GB2249219B - A method of manufacturing single-sided printed-wiring boards - Google Patents

A method of manufacturing single-sided printed-wiring boards

Info

Publication number
GB2249219B
GB2249219B GB9121966A GB9121966A GB2249219B GB 2249219 B GB2249219 B GB 2249219B GB 9121966 A GB9121966 A GB 9121966A GB 9121966 A GB9121966 A GB 9121966A GB 2249219 B GB2249219 B GB 2249219B
Authority
GB
United Kingdom
Prior art keywords
wiring boards
sided printed
manufacturing single
manufacturing
sided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9121966A
Other versions
GB9121966D0 (en
GB2249219A (en
Inventor
Masuo Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp
Publication of GB9121966D0 publication Critical patent/GB9121966D0/en
Publication of GB2249219A publication Critical patent/GB2249219A/en
Application granted granted Critical
Publication of GB2249219B publication Critical patent/GB2249219B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
GB9121966A 1990-10-18 1991-10-16 A method of manufacturing single-sided printed-wiring boards Expired - Fee Related GB2249219B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27999990A JPH04154188A (en) 1990-10-18 1990-10-18 Manufacture of single-sided printed wiring board

Publications (3)

Publication Number Publication Date
GB9121966D0 GB9121966D0 (en) 1991-11-27
GB2249219A GB2249219A (en) 1992-04-29
GB2249219B true GB2249219B (en) 1994-08-17

Family

ID=17618899

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9121966A Expired - Fee Related GB2249219B (en) 1990-10-18 1991-10-16 A method of manufacturing single-sided printed-wiring boards

Country Status (2)

Country Link
JP (1) JPH04154188A (en)
GB (1) GB2249219B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5877940A (en) * 1993-12-02 1999-03-02 Teledyne Industries Inc. Fabrication multilayer combined rigid/flex printed circuit board
CA2177275C (en) * 1993-12-02 2004-07-06 Lee J. Millette Fabrication multilayer combined rigid/flex printed circuit board
US5505321A (en) * 1994-12-05 1996-04-09 Teledyne Industries, Inc. Fabrication multilayer combined rigid/flex printed circuit board
DE69433411T2 (en) * 1994-03-08 2004-10-14 Teledyne Technologies Inc., Los Angeles MANUFACTURE OF A MULTI-LAYER COMBINED RIGID-FLEXIBLE PCB
US7807215B2 (en) * 2006-09-21 2010-10-05 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing copper-clad laminate for VOP application
CN105282975B (en) * 2014-05-28 2018-05-11 深圳崇达多层线路板有限公司 A kind of hole processing method for pcb board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0348632A2 (en) * 1988-06-29 1990-01-03 International Business Machines Corporation Processing of cores for circuit boards or cards

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0348632A2 (en) * 1988-06-29 1990-01-03 International Business Machines Corporation Processing of cores for circuit boards or cards

Also Published As

Publication number Publication date
JPH04154188A (en) 1992-05-27
GB9121966D0 (en) 1991-11-27
GB2249219A (en) 1992-04-29

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19951016