|
US5591267A
(en)
*
|
1988-01-11 |
1997-01-07 |
Ohmi; Tadahiro |
Reduced pressure device
|
|
US5906688A
(en)
*
|
1989-01-11 |
1999-05-25 |
Ohmi; Tadahiro |
Method of forming a passivation film
|
|
JP2779937B2
(ja)
*
|
1988-06-20 |
1998-07-23 |
大和製衡株式会社 |
重量式計量充填包装機
|
|
US5683072A
(en)
*
|
1988-11-01 |
1997-11-04 |
Tadahiro Ohmi |
Thin film forming equipment
|
|
JPH02139391A
(ja)
*
|
1988-11-11 |
1990-05-29 |
Shigeo Kanetani |
液体供給装置
|
|
US5789086A
(en)
*
|
1990-03-05 |
1998-08-04 |
Ohmi; Tadahiro |
Stainless steel surface having passivation film
|
|
JPH0395922A
(ja)
*
|
1989-09-07 |
1991-04-22 |
Canon Inc |
半導体薄膜の形成方法
|
|
US5300460A
(en)
*
|
1989-10-03 |
1994-04-05 |
Applied Materials, Inc. |
UHF/VHF plasma for use in forming integrated circuit structures on semiconductor wafers
|
|
JP2758948B2
(ja)
*
|
1989-12-15 |
1998-05-28 |
キヤノン株式会社 |
薄膜形成方法
|
|
US5707486A
(en)
*
|
1990-07-31 |
1998-01-13 |
Applied Materials, Inc. |
Plasma reactor using UHF/VHF and RF triode source, and process
|
|
EP0609237A1
(en)
*
|
1991-09-09 |
1994-08-10 |
Sematech, Inc. |
Harmonic and subharmonic isolator for plasma discharge
|
|
US5302882A
(en)
*
|
1991-09-09 |
1994-04-12 |
Sematech, Inc. |
Low pass filter for plasma discharge
|
|
US5490910A
(en)
*
|
1992-03-09 |
1996-02-13 |
Tulip Memory Systems, Inc. |
Circularly symmetric sputtering apparatus with hollow-cathode plasma devices
|
|
US5203385A
(en)
*
|
1992-03-31 |
1993-04-20 |
Donald Waber |
Apparatus and process for automatically reconstituting dry materials, especially pharmaceuticals
|
|
JPH0653137A
(ja)
*
|
1992-07-31 |
1994-02-25 |
Canon Inc |
水素化アモルファスシリコン膜の形成方法
|
|
US5325019A
(en)
*
|
1992-08-21 |
1994-06-28 |
Sematech, Inc. |
Control of plasma process by use of harmonic frequency components of voltage and current
|
|
US6022458A
(en)
*
|
1992-12-07 |
2000-02-08 |
Canon Kabushiki Kaisha |
Method of production of a semiconductor substrate
|
|
JP3351843B2
(ja)
*
|
1993-02-24 |
2002-12-03 |
忠弘 大見 |
成膜方法
|
|
JPH06279185A
(ja)
*
|
1993-03-25 |
1994-10-04 |
Canon Inc |
ダイヤモンド結晶およびダイヤモンド結晶膜の形成方法
|
|
US5911856A
(en)
*
|
1993-09-03 |
1999-06-15 |
Canon Kabushiki Kaisha |
Method for forming thin film
|
|
JP3387616B2
(ja)
*
|
1994-04-18 |
2003-03-17 |
キヤノン株式会社 |
プラズマ処理装置
|
|
JP3419899B2
(ja)
*
|
1994-07-26 |
2003-06-23 |
東京エレクトロン株式会社 |
スパッタリング方法及びスパッタリング装置
|
|
EP0715334B1
(en)
*
|
1994-11-30 |
1999-04-14 |
Applied Materials, Inc. |
Plasma reactors for processing semiconductor wafers
|
|
JPH08220304A
(ja)
|
1995-02-13 |
1996-08-30 |
Tadahiro Omi |
光学物品及びそれを用いた露光装置又は光学系並びにその製造方法
|
|
US6132564A
(en)
|
1997-11-17 |
2000-10-17 |
Tokyo Electron Limited |
In-situ pre-metallization clean and metallization of semiconductor wafers
|
|
US6224724B1
(en)
|
1995-02-23 |
2001-05-01 |
Tokyo Electron Limited |
Physical vapor processing of a surface with non-uniformity compensation
|
|
US5948215A
(en)
|
1997-04-21 |
1999-09-07 |
Tokyo Electron Limited |
Method and apparatus for ionized sputtering
|
|
US5800688A
(en)
*
|
1997-04-21 |
1998-09-01 |
Tokyo Electron Limited |
Apparatus for ionized sputtering
|
|
JP3630982B2
(ja)
*
|
1997-05-22 |
2005-03-23 |
キヤノン株式会社 |
プラズマ処理方法及びプラズマ処理装置
|
|
US5921759A
(en)
*
|
1997-10-14 |
1999-07-13 |
Sandeep Khan |
Liquid metering piston pump and valves capable of being cleaned and sterilized without disassembly
|
|
JP3565311B2
(ja)
*
|
1997-12-17 |
2004-09-15 |
アルプス電気株式会社 |
プラズマ処理装置
|
|
US6287977B1
(en)
|
1998-07-31 |
2001-09-11 |
Applied Materials, Inc. |
Method and apparatus for forming improved metal interconnects
|
|
US6236001B1
(en)
*
|
1999-08-03 |
2001-05-22 |
Wayne W. Shymko |
Scoop with weigh scale
|
|
DE10065094A1
(de)
*
|
2000-12-28 |
2002-07-04 |
Wipotec Wiege & Positioniersys |
Wägevorrichtung mit Freistellungseinrichtung
|
|
US6631693B2
(en)
*
|
2001-01-30 |
2003-10-14 |
Novellus Systems, Inc. |
Absorptive filter for semiconductor processing systems
|
|
US7084832B2
(en)
*
|
2001-10-09 |
2006-08-01 |
Plasma Control Systems, Llc |
Plasma production device and method and RF driver circuit with adjustable duty cycle
|
|
US7100532B2
(en)
*
|
2001-10-09 |
2006-09-05 |
Plasma Control Systems, Llc |
Plasma production device and method and RF driver circuit with adjustable duty cycle
|
|
US7132996B2
(en)
*
|
2001-10-09 |
2006-11-07 |
Plasma Control Systems Llc |
Plasma production device and method and RF driver circuit
|
|
JP4207543B2
(ja)
*
|
2002-11-21 |
2009-01-14 |
澁谷工業株式会社 |
回転式重量充填装置
|
|
US7405521B2
(en)
*
|
2003-08-22 |
2008-07-29 |
Lam Research Corporation |
Multiple frequency plasma processor method and apparatus
|
|
US7042311B1
(en)
|
2003-10-10 |
2006-05-09 |
Novellus Systems, Inc. |
RF delivery configuration in a plasma processing system
|
|
JP4703965B2
(ja)
*
|
2004-03-22 |
2011-06-15 |
大和製衡株式会社 |
回転式重量充填装置および回転式重量充填方法
|
|
US7594968B2
(en)
*
|
2004-09-10 |
2009-09-29 |
Carnegie Institution Of Washington |
Ultratough CVD single crystal diamond and three dimensional growth thereof
|
|
US7214619B2
(en)
*
|
2004-10-05 |
2007-05-08 |
Applied Materials, Inc. |
Method for forming a barrier layer in an integrated circuit in a plasma with source and bias power frequencies applied through the workpiece
|
|
US7268076B2
(en)
*
|
2004-10-05 |
2007-09-11 |
Applied Materials, Inc. |
Apparatus and method for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece
|
|
US7399943B2
(en)
*
|
2004-10-05 |
2008-07-15 |
Applied Materials, Inc. |
Apparatus for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece
|
|
JP4675612B2
(ja)
*
|
2004-11-18 |
2011-04-27 |
大和製衡株式会社 |
回転式重量計
|
|
US7820020B2
(en)
*
|
2005-02-03 |
2010-10-26 |
Applied Materials, Inc. |
Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas
|
|
US20070074968A1
(en)
*
|
2005-09-30 |
2007-04-05 |
Mirko Vukovic |
ICP source for iPVD for uniform plasma in combination high pressure deposition and low pressure etch process
|
|
WO2007072853A1
(ja)
|
2005-12-21 |
2007-06-28 |
Ishida Co., Ltd. |
回転式計量装置
|
|
DE102006002711C5
(de)
*
|
2006-01-19 |
2009-11-12 |
Wipotec Wiege- Und Positioniersysteme Gmbh |
Wägeaufnehmer
|
|
ITBO20060108A1
(it)
*
|
2006-02-14 |
2007-08-15 |
Azionaria Costruzioni Acma Spa |
Dispositivo di supporto e pesatura per contenitori.
|
|
US7645710B2
(en)
|
2006-03-09 |
2010-01-12 |
Applied Materials, Inc. |
Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system
|
|
US7678710B2
(en)
|
2006-03-09 |
2010-03-16 |
Applied Materials, Inc. |
Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system
|
|
US7837838B2
(en)
*
|
2006-03-09 |
2010-11-23 |
Applied Materials, Inc. |
Method of fabricating a high dielectric constant transistor gate using a low energy plasma apparatus
|
|
US20070209930A1
(en)
*
|
2006-03-09 |
2007-09-13 |
Applied Materials, Inc. |
Apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system
|
|
ITBO20070549A1
(it)
*
|
2007-08-02 |
2009-02-03 |
Acma Spa |
Giostra di supporto e pesatura per contenitori.
|
|
US9856558B2
(en)
*
|
2008-03-14 |
2018-01-02 |
Applied Materials, Inc. |
Physical vapor deposition method with a source of isotropic ion velocity distribution at the wafer surface
|
|
US8568571B2
(en)
*
|
2008-05-21 |
2013-10-29 |
Applied Materials, Inc. |
Thin film batteries and methods for manufacturing same
|
|
DE102008030721A1
(de)
|
2008-07-01 |
2010-01-07 |
Krones Ag |
Vorrichtung zum Abfüllen von zähfließenden Medien
|
|
US9017533B2
(en)
*
|
2008-07-15 |
2015-04-28 |
Applied Materials, Inc. |
Apparatus for controlling radial distribution of plasma ion density and ion energy at a workpiece surface by multi-frequency RF impedance tuning
|
|
US8920611B2
(en)
*
|
2008-07-15 |
2014-12-30 |
Applied Materials, Inc. |
Method for controlling radial distribution of plasma ion density and ion energy at a workpiece surface by multi-frequency RF impedance tuning
|
|
JP5773346B2
(ja)
*
|
2009-03-12 |
2015-09-02 |
株式会社アルバック |
セルフイオンスパッタリング装置
|
|
IT1393740B1
(it)
*
|
2009-03-27 |
2012-05-08 |
Cft Packaging S P A |
Dispositivo di riempimento ponderale e riempitrice ponderale
|
|
FR2946623B1
(fr)
*
|
2009-06-11 |
2016-07-01 |
Serac Group |
Dispositif de delivrance suspendu et installation de remplissage de recipients comportant de tels dispositifs.
|
|
JP5064533B2
(ja)
*
|
2010-06-07 |
2012-10-31 |
大和製衡株式会社 |
回転式重量充填装置および回転式重量充填方法
|
|
CN103608966B
(zh)
|
2011-06-17 |
2017-02-15 |
应用材料公司 |
无针孔介电薄膜制造
|
|
DE102011110488B4
(de)
*
|
2011-08-17 |
2013-05-29 |
Flintec Gmbh |
Wägevorrichtung für Füllmaschinen zum gewichtsabhängigen Füllen von Behältern sowie Füllmaschine
|
|
US9735280B2
(en)
|
2012-03-02 |
2017-08-15 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device, method for manufacturing semiconductor device, and method for forming oxide film
|
|
EP2839530B1
(en)
|
2012-04-18 |
2017-03-15 |
Applied Materials, Inc. |
Pinhole-free solid state electrolyte with high ionic conductivity
|
|
JP6196529B2
(ja)
*
|
2013-10-31 |
2017-09-13 |
澁谷工業株式会社 |
ピストン式充填機
|
|
GB201319654D0
(en)
*
|
2013-11-07 |
2013-12-25 |
Spts Technologies Ltd |
Deposition of silicon dioxide
|
|
DE102013020638A1
(de)
*
|
2013-12-16 |
2015-06-18 |
Merck Patent Gmbh |
Abfüllvorrichtung und deren Verwendung zur Abfüllung eines Fluids
|
|
US10264663B1
(en)
|
2017-10-18 |
2019-04-16 |
Lam Research Corporation |
Matchless plasma source for semiconductor wafer fabrication
|
|
JP7060796B6
(ja)
*
|
2018-05-09 |
2022-05-17 |
慶應義塾 |
重量充填装置
|