GB2321863A - Polymer coatings for metal oxides - Google Patents
Polymer coatings for metal oxides Download PDFInfo
- Publication number
- GB2321863A GB2321863A GB9702000A GB9702000A GB2321863A GB 2321863 A GB2321863 A GB 2321863A GB 9702000 A GB9702000 A GB 9702000A GB 9702000 A GB9702000 A GB 9702000A GB 2321863 A GB2321863 A GB 2321863A
- Authority
- GB
- United Kingdom
- Prior art keywords
- monomer
- film
- substrate
- polymerisation
- metal oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 229920000642 polymer Polymers 0.000 title claims abstract description 8
- 229910044991 metal oxide Inorganic materials 0.000 title claims description 16
- 150000004706 metal oxides Chemical class 0.000 title claims description 16
- 238000000576 coating method Methods 0.000 title claims 2
- 239000000178 monomer Substances 0.000 claims abstract description 39
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 229930192474 thiophene Natural products 0.000 claims abstract description 18
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 claims abstract description 11
- 230000001590 oxidative effect Effects 0.000 claims abstract description 10
- 239000007791 liquid phase Substances 0.000 claims abstract description 9
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000010959 steel Substances 0.000 claims abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract 4
- 229910052742 iron Inorganic materials 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 25
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 6
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims description 5
- 229960004643 cupric oxide Drugs 0.000 claims description 5
- 229920001940 conductive polymer Polymers 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 1
- 125000000168 pyrrolyl group Chemical group 0.000 claims 1
- 238000005260 corrosion Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 22
- 229920000123 polythiophene Polymers 0.000 description 9
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229920006254 polymer film Polymers 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical class [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 238000005162 X-ray Laue diffraction Methods 0.000 description 1
- 238000000026 X-ray photoelectron spectrum Methods 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- -1 cupric oxide CuO Chemical class 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000004 low energy electron diffraction Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000009304 pastoral farming Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000013047 polymeric layer Substances 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
- C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
- C08G61/124—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds with a five-membered ring containing one nitrogen atom in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
- C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
- C08G61/126—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds with a five-membered ring containing one sulfur atom in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Abstract
Thiophene in the liquid phase is polymerised by being held in contact with a film or substrate of ferric oxide. Other monomers which undergo oxidative polymerisation may be used, and other oxide films may be substituted for ferric oxide provided their redox potential is sufficiently positive to cause polymerisation of said monomer. The oxide film may be on a substrate of the related metal, i.e. iron or steel for ferric oxide. The polymer layer thus formed is useful for corrosion protection, and may be electrically conductive.
Description
POLYMERISATION METHOD
The present invention relates to a method of polymerisation of a monomer, and provides a method for the preparation of thin polymer films on a substrate.
Japanese Patent Application No. 87-266714 (Toyota Jidosha
KK) discloses the formation of a highly conductive polymer film on a copper sheet which has a solid peroxide layer formed thereon, by exposure to the vapour of a monomer capable of undergoing oxidative polymerisation, such as pyrrole, thiophene or aniline. The solid peroxide layer is produced by treatment with hydrogen peroxide, a dialkyl peroxide, or ozone, for example, and is not a conventional oxide. Thus, this method requires a separate oxidising agent to produce a surface layer or film, and the latter is neither copper nor a conventional copper oxide such as may normally occur on the surface of the sheet under atmospheric conditions.
In a presentation at the European Conference on Surface
Science, Lille, France in September 1995, it was disclosed that the (0001) face of a crystal of ferric oxide, Fe2O3, catalyses the polymerisation of thiophene from the vapour phase to form a polythiophene film with a thickness of about 30 A. This film is stable up to 720 C and survives atmospheric exposure. Thiophene is an example of a monomer which is known to be polymerisable by electrochemical or chemical oxidation, and is conveniently used as a "model" monomer for studying this type of polymerisation, and for predicting the properties of related monomers.
It has now been found that the oxide crystal can be replaced by a thin film of oxide, for example on the surface of the parent metal, and that polymerisation on the oxide film or substrate can occur from liquid monomer under conditions of temperature and pressure at or close to ambient. The latter aspect may be of considerable commercial interest, insofar as it considerably simplifies the production of these polymer films.
It is also believed that the oxides of other metals, such as cupric oxide CuO, will have a similar (catalytic) polymerising ability, provided the redox potential thereof is appropriately high for the monomer in question. Thus, the Cu - Cu redox potential of 0.16eV has been found sufficient to polymerise thiophene in zeolite channels.
In a first aspect, the present invention provides a method of polymerising a monomer of the type capable of undergoing oxidative polymerisation, comprising the step of exposing said monomer in the liquid phase to a film or substrate formed of a metal oxide, said metal oxide having a redox potential sufficiently positive to cause polymerisation of said monomer.
Preferably, the metal oxide is selected from ferric oxide and cupric oxide. Thus in a particular form of the first aspect of the invention there is provided a method of polymerising a monomer of the type capable of undergoing oxidative polymerisation, comprising the step of exposing said monomer in the liquid phase to a film or substrate formed of ferric oxide.
In a preferred method, the metal oxide is in the form of a film on a substrate of different material.
In a second aspect, the invention provides a method of polymerising a monomer of the type capable of undergoing oxidative polymerisation, comprising the step of exposing said monomer to a film of a metal oxide film on a substrate of a different material, said metal oxide having a redox potential sufficiently positive to cause polymerisation of said monomer. Preferably the monomer is in the liquid phase.
Preferably, again, the metal oxide of the film is selected from ferric oxide and cupric oxide. Thus in a particular form of the second aspect of the invention there is provided a method of polymerising a monomer of the type capable of undergoing oxidative polymerisation, comprising the step of exposing said monomer in the liquid phase to a film of ferric oxide on a substrate of a different material.
A substrate, where required or provided, is preferably of the metal of the metal oxide film.
Monomers for use in the first or second aspects may be selected from thiophene and derivatives thereof, but the invention is not limited thereto. For example, it is believed that pyrrole and derivatives thereof, and other materials such as aniline and derivatives thereof could be used.
The formation of the polymer can be performed in the region of ambient temperature and pressure, for example at a temperature of between -10 C and +20"C, and at substantially atmospheric pressure. Naturally, where necessary, these conditions could be varied to ensure that the monomer is in the liquid phase for ease of handling.
The invention will now be described more particularly with reference to an embodiment thereof, and with reference to the prior art as presented at the Lille conference mentioned above.
Prior art An a-Fe2Os crystal was cut and polished to within 0.5 of the (0001) plane as determined by Laue diffraction, cleaned by cycles of Ar bombardment, and annealed at about 1150 K in 10-4 mbar O2 to produce a nominally stoichiometric, clean and ordered a-Fe203 surface as determined by low energy electron diffraction and Auger spectroscopy. Thiophene was dosed from the vapour above the room-temperature liquid, following several freeze-pump-thaw cycles to remove dissolved gases. The crystal at -120-K was exposed to thiophene vapour at low pressure to form a multilayer thereon.
Evidence that the thiophene formed a polymeric layer on annealing towards room temperature is threefold: (a) The deposited multilayer was observed to remain as a
film of average thickness 30+10 after annealing to 720-K as calculated from the Fe 2p and S 2p XPS peak
areas indicating formation of a surface species of
increased thermal stability, in line with the
properties of polythiophene.
(b) NEXAFS and XPS spectroscopic data of the thermally
annealed film fingerprint polythiophene formation.
Features include shifts and absolute binding
energies previously observed in experiments
examining the difference between monomers, oligomers
and polymers of thiophene. An absence of features
at less than 284 and 162 eV binding energy in the C
is and S 2p spectra of the annealed films
respectively indicates that the thiophene rings
remain intact and do not decompose, and the S/C
stoichiometry as determined from the XPS peak areas
remains at 0.26, very close to the value expected
for thiophene and its polymer. Figures l(a) and 1(b) show that the thermally annealed layer has S 2p
and C ls XPS shifts of 0.6 eV and 0.2 eV less than
the unreacted thiophene.
(c) Figure 2 shows normal and grazing incidence S K-edge
NEXAFS spectra of multilayer thiophene and films
thereof successively thermally annealed to 143, 300
and 7204K. The relative invariance of the
appearance of the spectra indicates that the
annealed film contains thiophene rings with minimal
structural modification, which is a specific feature
of polythiophene. However, there is a broadening
which is expected from a comparison between NEXAFS
spectra of thiophene and an electrochemically grown
polythiophene film. There is also a downward shift
of about 0.6 eV in the leading resonance and, in
contrast to the thiophene multilayer, there is no
noticeable polarisation dependence.
Both the multilayer film annealed to 700"K and then cooling to room temperature, and one allowed to warm directly to room temperature, resulted in a polymer film of about 30A thickness (by XPS). The relatively high vapour pressure of thiophene monomer would suggest that, had polymerisation not occurred, there would have been differing film thicknesses following the two treatments.
A 24 hour exposure to atmospheric conditions did not alter the C ls and S 2p XPS spectra, indicating that the product was stable to air and moisture.
Embodiment A piece of 0.14% C, 0.5W Mn sheet steel was polished to 500u roughness, and suspended for 30 minutes in liquid thiophene monomer under ambient laboratory conditions. Characterisation of the resulting film by
IR spectroscopy provided absorption bands consistent with the parent monomer (1494, 1454, 1230, 1100, 1052, 915 and 842 cam 1), and polythiophene (1368, 788 and 730 cm 1), as shown in Figure 3. The polythiophene bands at 788 and 730 cm suggest a mixture of a-a and a-ss coupling of the monomeric units.
The polythiophene layer exhibited good corrosion resisting properties. The sample was immersed in a saturated sodium chloride solution at room temperature for 12 hours. The part of the sample covered with the polymer retained a metallic appearance and showed no visible sign of corrosion, whereas an untreated area was severely discoloured.
Polymer films are currently of great technological interest, for example in relation to electronic devices, sensors and protective coatings. Clearly, the present invention has a potential use in the corrosion protection of engineering steels and steel components, and of other components such as sensors.
Certain polymers, including polythiophenes and polypyrroles, also are electrically conductive when suitably doped. There thus exists the possibility that an electrically conductive substrate can be coated by the method of the invention while retaining surface conductivity. Where there is a substrate which is nonconductive, deposition of an electrically conductive polymer by the method of the invention will enable the production of electronic or electrical components, including sensors and conductive patterns or tracks.
Claims (14)
1. A method of polymerising a monomer of the type capable of undergoing oxidative polymerisation, comprising the step of exposing said monomer in the liquid phase to a film or substrate formed of a metal oxide, said metal oxide having a redox potential sufficiently positive to cause polymerisation of said monomer.
2. A method according to claim 1 wherein said metal oxide is selected from ferric oxide and cupric oxide.
3. A method according to claim 1 or claim 2 wherein said metal oxide is in the form of a film on a substrate of different material.
4. A method of polymerising a monomer of the type capable of undergoing oxidative polymerisation, comprising the step of exposing said monomer to a film of a metal oxide film on a substrate of a different material, said metal oxide having a redox potential sufficiently positive to cause polymerisation of said monomer.
5. A method according to claim 4 wherein the monomer is in the liquid phase.
6. A method according to any one of claims 3 to 5 wherein the substrate is of the metal of the metal oxide film.
7. A method according to any one of claims 3 to 6 wherein the substrate is electrically non-conductive.
8. A method of polymerising a monomer of the type capable of undergoing oxidative polymerisation, comprising the step of exposing said monomer in the liquid phase to a film or substrate of ferric oxide.
9. A method of polymerising a monomer of the type capable of undergoing oxidative polymerisation, comprising the step of exposing said monomer to a film of ferric oxide on a steel or iron substrate.
10. A method according to any preceding claim wherein the monomer is selected from pyrrole and derivatives thereof, and thiophene and derivatives thereof.
11. A method according to any preceding claim wherein the monomer is selected such as to provide an electrically conductive polymer.
12. A method according to any preceding claim, performed at a temperature of between -10 C and +20oC and at substantially atmospheric pressure.
13. A method of polymerisation according to claim 1 and substantially as herein described.
14. A component or substrate provided with a polymer coating prepared by a method according to any preceding claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9702000A GB2321863A (en) | 1997-01-31 | 1997-01-31 | Polymer coatings for metal oxides |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9702000A GB2321863A (en) | 1997-01-31 | 1997-01-31 | Polymer coatings for metal oxides |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB9702000D0 GB9702000D0 (en) | 1997-03-19 |
| GB2321863A true GB2321863A (en) | 1998-08-12 |
Family
ID=10806880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9702000A Withdrawn GB2321863A (en) | 1997-01-31 | 1997-01-31 | Polymer coatings for metal oxides |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2321863A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1505095A1 (en) * | 2003-08-01 | 2005-02-09 | Technobiochip S.C.A.R.L | Pyrrolic polymeric compositions |
-
1997
- 1997-01-31 GB GB9702000A patent/GB2321863A/en not_active Withdrawn
Non-Patent Citations (1)
| Title |
|---|
| J. Colloid Interface Sci., 144(1), 27-35, (1991) * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1505095A1 (en) * | 2003-08-01 | 2005-02-09 | Technobiochip S.C.A.R.L | Pyrrolic polymeric compositions |
Also Published As
| Publication number | Publication date |
|---|---|
| GB9702000D0 (en) | 1997-03-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |