GB2280038A - Micromechanical sensor - Google Patents

Micromechanical sensor

Info

Publication number
GB2280038A
GB2280038A GB9418784A GB9418784A GB2280038A GB 2280038 A GB2280038 A GB 2280038A GB 9418784 A GB9418784 A GB 9418784A GB 9418784 A GB9418784 A GB 9418784A GB 2280038 A GB2280038 A GB 2280038A
Authority
GB
United Kingdom
Prior art keywords
sensing elements
sensing
outgoing
supported
substantially similar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9418784A
Other versions
GB2280038B (en
GB9418784D0 (en
Inventor
David Frank Moore
Andrew Charles Frederick Hoole
Alan Heaver
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lynxvale Ltd
Original Assignee
Lynxvale Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lynxvale Ltd filed Critical Lynxvale Ltd
Publication of GB9418784D0 publication Critical patent/GB9418784D0/en
Publication of GB2280038A publication Critical patent/GB2280038A/en
Application granted granted Critical
Publication of GB2280038B publication Critical patent/GB2280038B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067Mechanical properties
    • B81B3/0072For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/14Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802Details

Abstract

A micromechanical sensor has a plurality of sensing elements (14a - 14d) which are supported at respective support regions (12a - 12d). A first set of the sensing elements defines the sensing gap. In one arrangement this is defined by sensing elements supported by adjacent support regions. In another embodiment the sensing gap is defined between one sensing element and a reference beam formed by connection of the return legs of two diametrically opposed sensing elements. The sensing elements are substantially similar one to another and each sensing element comprises an outgoing elongate leg extending away from its associated support region and a return leg substantially parallel to the outgoing leg extending towards the support region. By providing sensing elements which are substantially similar in shape and arranged in this way, the effects of thin film stress are minimised. <IMAGE>
GB9418784A 1992-03-16 1993-03-15 Micromechanical sensor Expired - Fee Related GB2280038B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB929205711A GB9205711D0 (en) 1992-03-16 1992-03-16 Micromechanical sensor
PCT/GB1993/000532 WO1993019343A1 (en) 1992-03-16 1993-03-15 Micromechanical sensor

Publications (3)

Publication Number Publication Date
GB9418784D0 GB9418784D0 (en) 1994-11-02
GB2280038A true GB2280038A (en) 1995-01-18
GB2280038B GB2280038B (en) 1995-11-22

Family

ID=10712234

Family Applications (2)

Application Number Title Priority Date Filing Date
GB929205711A Pending GB9205711D0 (en) 1992-03-16 1992-03-16 Micromechanical sensor
GB9418784A Expired - Fee Related GB2280038B (en) 1992-03-16 1993-03-15 Micromechanical sensor

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB929205711A Pending GB9205711D0 (en) 1992-03-16 1992-03-16 Micromechanical sensor

Country Status (7)

Country Link
EP (1) EP0632880B1 (en)
JP (1) JPH08504266A (en)
AT (1) ATE156907T1 (en)
DE (1) DE69313104T2 (en)
ES (1) ES2107010T3 (en)
GB (2) GB9205711D0 (en)
WO (1) WO1993019343A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5658698A (en) * 1994-01-31 1997-08-19 Canon Kabushiki Kaisha Microstructure, process for manufacturing thereof and devices incorporating the same
DE4439238A1 (en) * 1994-11-03 1996-05-09 Telefunken Microelectron Capacitive acceleration sensor
US5880369A (en) * 1996-03-15 1999-03-09 Analog Devices, Inc. Micromachined device with enhanced dimensional control
US6088463A (en) 1998-10-30 2000-07-11 Microtronic A/S Solid state silicon-based condenser microphone
US6829131B1 (en) 1999-09-13 2004-12-07 Carnegie Mellon University MEMS digital-to-acoustic transducer with error cancellation
AU2002331624A1 (en) 2001-08-17 2003-03-03 Carnegie Mellon University Method and apparatus for reconstruction of soundwaves from digital signals
US7142682B2 (en) 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
US7049051B2 (en) 2003-01-23 2006-05-23 Akustica, Inc. Process for forming and acoustically connecting structures on a substrate
US6936524B2 (en) 2003-11-05 2005-08-30 Akustica, Inc. Ultrathin form factor MEMS microphones and microspeakers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0149572A1 (en) * 1984-01-12 1985-07-24 Commissariat A L'energie Atomique Directional accelerometer and process for producing it by microlithography
US4783237A (en) * 1983-12-01 1988-11-08 Harry E. Aine Solid state transducer and method of making same
US4953387A (en) * 1989-07-31 1990-09-04 The Regents Of The University Of Michigan Ultrathin-film gas detector
WO1992003740A1 (en) * 1990-08-17 1992-03-05 Analog Devices, Inc. Monolithic accelerometer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4783237A (en) * 1983-12-01 1988-11-08 Harry E. Aine Solid state transducer and method of making same
EP0149572A1 (en) * 1984-01-12 1985-07-24 Commissariat A L'energie Atomique Directional accelerometer and process for producing it by microlithography
US4953387A (en) * 1989-07-31 1990-09-04 The Regents Of The University Of Michigan Ultrathin-film gas detector
WO1992003740A1 (en) * 1990-08-17 1992-03-05 Analog Devices, Inc. Monolithic accelerometer

Non-Patent Citations (8)

* Cited by examiner, † Cited by third party
Title
APPLIED PHYSICS LETTERS vol.58,no.7,Jan 1991, NEW YORK US pages 100-102 T.W.KENNY ET AL cont. *
D.W.BURNS; H.GUCKEL 'thin films for micromechanical sensors' *
engineering' cited in the application *
JOURNAL OF MICROMECHANICAL ENGINEERING vol.1, 1991, pages 113-125 G.STEMME 'resonant silicon cont *
JOURNAL OF MICROSCOPY vol.152,no.2 Nov 1988, pp585-596 C. SCHNEIKER ET AL 'scanning tunneling cont *
JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY: PART A. vol.8,no.4July 1990, NEW YORK US pp 3606-3613 cont *
'Micromachined silicon tunnel sensor for motion detection' *
sensors'cited in the application *

Also Published As

Publication number Publication date
DE69313104D1 (en) 1997-09-18
EP0632880B1 (en) 1997-08-13
EP0632880A1 (en) 1995-01-11
WO1993019343A1 (en) 1993-09-30
JPH08504266A (en) 1996-05-07
ATE156907T1 (en) 1997-08-15
GB2280038B (en) 1995-11-22
DE69313104T2 (en) 1997-12-11
ES2107010T3 (en) 1997-11-16
GB9418784D0 (en) 1994-11-02
GB9205711D0 (en) 1992-04-29

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20000315