GB2249196A - Originals with release layers - Google Patents

Originals with release layers Download PDF

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Publication number
GB2249196A
GB2249196A GB9119712A GB9119712A GB2249196A GB 2249196 A GB2249196 A GB 2249196A GB 9119712 A GB9119712 A GB 9119712A GB 9119712 A GB9119712 A GB 9119712A GB 2249196 A GB2249196 A GB 2249196A
Authority
GB
United Kingdom
Prior art keywords
exposure
film
pattern
photosensitive resin
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9119712A
Other versions
GB2249196B (en
GB9119712D0 (en
Inventor
Shin Kawakami
Satoshi Haruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp
Publication of GB9119712D0 publication Critical patent/GB9119712D0/en
Publication of GB2249196A publication Critical patent/GB2249196A/en
Application granted granted Critical
Publication of GB2249196B publication Critical patent/GB2249196B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/48—Protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks

Abstract

An original for use in manufacturing printed circuit boards comprising a film base 1, an image pattern 2, and a protective film 3 for protecting the pattern, and a release layer 4 preferably of a silicone resin or a fluorine-containing resin. The release layer 4 when applied to a photosensitive resist surface prevents sticking at the time of exposure of the photosensitive resin or damage of the photosensitive resin surface or the pattern surface of the original. <IMAGE>

Description

EXPOSURE FILM FOR USE IN MANUFACTURING PRINTED WIRING BOARDS The present invention is related to an exposure film for use in manufacturing printed wiring boards.
Since it has become difficult in the matter of precision for the conventional pattern forming and solder resist operations by screen printing to meet the requirements for being light, thin and small, and for high precision and high density in printed wiring boards, a photosensitive resin is directly applied on the material and an exposure and sintering process required for forming a pattern thereon is adopted.
When the material is directly coated with a photosensitive resin, the coating resin is exposed and is in liquid form after the coating, and thus the coating resin is subjected to a heat treatment so as to be semi-hardened, but the resin surface is in a polymeric state and adhesive.
In these circumstances, the problem arises that an exposure film sticks to the surface of such photosensitive resin when the exposure film is mounted on the photosensitive resin surface and alignment is performed for the purpose of exposing the photosensitive resin, or a protective film peels off the exposure film side, which protective film is comprised of a polyethylene film of the order of 20 pm and deposited for protecting the exposure pattern of the exposure film, and such defect has been a hindrance to the manufacturing of printed wiring boards.
Consequently, the present invention was developed in view of the hindrance to the work in printed wiring boards manufactured by directly applying a photosensitive resin onto the material, and seeks to provide an exposure film which can accomplish the exposure work independently of the adhesivity of the photosensitive resin with respect to the material.
According to the present invention, there is provided an exposure film for use in manufacturing printed wiring boards, said exposure film comprising a film base, an exposure pattern, and a protective film for protecting the exposure pattern, and wherein said protective film is formed with a release treatment.
A release action with the photosensitive resist surface is exhibited in the protective film of the exposure film of the present invention by applying the release treatment, and sticking at the time of exposure of the photosensitive resin or damage of the photosensitive resin surface or the exposure pattern surface of the exposure film can be prevented.
In order that the invention may be better understood, an embodiment thereof will now be described by way of example only and with reference to the accompanying drawing which is a schematic sectional view showing the embodiment of the exposure film of the present invention.
Referring to the drawing, reference 1 represents a film base, on which an exposure pattern 2 is formed for exposing the phoosensitive resin applied on the material of a printed wiring board (not shown) into a pattern corresponding to the printed circuit pattern or solder resist pattern to be formed.
In addition, the exposure pattern 2 is protected by a protective film 3.
Further, the protective film 3 is provided with a release treatment by being coated with a material having a large release effect, for instance, a silicone and fluorine-contained resin 4.
As an example of the release agent for use in the release treatment, type KF-96 made by Shinetsu Kagaku-Kogyo K.K. can be used as a silicone resin and Fluorade type FC-721 made by Sumitomo 3M Corporation can be used as a fluorine-contained resin.
The exposure film of such construction is put in contact with the photosensitive resin surface, which was formed by being directly applied on the material of a printed wiring board, with the protected surface 3 side formed with the release treatment, and thence performing an exposure alignment.
The remaining construction is the same as that of the exposure film used in the conventional exposure method, and thus a detailed description thereof is omitted.
In addition, the application as the exposure film used for the exposure process in the manufacturing of printed wiring boards is not limited to the formation of the printed circuit pattern, but the use as the exposure film in the formation of solder resist film or the like is of course possible as well.
In accordance with the exposure film of the present invention, by applying a release treatment by a material having a large release effect to the protective film which is a surface to be contacted with the photosensitive resin surface, defects such as the film contamination caused by the adhesivity due to the unhardened state of the photosensitive resin and the peeling of the protective film can be prevented, thereby enabling the exposure operation to be improved.

Claims (3)

1. An exposure film for use in manufacturing printed wiring boards, said exposure film comprising a film base, an exposure pattern, and a protective film for protecting the exposure pattern, and wherein said protective film is formed with a release treatment.
2. An exposure film as claimed in claim 1 wherein the release treatment of said protective film comprises a coating of silicone and fluorine-contained resins.
3. An exposure film for use in manufacturing printed wiring boards substantially as hereinbefore described with reference to the accompanying drawing.
GB9119712A 1990-09-18 1991-09-16 Photo-mask for use in manufacturing printed wiring boards Expired - Fee Related GB2249196B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2247696A JPH04125641A (en) 1990-09-18 1990-09-18 Exposing film used for production of printed circuit board

Publications (3)

Publication Number Publication Date
GB9119712D0 GB9119712D0 (en) 1991-10-30
GB2249196A true GB2249196A (en) 1992-04-29
GB2249196B GB2249196B (en) 1994-06-15

Family

ID=17167292

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9119712A Expired - Fee Related GB2249196B (en) 1990-09-18 1991-09-16 Photo-mask for use in manufacturing printed wiring boards

Country Status (2)

Country Link
JP (1) JPH04125641A (en)
GB (1) GB2249196B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1128211A1 (en) * 2000-02-21 2001-08-29 Motorola, Inc. Lithographic printing method using a low surface energy layer
US6300042B1 (en) 1998-11-24 2001-10-09 Motorola, Inc. Lithographic printing method using a low surface energy layer

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1180805A (en) * 1966-06-30 1970-02-11 Ibm A Process for Forming Protective Coatings on Glass Photographic Masters.
US4451552A (en) * 1981-02-06 1984-05-29 Crosfield Electronics Limited Formation of print surfaces
GB2131966A (en) * 1982-12-15 1984-06-27 Letraset International Ltd Manufacture of transfer materials
US4735890A (en) * 1982-09-16 1988-04-05 Tokyo Ohka Kogyo Kabushiki Kaisha Photomasks for photolithographic fine patterning

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1180805A (en) * 1966-06-30 1970-02-11 Ibm A Process for Forming Protective Coatings on Glass Photographic Masters.
US4451552A (en) * 1981-02-06 1984-05-29 Crosfield Electronics Limited Formation of print surfaces
US4735890A (en) * 1982-09-16 1988-04-05 Tokyo Ohka Kogyo Kabushiki Kaisha Photomasks for photolithographic fine patterning
GB2131966A (en) * 1982-12-15 1984-06-27 Letraset International Ltd Manufacture of transfer materials

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6300042B1 (en) 1998-11-24 2001-10-09 Motorola, Inc. Lithographic printing method using a low surface energy layer
US6562553B2 (en) 1998-11-24 2003-05-13 Motorola, Inc. Lithographic printing method using a low surface energy layer
EP1128211A1 (en) * 2000-02-21 2001-08-29 Motorola, Inc. Lithographic printing method using a low surface energy layer

Also Published As

Publication number Publication date
JPH04125641A (en) 1992-04-27
GB2249196B (en) 1994-06-15
GB9119712D0 (en) 1991-10-30

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19950916