GB2284303B - Automatic wafer handler for a dicing machine - Google Patents

Automatic wafer handler for a dicing machine

Info

Publication number
GB2284303B
GB2284303B GB9423850A GB9423850A GB2284303B GB 2284303 B GB2284303 B GB 2284303B GB 9423850 A GB9423850 A GB 9423850A GB 9423850 A GB9423850 A GB 9423850A GB 2284303 B GB2284303 B GB 2284303B
Authority
GB
United Kingdom
Prior art keywords
dicing machine
wafer handler
automatic wafer
automatic
handler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9423850A
Other languages
English (en)
Other versions
GB2284303A (en
GB9423850D0 (en
Inventor
Tadashi Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Seiki KK
Original Assignee
Seiko Seiki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Seiki KK filed Critical Seiko Seiki KK
Publication of GB9423850D0 publication Critical patent/GB9423850D0/en
Publication of GB2284303A publication Critical patent/GB2284303A/en
Application granted granted Critical
Publication of GB2284303B publication Critical patent/GB2284303B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Warehouses Or Storage Devices (AREA)
GB9423850A 1993-11-26 1994-11-25 Automatic wafer handler for a dicing machine Expired - Fee Related GB2284303B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5321200A JPH07153720A (ja) 1993-11-26 1993-11-26 ダイシング装置のウェハ自給装置

Publications (3)

Publication Number Publication Date
GB9423850D0 GB9423850D0 (en) 1995-01-11
GB2284303A GB2284303A (en) 1995-05-31
GB2284303B true GB2284303B (en) 1997-10-08

Family

ID=18129915

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9423850A Expired - Fee Related GB2284303B (en) 1993-11-26 1994-11-25 Automatic wafer handler for a dicing machine

Country Status (4)

Country Link
JP (1) JPH07153720A (cs)
KR (1) KR950015630A (cs)
GB (1) GB2284303B (cs)
TW (1) TW252213B (cs)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013049001A (ja) * 2011-08-30 2013-03-14 Panasonic Corp 液剤塗布装置及び液剤塗布方法
JP6435669B2 (ja) * 2014-07-04 2018-12-12 三星ダイヤモンド工業株式会社 基板加工装置
CN111604810B (zh) * 2020-07-24 2020-11-03 杭州众硅电子科技有限公司 一种晶圆传输设备、化学机械平坦化装置及晶圆传输方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2198881A (en) * 1986-12-02 1988-06-22 Teradyne Inc Transporting wafers
US5064337A (en) * 1988-07-19 1991-11-12 Tokyo Electron Limited Handling apparatus for transferring carriers and a method of transferring carriers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2198881A (en) * 1986-12-02 1988-06-22 Teradyne Inc Transporting wafers
US5064337A (en) * 1988-07-19 1991-11-12 Tokyo Electron Limited Handling apparatus for transferring carriers and a method of transferring carriers

Also Published As

Publication number Publication date
GB2284303A (en) 1995-05-31
KR950015630A (ko) 1995-06-17
TW252213B (cs) 1995-07-21
GB9423850D0 (en) 1995-01-11
JPH07153720A (ja) 1995-06-16

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20051125