GB2308733A - Growing an oxide film of a semiconductor device - Google Patents
Growing an oxide film of a semiconductor device Download PDFInfo
- Publication number
- GB2308733A GB2308733A GB9625267A GB9625267A GB2308733A GB 2308733 A GB2308733 A GB 2308733A GB 9625267 A GB9625267 A GB 9625267A GB 9625267 A GB9625267 A GB 9625267A GB 2308733 A GB2308733 A GB 2308733A
- Authority
- GB
- United Kingdom
- Prior art keywords
- oxide film
- growing
- thickness
- time
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Description
2308733 APPARATUS A9D METHODFOR FORMING OXIDE FILM OF SEMICONDUCTOR DEVICE
is The present invention relates to an apparatus and a method of manufacturing semiconductor device, and more particularly, to an oxidizing apparatus and a method for forming an oxide film of desired thickness on a semiconductor wafer using the same.
FIG. 1 is a flowchart illustrating a method for forming an oxide film in a conventional semiconductor device. The time required for growing an oxide film corresponding to the target thickness of an oxide film to be formed on a wafer is determined in step S10 and the oxide film is grown in an oxidizing apparatus for the predetermined duration in step S11. The thickness of the oxide film grown on the wafer is measured using a measuring apparatus of oxide film thickness in step S12, and then the measured thickness is compared with the target thickness in step S13. If the target thickness has not been satisfied in step S13, the time required for growing more oxide film is calculated and steps S10-S12 are repeated until the measured thickness corresponds to the target thickness.
In the above-mentioned conventional process of forming an oxide film, due to various conditions of the oxidizing apparatus itself, the thickness of the oxide film is different in each batch. When the target thickness of the oxide film is not met, the time for growing the oxide film must be manually 1 calculated in order to grow an oxide film of desired thickness.
Also, a method of calculating the time for growing the oxide film may differ such that each calculation is not uniform, and further the results of each batch must be identified and recorded.
Summary of the Invention
Accordingly, it is an object of the present invention to provide an oxidizing apparatus for minimizing differences in oxide film thicknesses grown in a batch by the manually calculated time for growing the oxide film.
It is another object of the present invention to provide a method of forming an oxide film using the oxidizing apparatus.
To accomplish the above first object of the present invention, there is provided an apparatus for forming an oxide film of a semiconductor device, comprising: controlling means for calculating a time required for growing an oxide film of desired thickness, based on a target thickness input from an operator terminal and a measured thickness of an oxide film grown in a previous oxidation process, and outputting the required time for growing the oxide film; oxide film growing means for receiving the -required time output from the controlling means and growing an oxide film for the required time; and oxide film thickness measuring means for measuring a thickness of the oxide film grown in the oxide film growing is 2 is means and inputting the measured thickness to the controlling means.
To accomplish the above second object of the present invention, there is provided a method for forming an oxide film of a semiconductor device, comprising the steps of: a) inputting a target thickness of an oxide film to be formed into a controlling means and calculating a time required for growing an oxide film corresponding to the target thickness with the controlling means; b) inputting the time into an oxide film growing means and then growing an oxide film for the time; c) measuring the thickness of the grown oxide film in an oxide film thickness measuring means and then inputting the measured thickness into the controlling means; d) comparing the target thickness with the measured thickness and calculating the time for growing an oxide film corresponding to difference between the target thickness and the measured thickness in the controlling means; and e) inputting the time for growing an oxide film calculated in the step d) into the oxide film growing means and then repeating the steps from step b) until the target thickness corresponds to the measured thickness.
According to the apparatus of the present invention and a method of forming an oxide film using the same, the time for growing the oxide film corresponding to the target thickness of the oxide film to be grown is automatically calculated, to thereby simplify the process and minimize differences in the oxide film thicknesses. Accordingly, reliability with respect 3 to the process is enhanced and the product can be more uniformly produced.
is Brief Description of the Drawings
The above objects and advantages of the present invention will become more apparent by describing in detail a preferred embodiment thereof with reference to the attached drawings in which:
FIG. 1 is a flowchart illustrating a method for forming an oxide film in a conventional semiconductor device; FIG. 2 is a block diagram of an apparatus for forming an oxide film of a semiconductor device according to the present invention; and FIG. 3 is a flowchart illustrating a method for forming an oxide film of a semiconductor device using the apparatus of FIG. 2.
Detailed Description of the Invention
Referring to FIG. 2, reference numeral 3 refers to an oxide film growing means and reference numeral 4 refers to an oxide film thickness measuring means, respectively.
Reference numeral 5 refers to a controlling means which includes a host computer 1 for storing, comparing and calculating data and a terminal 2.
When either the target thickness of the oxide film to be grown on the wafer or the measured thickness cf the oxide film grown on the wafer is input into the host commuter 1 through 4 the terminal 2, the host computer 1 calculates either the time required for growing an oxide film for growing the target thickness or the time required for growing an oxide film corresponding to the difference between the target thickness and the measured thickness, where the target thickness is thicker than that of the measured thickness, and then outputs the calculated time to the terminal 2.
The time for growing an oxide film is determined from the stored data of oxide film growth rates obtained from repeated oxidation process in the means for growing the oxide film. The oxide film growing means 3 receives the predetermined time required for growing the desired thickness of an oxide film from the controlling means 5 and then grows the oxide film for the predetermined time. Then, the oxide film thickness measuring means 4 measures the thickness of the oxide film and the measured thickness is fed back to the host computer 1 of the controlling means 5.
Referring to FIG. 3, the time for growing an oxide film corresponding to the target thickness of the oxide film to be grown on the wafer is determined using the controlling means 5 in step S101 and the oxide film is grown in the oxide film growing means 3 for the predetermined time in step S102. Next, the oxide film thickness measuring means 4 measures the thickness of the oxide film grown on the wafer during the oxidation process in step S103 and then the controlling means compares the measured thickness with the target thickness. Here, in step S104, the controlling means 5 determines whether the target thickness has been met. If the target thickness is thicker than the measured thickness, the steps S101-S103 are repeated.
The formulas used for calculating the time for growing an oxide film stored in the controlling means are as follows:
t= (t,' R) + [ t (1-R) 2 (1.) (TOX a - T) vgr, 1 (2) G, 21 2- (TOX a g, 2 - T) (3) G2 1 R t 1 / (4) r 20 + t:l wherein t is the time reauired for next growth of oxide film, t, is the duration of growth of current batch, t2 is the duration of growth of previous batch, TOX,,,,l and TOX,,,,2 are the average thicknesses of the oxide grown during ti and t2, respectively, T is the target thickness and G. and G, are the respective growth rates of the oxide during t, and t,.
Here, TOX,....,,, and TOX,,,,- are calculated with the largest and the smallest measured values beinQ discarded. Also, when the di-,:.L"erence between the largest data and the smallest data is larcer than a Dredetermined span value, S (S = x96 of T), 6 the averages TOXa,,3,1 and TOX,,g,2 are replaced by the span value S. When the change in measured thicknesses of the oxide film is large and the time for growing the oxide film is calculated using the above formulas, process failure may occur. Thus, the operator predetermines the span value after repeated processes.
According to the oxidizing apparatus and the method of forming an oxide film of the present invention, the time for growing an oxide film corresponding to the target thickness of the oxide film to be grown is calculated automatically, using the oxidizing apparatus having an oxide film growing means, the oxide film thickness measuring means and controlling means. Accordingly, the operation is simplified and varying oxide film thicknesses in a batch are minimized, to thereby is enhance the reliability with respect to the process and produce more uniform products.
7
Claims (6)
1 2 3 4 6 7 8 9 11 12 13 14 15 1 2 3 4 5 6 7 8 9 10 1. An apparatus for forming an oxide film of a semiconductor device, comprising:
controlling means for calculating a time required for growing an oxide film of desired thickness, based on a target thickness input from an operator terminal and a measured thickness of an oxide film grown in a previous oxidation process, and outputting the required time for growing the oxide film; oxide film growing means for receiving the required time output from said controlling means and growing an oxide film for the required time; and oxide film thickness measuring means for measuring a thickness of the oxide film grown in said oxide film growing means and inputting said measured thickness to said controlling means.
2. A method for forming an oxide film of a semiconductor device, comprising the steps of:
a) inputting a target thickness of an oxide film to be formed into controlling means and calculating a time required for growing an oxide film corresponding to said target thickness with said controlling means; b) inputting the time into oxide film growing means and then growing an oxide film for the time; c) measuring the thickness of the grown oxide film in oxide film thickness measuring means and then inputting the 8 11 12 13 14 is 16 17 18 19 6 7 8 9 10 11 1 2 3 4 measured thickness into said controlling means; d) comparing said target thickness with said measured thickness and calculating the time for growing an oxide film corresponding to difference between said target thickness and said measured thickness in said controlling means; and e) inputting the time for growing an oxide film calculated in said step d) into said oxide film growing means and then repeating said steps from step b) until said target thickness corresponds to said measured thickness.
3. A method for forming an oxide film of a semiconductor device according to claim 2, wherein the time, t, required for growing said oxide f ilm can be expressed as t= (tit R) + ( t 2 ' (1-R)] wherein, (TOX avg, 1- T) t 1 t ti t 1 G 2 (TOX g, 2 - T) G 2 1 and R = t1 i t 21 +til 1 in which ti 1 and t2 p are values obtained during times t, and t2 for growing oxide films in previous stages, TOX,,,,, and TOX..,2 represent the average thicknesses of the oxide grown during the times t, and t2, respectively, T represents said target thickness and G, and G2 are the respective growth rates of the oxide during the times t. and t2.
4. A method for forming an oxide film of a semiconductor device according to claim 3, wherein an span value S determined by an operator is used in place of TOX,,,l and TOX,,,,2 when a difference between a greatest value and a 9 smallest value of data of said measured thicknesses of the 6 grown oxide film is larger than said span value S, wherein S = x515 of T.
5. An apparatus for forming an oxide film of a semiconductor device according to claim 1, substantially as herein described with reference to the accompanying drawings.
6. A method for forming an oxide film of a semiconductor device according to claim 2, substantially as herein described with reference to the accompanying drawing.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950059505A KR0165320B1 (en) | 1995-12-27 | 1995-12-27 | Method for establishing soaktime of process semiconductor oxidation |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9625267D0 GB9625267D0 (en) | 1997-01-22 |
GB2308733A true GB2308733A (en) | 1997-07-02 |
GB2308733B GB2308733B (en) | 2000-07-05 |
Family
ID=19445217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9625267A Expired - Lifetime GB2308733B (en) | 1995-12-27 | 1996-12-04 | Apparatus and method for forming oxide film of semiconductor device |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH09186151A (en) |
KR (1) | KR0165320B1 (en) |
DE (1) | DE19652741B4 (en) |
GB (1) | GB2308733B (en) |
TW (1) | TW401610B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999052133A1 (en) * | 1998-04-06 | 1999-10-14 | Advanced Micro Devices, Inc. | Depositing a material of controlled, variable thickness across a surface for planarization of that surface |
WO2001093311A2 (en) * | 2000-05-25 | 2001-12-06 | Advanced Micro Devices, Inc. | Method of controlling well leakage for trench isolations of differing depths |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6607926B1 (en) * | 1999-08-10 | 2003-08-19 | Advanced Micro Devices, Inc. | Method and apparatus for performing run-to-run control in a batch manufacturing environment |
US6405096B1 (en) * | 1999-08-10 | 2002-06-11 | Advanced Micro Devices, Inc. | Method and apparatus for run-to-run controlling of overlay registration |
US6625513B1 (en) * | 2000-08-15 | 2003-09-23 | Applied Materials, Inc. | Run-to-run control over semiconductor processing tool based upon mirror image target |
JP3993396B2 (en) * | 2001-03-30 | 2007-10-17 | 株式会社東芝 | Manufacturing method of semiconductor device |
-
1995
- 1995-12-27 KR KR1019950059505A patent/KR0165320B1/en not_active IP Right Cessation
-
1996
- 1996-12-04 GB GB9625267A patent/GB2308733B/en not_active Expired - Lifetime
- 1996-12-18 DE DE1996152741 patent/DE19652741B4/en not_active Expired - Fee Related
- 1996-12-19 TW TW85115714A patent/TW401610B/en not_active IP Right Cessation
- 1996-12-26 JP JP34817896A patent/JPH09186151A/en active Pending
Non-Patent Citations (1)
Title |
---|
Patent Abstracts of Japan, [E-315], Vol 9, No 115, page 58 &JP600004223A * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999052133A1 (en) * | 1998-04-06 | 1999-10-14 | Advanced Micro Devices, Inc. | Depositing a material of controlled, variable thickness across a surface for planarization of that surface |
US6033921A (en) * | 1998-04-06 | 2000-03-07 | Advanced Micro Devices, Inc. | Method for depositing a material of controlled, variable thickness across a surface for planarization of that surface |
US6184986B1 (en) | 1998-04-06 | 2001-02-06 | Advanced Micro Devices, Inc. | Depositing a material of controlled, variable thickness across a surface for planarization of that surface |
WO2001093311A2 (en) * | 2000-05-25 | 2001-12-06 | Advanced Micro Devices, Inc. | Method of controlling well leakage for trench isolations of differing depths |
WO2001093311A3 (en) * | 2000-05-25 | 2002-04-11 | Advanced Micro Devices Inc | Method of controlling well leakage for trench isolations of differing depths |
Also Published As
Publication number | Publication date |
---|---|
DE19652741A1 (en) | 1997-07-03 |
GB2308733B (en) | 2000-07-05 |
GB9625267D0 (en) | 1997-01-22 |
DE19652741B4 (en) | 2007-07-05 |
TW401610B (en) | 2000-08-11 |
KR970054573A (en) | 1997-07-31 |
JPH09186151A (en) | 1997-07-15 |
KR0165320B1 (en) | 1999-02-01 |
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