GB2420302A - A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner - Google Patents

A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner Download PDF

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Publication number
GB2420302A
GB2420302A GB0605607A GB0605607A GB2420302A GB 2420302 A GB2420302 A GB 2420302A GB 0605607 A GB0605607 A GB 0605607A GB 0605607 A GB0605607 A GB 0605607A GB 2420302 A GB2420302 A GB 2420302A
Authority
GB
United Kingdom
Prior art keywords
sensor signal
controlling
mechanical polishing
chemical mechanical
pad conditioner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0605607A
Other versions
GB0605607D0 (en
GB2420302B (en
Inventor
Gerd Franz Marxsen
Jens Kramer
Uwe Gunter Stoeckgen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10345381A external-priority patent/DE10345381B4/en
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of GB0605607D0 publication Critical patent/GB0605607D0/en
Publication of GB2420302A publication Critical patent/GB2420302A/en
Application granted granted Critical
Publication of GB2420302B publication Critical patent/GB2420302B/en
Anticipated expiration legal-status Critical
Active legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

In a system and a method, according to the present invention, a sensor signal, such as a motor current signal, from a drive assembly of a pad conditioning system is used to control a CMP system to compensate for a change in the conditions of consumables, thereby enhancing process stability.

Description

GB 2420302 A continuation (72) Inventor(s): Gerd Franz Marxsen Jens Kramer
Uwe Gunter Stoeckgen (74) Agent and/or Address for Service: Brookes Batchellor LLP 102-1 08 Clerkenwell Road, LONDON, EC1M 5SA, United Kingdom
GB0605607A 2003-09-30 2004-09-17 A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner Active GB2420302B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10345381A DE10345381B4 (en) 2003-09-30 2003-09-30 A method and system for controlling chemical mechanical polishing using a sensor signal from a pad conditioner
US10/859,336 US6957997B2 (en) 2003-09-30 2004-06-02 Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
PCT/US2004/030410 WO2005032763A1 (en) 2003-09-30 2004-09-17 A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner

Publications (3)

Publication Number Publication Date
GB0605607D0 GB0605607D0 (en) 2006-04-26
GB2420302A true GB2420302A (en) 2006-05-24
GB2420302B GB2420302B (en) 2007-03-07

Family

ID=34424310

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0605607A Active GB2420302B (en) 2003-09-30 2004-09-17 A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner

Country Status (3)

Country Link
KR (1) KR101141255B1 (en)
GB (1) GB2420302B (en)
WO (1) WO2005032763A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1055486A2 (en) * 1999-05-17 2000-11-29 Ebara Corporation Dressing apparatus and polishing apparatus
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6336842B1 (en) * 1999-05-21 2002-01-08 Hitachi, Ltd. Rotary machining apparatus
US20020052166A1 (en) * 2000-10-26 2002-05-02 Hiroyuki Kojima Polishing system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5973575A (en) * 1982-10-05 1984-04-25 Shionogi & Co Ltd Propynylaminoisoxazole derivative
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
WO2004106000A1 (en) * 2003-05-28 2004-12-09 Advanced Micro Devices, Inc. A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1055486A2 (en) * 1999-05-17 2000-11-29 Ebara Corporation Dressing apparatus and polishing apparatus
US6336842B1 (en) * 1999-05-21 2002-01-08 Hitachi, Ltd. Rotary machining apparatus
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US20020052166A1 (en) * 2000-10-26 2002-05-02 Hiroyuki Kojima Polishing system

Also Published As

Publication number Publication date
GB0605607D0 (en) 2006-04-26
WO2005032763A1 (en) 2005-04-14
KR101141255B1 (en) 2012-05-04
GB2420302B (en) 2007-03-07
KR20060088894A (en) 2006-08-07

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