GB2261549A - Cooling arrangement for a semiconductor module and manufacturing method thereof - Google Patents

Cooling arrangement for a semiconductor module and manufacturing method thereof Download PDF

Info

Publication number
GB2261549A
GB2261549A GB9223021A GB9223021A GB2261549A GB 2261549 A GB2261549 A GB 2261549A GB 9223021 A GB9223021 A GB 9223021A GB 9223021 A GB9223021 A GB 9223021A GB 2261549 A GB2261549 A GB 2261549A
Authority
GB
United Kingdom
Prior art keywords
copper foil
semiconductor module
control device
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9223021A
Other languages
English (en)
Other versions
GB9223021D0 (en
Inventor
Koyo Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9223021D0 publication Critical patent/GB9223021D0/en
Publication of GB2261549A publication Critical patent/GB2261549A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB9223021A 1991-11-14 1992-11-03 Cooling arrangement for a semiconductor module and manufacturing method thereof Withdrawn GB2261549A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3298895A JPH05136304A (ja) 1991-11-14 1991-11-14 半導体モジユール及びそれを用いたパワー制御装置

Publications (2)

Publication Number Publication Date
GB9223021D0 GB9223021D0 (en) 1992-12-16
GB2261549A true GB2261549A (en) 1993-05-19

Family

ID=17865549

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9223021A Withdrawn GB2261549A (en) 1991-11-14 1992-11-03 Cooling arrangement for a semiconductor module and manufacturing method thereof

Country Status (3)

Country Link
JP (1) JPH05136304A (ja)
DE (1) DE4238417A1 (ja)
GB (1) GB2261549A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6848819B1 (en) 1999-05-12 2005-02-01 Osram Opto Semiconductors Gmbh Light-emitting diode arrangement
US6952347B2 (en) 2001-01-20 2005-10-04 Conti Temic Microelectronic Gmbh Power module
US7215023B2 (en) 2002-02-01 2007-05-08 Conti Temic Microelectronic Gmbh Power module
EP2071620A1 (en) * 2007-12-12 2009-06-17 Wen-Long Chyn Heat sink having enhanced heat dissipation capacity

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29510335U1 (de) * 1995-06-26 1995-08-24 Siemens AG, 80333 München Elektronisches kombiniertes Logik-Leistungsmodul
FR2753848B1 (fr) * 1996-09-26 1998-12-11 Moteur electrique a commande electronique integree
DE19832710A1 (de) * 1998-07-14 2000-01-27 Siemens Ag Elektrooptische Baugruppe
DE19904279B4 (de) * 1999-02-03 2005-09-01 Sew-Eurodrive Gmbh & Co. Kg Halbleitervorrichtung
DE10042839B4 (de) * 2000-08-30 2009-01-29 Infineon Technologies Ag Elektronisches Bauteil mit Wärmesenke und Verfahren zu seiner Herstellung
DE10100679A1 (de) * 2001-01-09 2002-07-11 Abb Research Ltd Träger für Bauelemente der Mikrosystemtechnik
DE10230712B4 (de) * 2002-07-08 2006-03-23 Siemens Ag Elektronikeinheit mit einem niedrigschmelzenden metallischen Träger
JP4524570B2 (ja) * 2004-03-10 2010-08-18 富士電機システムズ株式会社 半導体装置
DE102005049872B4 (de) * 2005-10-18 2010-09-23 Continental Automotive Gmbh IC-Bauelement mit Kühlanordnung
JP5846824B2 (ja) * 2011-09-26 2016-01-20 ダイヤモンド電機株式会社 電動パワーステアリングコントロールユニット
DE102019215793A1 (de) * 2019-10-14 2021-04-15 Vitesco Technologies GmbH Verdrahtungssubstrat für ein Halbleiterbauteil und Verfahren zur Herstellung eines Verdrahtungssubstrats

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2026767A (en) * 1978-07-10 1980-02-06 Optical Coating Laboratory Inc Concentrator solar cell array module
EP0081365A1 (en) * 1981-12-07 1983-06-15 Hitachi, Ltd. Electrically insulating silicon carbide sintered body
US4965660A (en) * 1983-09-22 1990-10-23 Hitachi, Ltd. Integrated circuit package having heat sink bonded with resinous adhesive

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4884125A (en) * 1986-10-15 1989-11-28 Sanyo Electic Co., Ltd. Hybrid integrated circuit device capable of being inserted into socket
JP2609724B2 (ja) * 1989-06-28 1997-05-14 株式会社日立製作所 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2026767A (en) * 1978-07-10 1980-02-06 Optical Coating Laboratory Inc Concentrator solar cell array module
EP0081365A1 (en) * 1981-12-07 1983-06-15 Hitachi, Ltd. Electrically insulating silicon carbide sintered body
US4965660A (en) * 1983-09-22 1990-10-23 Hitachi, Ltd. Integrated circuit package having heat sink bonded with resinous adhesive

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6848819B1 (en) 1999-05-12 2005-02-01 Osram Opto Semiconductors Gmbh Light-emitting diode arrangement
US6952347B2 (en) 2001-01-20 2005-10-04 Conti Temic Microelectronic Gmbh Power module
US7215023B2 (en) 2002-02-01 2007-05-08 Conti Temic Microelectronic Gmbh Power module
EP2071620A1 (en) * 2007-12-12 2009-06-17 Wen-Long Chyn Heat sink having enhanced heat dissipation capacity

Also Published As

Publication number Publication date
GB9223021D0 (en) 1992-12-16
DE4238417A1 (ja) 1993-05-19
JPH05136304A (ja) 1993-06-01

Similar Documents

Publication Publication Date Title
GB2261549A (en) Cooling arrangement for a semiconductor module and manufacturing method thereof
US6881071B2 (en) Power semiconductor module with pressure contact means
US20190067151A1 (en) Three-dimensional packaging structure and packaging method of power devices
US20110100681A1 (en) Substrate-mounted circuit module having components in a plurality of contacting planes
US6369411B2 (en) Semiconductor device for controlling high-power electricity with improved heat dissipation
JP4465906B2 (ja) パワー半導体モジュール
US11062972B2 (en) Electronic module for power control and method for manufacturing an electronic module power control
WO2007130643A2 (en) Die-on-leadframe (dol) with high voltage isolation
CN109727960A (zh) 半导体模块、其制造方法以及电力变换装置
JP7091878B2 (ja) パワーモジュール、電力変換装置、及びパワーモジュールの製造方法
CN111696936A (zh) 一种集成散热器的功率模块及其制作方法
JP6965706B2 (ja) 半導体モジュール、その製造方法及び電力変換装置
JP6644196B1 (ja) 半導体装置およびその製造方法ならびに電力変換装置
JP2019153607A (ja) 電力用半導体装置およびその製造方法、ならびに電力変換装置
JP2018147958A (ja) 半導体パワーモジュール及び電力変換装置
CN113097155A (zh) 一种芯片导热模块及其制备方法
WO2020245890A1 (ja) パワーモジュール及び電力変換装置
JPH11163490A (ja) 電子装置
US20230378888A1 (en) Electrical system with an electrical power module and a dc link capacitor and method for manufacturing such an electrical system
JP2002314037A (ja) パワー半導体モジュール
CN114899161A (zh) 一种模块及其制造方法
JP2000196011A (ja) 電子装置及びその製造方法
JP2007250689A (ja) Ｉｐｍ搭載の太陽光インバータとその製造方法
JP4103411B2 (ja) 電力変換装置
CN219677253U (zh) 一种双面散热的半导体装置及封装

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)