GB2151662A - Device for enriching a carrier gas with the vapour of a slightly volatile material for chemical vapour deposition method - Google Patents

Device for enriching a carrier gas with the vapour of a slightly volatile material for chemical vapour deposition method Download PDF

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Publication number
GB2151662A
GB2151662A GB08427276A GB8427276A GB2151662A GB 2151662 A GB2151662 A GB 2151662A GB 08427276 A GB08427276 A GB 08427276A GB 8427276 A GB8427276 A GB 8427276A GB 2151662 A GB2151662 A GB 2151662A
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GB
United Kingdom
Prior art keywords
carrier gas
wall
mixture
groove
metal member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB08427276A
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GB2151662B (en
GB8427276D0 (en
Inventor
Georg Gartner
Helmut Grosche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of GB8427276D0 publication Critical patent/GB8427276D0/en
Publication of GB2151662A publication Critical patent/GB2151662A/en
Application granted granted Critical
Publication of GB2151662B publication Critical patent/GB2151662B/en
Expired legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4481Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

The device comprises a container (1) having a heatable inner space (3) for receiving a fine-particle, sparingly volatile material or mixture of materials, a gas inlet (4) and a gas outlet (5), and the container (1) comprises a removable tightly-fitting metal member (2), having a groove (3) preferably wound in the form of a spiral or in a zigzag-like or meander-like manner provided in at least one outer wall of the metal member, and said outer wall being in contact with an inner wall, preferably the bottom, of the container, in such manner that the groove forms the said inner space. The device has a long flow path and can easily be cleaned. <IMAGE>

Description

SPECIFICATION Device for Enriching a Carrier Gas with the Vapour of a Sparingly Volatile Material The invention relates to a device for enriching a carrier gas or carrier gas mixture with the vapour or vapours of a sparingly volatile material or mixture of materials present in the form of solid particles, comprising a container having a heatable inner space for receiving the material or mixture of materials which is provided with an inlet for the carrier gas and an outlet for the enriched carrier gas, the pipes opening into the inner space in such manner that the carrier gas during operation of the device flows through the material or the mixture of materials.
Such a device is known from DE-OS 31 36 895.
The known device consists of an evaporation vessel with cover. Inside the evaporation vessel a sieve is present on which during operation of the device a starting material is present in the form of a powder.
A heating element is provided below the sieve or in the proximity thereof in the evaporation vessel.
From a carrier gas storage container an inlet leads to the evaporation vessel, the inlet opening below the sieve. From the inner space of the evaporation vessel above the sieve a vapour outlet leads to a reactor in which a reactive deposition from the gaseous phase takes piace in which hence a CVDmethod is carried out.
The investigations which have led to the present invention relates to the enrichment of carrier gases with gases for the reactive deposition in particular of rare earth metals (Ill-B-metal) and rare earth metal compounds (Ill-B-compounds), respectively, and of thorium and thorium compounds, from the gaseous phase. Since the starting compounds in question for the CVD-method as a rule are present as metalorganiccompounds in powder form at room temperatu re--only these are slightly volatile already with slight heating-the starting compound is transported by a carrier gas to a substrate surface on which layers are to be deposited. The carrier gas, preferably a noble gas, in particular argon, flows through a saturator which is filled with the starting compound in powder form and is heated to a suitable temperature.
The device known from DE-OS 31 36 895 suffers from the disadvantage of having only a short flow path of the gas through the gas-forming material.
The yield of reaction gas for the CVD-method and its concentration in the gasflow, respectively, are correspondingly low.
It is the object of the invention to provide a device of the kind mentioned in the opening paragraph, in particular a saturator, which has a long flow path.
According to the invention this object is achieved in that the container comprises a removable tightly fitting metal member, that at least one groove is provided in at least one outer wall of the metal member, and that said outer wall is in contact with an inner wall of the container in such manner that the groove forms the said inner space.
In order to achieve a flow path which is as long as possible, the groove must be as long as possible.
For this purpose it is advantageous for the groove to be wound in the form of a spiral or in a zigzag-like or meander-like manner.
The outer wall of the metal member in which the groove is provided is preferably in contact with the bottom of the vessel. From this it follows that the groove is preferably provided in the lower side of the metal member. However, it is also possible for the groove to be provided in the side walls of the metal member.
In order to avoid particles of the material or mixture of materials being dragged along by the carrier gas it is advantageous to provide a gas permeable member between the gas outlet and the inner space.
The device according to the invention has the advantage that it can be filled in a simple manner with the fine-particle vapour-forming material or mixture of materials, for example a powder. For example, for filling a saturator according to the invention the groove formed in the lower side of a copper block is pressed down to the bottom of a tray or pan of V2A noble steel filled just sufficiently with the powder. During operation, the carrier gas flows through the groove thus filled.
A helical construction of the groove has the additional advantage that by means of a rotary movement in the spiral outer direction a dense filling of the grooves with the powder is achieved and at the same time the bottom contact of the contacting surfaces becomes really good.
A further advantage of the device according to the invention is that its parts, after removing the metal member, can easily be cleaned.
Afew embodiments of the invention are shown in a drawing and will be described in greater detail hereinafter. In the drawing: Fig. 1 is a sectional view of a saturator, Fig. 2 shows a removable metal member (metal insert) with spiral-like groove, and Fig. 3 shows a removable metal member (metal insert) with meander-like groove.
The sequence in time of the operation of the saturatorshown in Figure 1 is as follows.
First, fine gas-forming powder is filled in a container 1 of noble steel. A tightly fitting copper block 2 having a spiral groove 3 in its lower side is then pressed firmly on the powder, namely by means of a rotary movement against the subsequent direction of flow, and is fitted to the carrier gas inlet 4 and locked buy a pin (not shown).
The gas outlet 5 is in the centre of the copper block and comprises a mesh grid and Awl203 wool provided in front of it. This combined sieve is to prevent emanation of the powder.
A further copper insert, for example a hollow cylinder with sealing and outlet aperture (not shown) may be provided above the copper block 2 and be clamped on the saturator block with fixed pressure by means of a bayonet. The space between the copper insert and the saturator block then forms a mixing chamber for further CVD starting gases.
Via its outlet nozzle the substrate to be coated may then be provided in a reactor (not shown).
Fig. 2 shows a metal member 2 having a spiral-like groove 3 and Fig. 3 shows a metal member 2 having a meander-like groove 3 in which the carrier gas inlet is referenced 4 and the gas outlet is referenced 5.
The outer walls of the saturator and reactor consists of V2A noble steel and are constructed so as to be high vacuum-tight. They are present in a furnace having a separate heating for the saturator and for the reactor and the mixing chamber. During operation the latter are at a slightly higher temperature than the saturator so as to avoid deposition on the wall of the III B starting compound. After a series of coatings, cleaning of the saturator and a renewed filling with the starting compound as a rule is necessary since many of the powdered metalorganic starting compounds used start to dissociate already near the melting point, but exactly there also have the highest vapour pressure realisable in the long run. Moreover, a successive decomposition by contact with the agressive compounds (for example WF6 and HF) formed during the CVD method may be caused.
For cleaning purposes the whole arrangement can be taken apart wtih few manipulations and be cleaned by means of a brush in dilute solutions of detergents followed by rinsing with water and ethanol.
In using the saturator thorium acetyl acetonate (Th(AA)4) and thorium trifluoroacetyl acetonate (Th (3 FAA)4) were used as powdered starting compounds and argon was used as a carrier gas.
The saturator temperature for the filling with Th(AA)4 was 160 C+5 C and for the Th(3FAA)4 filling it was 100 to 1 20 C. The reactor temperature was 200- above the saturation temperature. As deposition rates for the layers containing thorium approximately 0.1 to 0.4 pmlmin were reached which strongly reduced forTh(AA)4 in the each time third coating and for Th(3FAA)4 could be realised for approximately 6 coatings, the duration of a coating being at most 4 hours.

Claims (5)

1. A device for enriching a carrier gas or mixture of carrier gases with the vapour or vapours of a sparingly volatile material or mixture of materials present in the form of solid particles, comprising a container having a heatable inner space for receiving the material or mixture of materials which is provided with an inletforthe carrier gas and an outlet for the enriched carrier gas, the pipes opening into the inner space in such manner that the carrier gas during operation of the device flows through the material or the mixture of materials, characterized in that the container comprises a removable tightly fitting metal member, that at least one groove is provided in at least one outer wall of the metal member, and that said outer wall is in contact with an inner wall of the container in such manner that the groove forms the said inner space.
2. A device as claimed in Claim 1, characterized in that the groove is wound in the form of a spiral or in a zigzag-like or meander-like manner.
3. A device as claimed in Claim 1 or 2, characterized in that the outer wall of the metal member in which the groove is provided is in contact with the bottom of the vessel.
4. A device as claimed in Claim 1,2 or 3, characterized in that a gas-permeable member is provided between the gas outlet and the inner wall.
5. A device for enriching a carrier gas or mixture of carrier gases with the vapour or vapours of a sparingly volatile material or mixture of materials present in the device in the form of solid particles, substantially as herein described with reference to Figures 1 and 2 orto Figure 3 of the drawings.
GB08427276A 1983-11-02 1984-10-29 Device for enriching a carrier gas with the vapour of a slightly volatile material for chemical vapour deposition method Expired GB2151662B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833339625 DE3339625A1 (en) 1983-11-02 1983-11-02 DEVICE FOR ENRICHING A CARRIER GAS WITH THE VAPOR OF A LITTLE VOLATILE FABRIC

Publications (3)

Publication Number Publication Date
GB8427276D0 GB8427276D0 (en) 1984-12-05
GB2151662A true GB2151662A (en) 1985-07-24
GB2151662B GB2151662B (en) 1986-07-23

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GB08427276A Expired GB2151662B (en) 1983-11-02 1984-10-29 Device for enriching a carrier gas with the vapour of a slightly volatile material for chemical vapour deposition method

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JP (1) JPS61110766A (en)
DE (1) DE3339625A1 (en)
FR (1) FR2554131B1 (en)
GB (1) GB2151662B (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004007793A2 (en) * 2002-07-17 2004-01-22 Applied Materials, Inc. Method and apparatus for providing gas to a processing chamber
US7122085B2 (en) 2002-07-30 2006-10-17 Asm America, Inc. Sublimation bed employing carrier gas guidance structures
US7156380B2 (en) 2003-09-29 2007-01-02 Asm International, N.V. Safe liquid source containers
US7601225B2 (en) 2002-06-17 2009-10-13 Asm International N.V. System for controlling the sublimation of reactants
US7833353B2 (en) 2007-01-24 2010-11-16 Asm Japan K.K. Liquid material vaporization apparatus for semiconductor processing apparatus
US8012876B2 (en) 2008-12-02 2011-09-06 Asm International N.V. Delivery of vapor precursor from solid source
US8137462B2 (en) 2006-10-10 2012-03-20 Asm America, Inc. Precursor delivery system
US9117773B2 (en) 2009-08-26 2015-08-25 Asm America, Inc. High concentration water pulses for atomic layer deposition
US10876205B2 (en) 2016-09-30 2020-12-29 Asm Ip Holding B.V. Reactant vaporizer and related systems and methods
US11624113B2 (en) 2019-09-13 2023-04-11 Asm Ip Holding B.V. Heating zone separation for reactant evaporation system
US11634812B2 (en) 2018-08-16 2023-04-25 Asm Ip Holding B.V. Solid source sublimator
US11926894B2 (en) 2016-09-30 2024-03-12 Asm Ip Holding B.V. Reactant vaporizer and related systems and methods
US12054825B2 (en) 2021-06-22 2024-08-06 Applied Materials, Inc. Bottom fed sublimation bed for high saturation efficiency in semiconductor applications

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DE3702923A1 (en) * 1987-01-31 1988-08-11 Philips Patentverwaltung DEVICE FOR ENRICHING A CARRIER GAS WITH THE VAPOR OF A LITTLE VOLATILE FABRIC
DE3801147A1 (en) * 1988-01-16 1989-07-27 Philips Patentverwaltung DEVICE FOR GENERATING A GAS FLOW ENRICHED WITH THE VAPOR OF A LITTLE VOLATILE FABRIC
JPH0269389A (en) * 1988-08-31 1990-03-08 Toyo Stauffer Chem Co Formation of saturated vapor of solid organometallic compound in vapor growth method
DE3931189A1 (en) * 1989-09-19 1991-03-28 Philips Patentverwaltung Gas flow contg. vapour of low volatility powder for CVD - obtd. using device where process can be continuous and containers having little residual powder can be refilled without disturbing gas flow
JPH0513166U (en) * 1991-08-06 1993-02-23 ダイワ精工株式会社 Fishing reel fishing line stopper
DE19638100C1 (en) * 1996-09-18 1998-03-05 Fraunhofer Ges Forschung Apparatus to produce vaporous reaction product from solid particles
US7775508B2 (en) 2006-10-31 2010-08-17 Applied Materials, Inc. Ampoule for liquid draw and vapor draw with a continuous level sensor
US8343583B2 (en) 2008-07-10 2013-01-01 Asm International N.V. Method for vaporizing non-gaseous precursor in a fluidized bed
US8146896B2 (en) 2008-10-31 2012-04-03 Applied Materials, Inc. Chemical precursor ampoule for vapor deposition processes

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Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7851019B2 (en) 2002-06-17 2010-12-14 Asm International N.V. Method for controlling the sublimation of reactants
US8309173B2 (en) 2002-06-17 2012-11-13 Asm International N.V. System for controlling the sublimation of reactants
US7601225B2 (en) 2002-06-17 2009-10-13 Asm International N.V. System for controlling the sublimation of reactants
WO2004007793A3 (en) * 2002-07-17 2004-05-27 Applied Materials Inc Method and apparatus for providing gas to a processing chamber
US6905541B2 (en) 2002-07-17 2005-06-14 Applied Materials, Inc. Method and apparatus of generating PDMAT precursor
US7186385B2 (en) 2002-07-17 2007-03-06 Applied Materials, Inc. Apparatus for providing gas to a processing chamber
WO2004007793A2 (en) * 2002-07-17 2004-01-22 Applied Materials, Inc. Method and apparatus for providing gas to a processing chamber
US7122085B2 (en) 2002-07-30 2006-10-17 Asm America, Inc. Sublimation bed employing carrier gas guidance structures
US7971861B2 (en) 2003-09-29 2011-07-05 Asm International N.V. Safe liquid source containers
US7156380B2 (en) 2003-09-29 2007-01-02 Asm International, N.V. Safe liquid source containers
US7497420B2 (en) 2003-09-29 2009-03-03 Asm International, N.V. Safe liquid source containers
US9593416B2 (en) 2006-10-10 2017-03-14 Asm America, Inc. Precursor delivery system
US8137462B2 (en) 2006-10-10 2012-03-20 Asm America, Inc. Precursor delivery system
US7833353B2 (en) 2007-01-24 2010-11-16 Asm Japan K.K. Liquid material vaporization apparatus for semiconductor processing apparatus
US8012876B2 (en) 2008-12-02 2011-09-06 Asm International N.V. Delivery of vapor precursor from solid source
US9117773B2 (en) 2009-08-26 2015-08-25 Asm America, Inc. High concentration water pulses for atomic layer deposition
US10876205B2 (en) 2016-09-30 2020-12-29 Asm Ip Holding B.V. Reactant vaporizer and related systems and methods
US11377732B2 (en) 2016-09-30 2022-07-05 Asm Ip Holding B.V. Reactant vaporizer and related systems and methods
US11926894B2 (en) 2016-09-30 2024-03-12 Asm Ip Holding B.V. Reactant vaporizer and related systems and methods
US11634812B2 (en) 2018-08-16 2023-04-25 Asm Ip Holding B.V. Solid source sublimator
US11773486B2 (en) 2018-08-16 2023-10-03 Asm Ip Holding B.V. Solid source sublimator
US11624113B2 (en) 2019-09-13 2023-04-11 Asm Ip Holding B.V. Heating zone separation for reactant evaporation system
US12054825B2 (en) 2021-06-22 2024-08-06 Applied Materials, Inc. Bottom fed sublimation bed for high saturation efficiency in semiconductor applications

Also Published As

Publication number Publication date
FR2554131B1 (en) 1988-10-14
DE3339625C2 (en) 1991-01-31
JPS61110766A (en) 1986-05-29
GB2151662B (en) 1986-07-23
FR2554131A1 (en) 1985-05-03
JPH0530908B2 (en) 1993-05-11
DE3339625A1 (en) 1985-05-09
GB8427276D0 (en) 1984-12-05

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PCNP Patent ceased through non-payment of renewal fee

Effective date: 19951029