabinet such that the refrigeration system in use extracts heat from within the cabinet to an external environment 7. The sealed enclosure is preferably configured to provide a thermosyphon convective flow effect to improve the distribution of cooling throughout the enclosure and to aid heat transfer from within the cabinet. The enclosure may have one or more filling points for introducing the heat transfer liquid. Preferably, the wall of the cabinet comprises a layer of thermal insulation 10 through which the evaporator pipe extends. The evaporator pipe may also pass through a recess 14 provided in the wall. The enclosure may be attached to the insulation by way of welding, gluing or other mechanical fixings 2a, 2b. Preferably, the enclosure is planar in construction across the internal surface of the wall. The refrigeration system may be used to cool temperature-sensitive electrical and electronic equipment, such as standby and backup batteries, housed within the temperature controlled cabinet.
Description
TEMPERATURE-CONTROLLED CABINET
Field of the Invention
The invention relates generally to temperature controlled cabinets using diffusion absorption refrigeration cycle systems, in particular relating to cabinets for containing temperature-sensitive electrical and electronic equipment.
Background
Many items of electrical and electronic equipment have increased susceptibility to failure, malfunction or generally accelerated degradation and shortened lifespan when exposed to large variations in temperature, humidity and other ambient conditions, The problem is particularly significant for items of equipment that must be left for extended periods of time in environments that are relatively unprotected from atmospheric conditions.
One example is items of control equipment, and in particular, the standby or backup battery power supplies thereof. Such control equipment may be found in power distribution, telecommunication, transport and security systems and may often be situated in isolated and exposed outdoor and indoor locations. Instafling such equipment in an enclosure for protection from rain or other precipitation can often increase temperature variations, in that sunlight on the enclosure will tend to heat the contents of the enclosure to far higher temperatures than would otherwise be the case. Additionally, in some applications, heat emitting equipment situated close to the sensitive equipment may add to the thermal stress. Thus, there is a requirement to provide cooling or air conditioning to the most temperature sensitive items.
In particular, battery back-up power supplies for power distribution control systems and telecommunication systems in the field have been observed to have a service life substantially lower than expected largely due to degradation caused by temperature and/or humidity variation. Solutions in the prior art have provided temperature controlled enclosures for the sensitive equipment ranging from a simple ventilated enclosure through to complete air conditioning systems. These solutions and systems incorporate technologies such as thermoelectric devices, forced convection, heat pipes, phase change material and vapour compression cycles.
A problem to be addressed in such temperature controlled enclosures is to make them as thermáHy efficient as possible, whilst at the same time developing devices that have no moving components which removes the need for regular and expensive maintenance due to the failure of those components as a result of mechanical wear and tear. Components which can be removed include mechanical parts such as fans, pumps and compressors and consumables such as filters.
An alternative refrigeration cycle or cooling mechanism to those noted which can be adapted to be used with electronic and electrical equipment is the diffusion absorption cycle. This cycle completely avoids the use of mechanical energy and instead it relies on direct thermal energy as a power source. They also use environmentally benign fluids, are reliable, silent and relatively inexpensive to build and have no moving parts. However they have a relatively low refrigeration Coefficient of Performance (COP'), which needs to be improved so that electronic and electrical equipment such as industrial reserve power batteries can efficiently be cooled.
Inside a conventional temperature controlled enclosure, an evaporator pipe of the diffusion absorption refrigeration cycle system extending into the enclosure has a tendency to cause a build-up of ice when the cooling system is in operation. This introduces safety issues for a cabinet containing electrical and electronic equipment. In addition, the ability of such a refrigerator system to extract heat from the cabinet is limited because the surface area of the evaporator pipe is typically small when compared to the contents of the cabinet. Simply adding a heat sink composed of a thermally conductive material to the evaporator pipe does not necessarily solve this problem, because the temperature distribution of the heat sink may not be uniform over a large surface area.
It is an object of the invention to improve the efficiency of cooling systems for temperature controled cabinets.
A further object of the invention is to reduce the variation in temperature throughout the interior of temperature controlled enclosures.
Summary of the in'iention
The invention provides a temperature-controllable equipment cabinet comprising a diffusion-absorption refrigeration cycle system, an evaporator pipe of the refrigeration system extending through a wall of the cabinet and passing through a sealed enclosure for containing a heat transfer liquid, the sealed enclosure extending across and forming part of an internal surface of the cabinet such that the refrigeration system in use extracts heat from within the cabinet to an external environment. )
The sealed enclosure is preferably configured to provide a thermo-siphon' effect, i.e. where a change in density of a working liquid due to temperature variation is used to generate a pumping force through convention flow, thus improving the distribution of cooling throughout the enclosure and ensuring that there is no ice build up on the evaporator pipe coming into contact with any of the contents of the enclosure.
The enclosure may be attached to, or embedded in, the wall by various methods which include one or more of gluing, welding and mechanical fixing. The enclosure through which the evaporator pipe passes may form a part of the ceiling, floor or side wall of the enciosure. The W ii may alternatively be a door of the cabinet. One or more sides of the enclosure may be made of different materials.
The wall of the cabinet preferably comprises a layer of thermal insulation through which the evaporator pipe extends.
The sealed enclosure is preferably substantially planar in construction, extending across the internal surface of the wall.
The evaporator pipe preferably passes in a horizontal direction through an upper portion of the sealed enclosure when the cabinet is oriented for use such that, in use, convective flow of the heat transfer liquid aids heat transfer from within the cabinet.
The invention enables improved temperature controlled enclosures for electrical and electronic components when used with a diffusion absorption refrigeration cycle system, leading to lower cost and greater energy efficiency and for a wider range of ambient temperatures.
The sealed enclosure forms a thermo-siphon configured through its location and shape to optimise and improve convection around the evaporator pipe, thus effectively providing additional surface area across which to transfer heat from within the cabinet.
Certain embodiments of the invention can be achieved through modification of an existing temperature controllable cabinet through the addition of a sealed enclosure for containing heat transfer fluid around the evaporator pipe of a diffusion-absorption refrigerator system. )
The sealed enclosure may be made from one or a limited number of pieces of material, which improves the ease of manufacture of the enclosure and the ease of installation around the evaporator pipe.
Preferred embodiments of the invention require no moving parts, such as fans which would increase the maintenance costs of the equipment. Heat transfer from the evaporator pipe is instead effected without forced convection. Ice build-up around the evaporator pipe is also prevented, enabling electrical and electronic components within the cabinet to be safely cooled, and the temperature distribution within the cabinet made more uniform. Additional fans may, however, be used where increased heat transfer is required, though at the expense of additional maintenance cost and complexity.
Detailed Description
The invention will now be described by way of example, and with reference to the appended drawing in figure 1 which shows a cross-sectional view of a diffusion-absorption refrigeration system.
With reference to figure 1 a diffusion absorption refrigeration system 5 is attached to a structural part of a cabinet, for example being attached to a door or a wall 9 of the cabinet.
The wall 9 comprises a layer of insulation 10 to thermally isolate the internal volume 8 of the cabinet from the external environment 7.
A recess 14 is provided in the wall 9, for example within the layer of insulation 1 0, through which the evaporator pipe 4 passes. The recess allows the waIl 9 to be kept relatively thin without unduly compromising the insulation of the internal volume 8 of the cabinet. The recess also allows the evaporator pipe 4 to be offset from other warmer parts of the system.
The evaporator pipe 4 of the refrigerator system 5 acts to draw heat from within the cabinet, and a heatsink 11 attached to the condenser of the system 5 conducts this heat to the external environment 7.
A liquid-filled enclosure, or thermo-siphon 3, is attached to the inside of the wall 9, forming a sealed vessel surrounding the evaporator pipe 4. The enclosure 3 comprises one or more filling points for introducing liquid 12 into the enclosure once it has been fixed in place around the evaporator pipe 4. The liquid filled enclosure 3 may be attached to the structural insulation 10, or to a material enclosing the insulation, by way of welding, gluing or other mechanical fixing methods, for example at fixing points 2a, 2b on the edge of the enclosure 3.
The enclosure 3 may have one or more sides or faces in common with the structural insulation 10 or a material enclosing the insulation, for example along an interface 13 between the internal volume of the enclosure 6 and the insulation 10. The external surface 15 of the enclosure 3 may be in direct contact with the contents of the temperature controlled enclosure, or may act as a cooling element across the internal wall for cooling air within the cabinet.
The size of the thermo-siphon is preferably optimised to provide a balance between thermal efficiency in heat transfer, cost of manufacture, fit with the refrigeration cycle and weight of fluid. The embodiment shown illustrates a particular preferred embodiment, where the enclosure 3 is in a substantially planar form extending across the internal surface of the wall, so as to maximise the cooling effect within the cabinet and minimise the quantity of heat transfer liquid required.
Preferably, the evaporator pipe 4 is located towards an upper end of the enclosure 3, extending through the enclosure in a substantially horizontal direction. The upper location of the pipe 4 allows for the convection effect to be optimised, since cool liquid within the enclosure 3 in contact with the evaporator pipe 4 will sink away from the pipe 4. As the liquid 3 absorbs heat from the internal volume 8 of the cabinet, the liquid rises and is then cooled again by the evaporator pipe 4, creating a convection cycle between the evaporator pipe 4 and the bottom of the enclosure 3. Any volume of liquid above the evaporator pipe 4, however, is not able to contribute to the convection cycle, due to a thermocline being set up within the liquid 12 around the level of the evaporator pipe 4.
The evaporator pipe 4 therefore preferably passes through an upper portion of the enclosure 3, and more preferably as near to the top of the enclosure as practical, so as to rnaximise the efficiency of the thermo-siphon effect.
Testing has indicated that a typical temperature difference LiT between the contents of a temperature controlled enclosure, for example in the form of industrial batteries, and the external ambient environment of only around 15 C can be achieved using standard 80W diffusion absorption cycle refrigeration systems. In addition, the temperature of the contents of such a cabinet can vary by over 10 C between the top and the bottom of the cabinet. Using the modifications to the cabinet described herein, this variation can be reduced to below 5 C. The invention also enables the refrigerator system to be used in elevated ambient temperatures (well above domestic room temperatures) of up to 6000, while maintaining the contents of the cabinet below 50 C and with a reduced variation of temperature within the enclosure. An effective minimum T of 15 C can be maintained for the contents of the cabinet down to around room temperature ambient (around 20-25 C).
Because the equipment cabinet is required to be thermally isolated from the external environment, a vent may be added to the cabinet to ensure that noxious or explosive gases (such as hydrogen) are dissipated to the external environment, thus avoiding any explosive build up of gas within the cabinet, which could be generated during operation of the equipment therein.
Other embodiments are intentionally within the scope of the invention, as defined by the appended claims.
Claims (6)
1. A temperature-controllable equipment cabinet comprising a diffusion-absorption refrigeration cycle system, an evaporator pipe of the refrigeration system extending through a wall of the cabinet and passing through a sealed enclosure for containing a heat transfer liquid, the sealed enclosure extending across and forming part of an internal surface of the cabinet such that the refrigeration system in use extracts heat from within the cabinet to an external environment.
2. The equipment cabinet of claim 1 wherein the wall of the cabinet comprises a layer of thermal insulation through which the evaporator pipe extends.
3. The equipment cabinet of claim 1 or claim 2 wherein the evaporator pipe passes through a recess provided in the wall.
4. The equipment cabinet of any preceding claim wherein the sealed enclosure is substantially planar in construction across the internal surface of the wall.
5. The equipment cabinet of any preceding claim wherein the evaporator pipe passes in a horizontal direction through an upper portion of the sealed enclosure when the cabinet is oriented for use such that, in use, convective flow of the heat transfer liquid aids heat transfer from within the cabinet.
6. An equipment cabinet substantially as described herein, with reference to the accompanying drawing.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/GB2008/001742 WO2008142412A1 (en) | 2007-05-22 | 2008-05-22 | Temperature-controlled cabinet |
US12/601,140 US20100154466A1 (en) | 2007-05-22 | 2008-05-22 | Temperature-controlled cabinet |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0709739A GB0709739D0 (en) | 2007-05-22 | 2007-05-22 | Improvment to dispenser heat dissipation in diffusion absolption cycles |
GB0709748A GB2456741A (en) | 2007-05-22 | 2007-05-22 | Thermosiphon Enclosure Surrounding an Evaporator Pipe |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0805660D0 GB0805660D0 (en) | 2008-04-30 |
GB2449522A true GB2449522A (en) | 2008-11-26 |
Family
ID=39386918
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0805660A Withdrawn GB2449522A (en) | 2007-05-22 | 2008-03-28 | Temperature controlled equipment cabinet comprising an absorption refrigerator system with an evaporator pipe located within a fluid containing enclosure |
GB0805661A Withdrawn GB2449523A (en) | 2007-05-22 | 2008-03-28 | Absorption refrigerator system comprising a condenser pipe surrounded by a tapered fluid filled enclosure |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0805661A Withdrawn GB2449523A (en) | 2007-05-22 | 2008-03-28 | Absorption refrigerator system comprising a condenser pipe surrounded by a tapered fluid filled enclosure |
Country Status (6)
Country | Link |
---|---|
US (2) | US20100242530A1 (en) |
EP (1) | EP2167888A1 (en) |
BR (1) | BRPI0811899A2 (en) |
GB (2) | GB2449522A (en) |
RU (1) | RU2431088C2 (en) |
WO (2) | WO2008142414A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2449522A (en) * | 2007-05-22 | 2008-11-26 | 4Energy Ltd | Temperature controlled equipment cabinet comprising an absorption refrigerator system with an evaporator pipe located within a fluid containing enclosure |
GB2456541B (en) | 2008-01-17 | 2010-02-10 | 4Energy Ltd | Air filter |
US9593870B2 (en) | 2012-12-03 | 2017-03-14 | Whirlpool Corporation | Refrigerator with thermoelectric device for ice making |
US9175888B2 (en) | 2012-12-03 | 2015-11-03 | Whirlpool Corporation | Low energy refrigerator heat source |
JP6267250B2 (en) * | 2016-02-25 | 2018-01-24 | 株式会社Subaru | Hydraulic circuit abnormality detection device and hydraulic circuit abnormality detection method |
US10718558B2 (en) * | 2017-12-11 | 2020-07-21 | Global Cooling, Inc. | Independent auxiliary thermosiphon for inexpensively extending active cooling to additional freezer interior walls |
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2008
- 2008-03-28 GB GB0805660A patent/GB2449522A/en not_active Withdrawn
- 2008-03-28 GB GB0805661A patent/GB2449523A/en not_active Withdrawn
- 2008-05-22 US US12/601,122 patent/US20100242530A1/en not_active Abandoned
- 2008-05-22 RU RU2009147441/06A patent/RU2431088C2/en not_active IP Right Cessation
- 2008-05-22 EP EP08750669A patent/EP2167888A1/en not_active Withdrawn
- 2008-05-22 US US12/601,140 patent/US20100154466A1/en not_active Abandoned
- 2008-05-22 BR BRPI0811899-0A2A patent/BRPI0811899A2/en not_active Application Discontinuation
- 2008-05-22 WO PCT/GB2008/001746 patent/WO2008142414A1/en active Application Filing
- 2008-05-22 WO PCT/GB2008/001742 patent/WO2008142412A1/en active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
WO2008142412A1 (en) | 2008-11-27 |
EP2167888A1 (en) | 2010-03-31 |
BRPI0811899A2 (en) | 2014-11-18 |
US20100242530A1 (en) | 2010-09-30 |
GB2449523A (en) | 2008-11-26 |
RU2431088C2 (en) | 2011-10-10 |
GB0805660D0 (en) | 2008-04-30 |
US20100154466A1 (en) | 2010-06-24 |
GB0805661D0 (en) | 2008-04-30 |
RU2009147441A (en) | 2011-06-27 |
WO2008142414A1 (en) | 2008-11-27 |
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WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |