GB2148608B - Forming conductive regions in polymeric materials - Google Patents
Forming conductive regions in polymeric materialsInfo
- Publication number
- GB2148608B GB2148608B GB08328288A GB8328288A GB2148608B GB 2148608 B GB2148608 B GB 2148608B GB 08328288 A GB08328288 A GB 08328288A GB 8328288 A GB8328288 A GB 8328288A GB 2148608 B GB2148608 B GB 2148608B
- Authority
- GB
- United Kingdom
- Prior art keywords
- polymeric materials
- conductive regions
- forming conductive
- forming
- regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08328288A GB2148608B (en) | 1983-10-22 | 1983-10-22 | Forming conductive regions in polymeric materials |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08328288A GB2148608B (en) | 1983-10-22 | 1983-10-22 | Forming conductive regions in polymeric materials |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8328288D0 GB8328288D0 (en) | 1983-11-23 |
GB2148608A GB2148608A (en) | 1985-05-30 |
GB2148608B true GB2148608B (en) | 1987-03-18 |
Family
ID=10550595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08328288A Expired GB2148608B (en) | 1983-10-22 | 1983-10-22 | Forming conductive regions in polymeric materials |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2148608B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8728399D0 (en) * | 1987-12-04 | 1988-01-13 | Secretary Trade Ind Brit | Deposition of materials to substrates |
US5300208A (en) * | 1989-08-14 | 1994-04-05 | International Business Machines Corporation | Fabrication of printed circuit boards using conducting polymer |
CN100335968C (en) | 2000-05-04 | 2007-09-05 | 英国技术集团国际有限公司 | Nanostructures |
CN105899003B (en) | 2015-11-06 | 2019-11-26 | 武汉光谷创元电子有限公司 | Single layer board, multilayer circuit board and their manufacturing method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL281145A (en) * | 1961-05-08 |
-
1983
- 1983-10-22 GB GB08328288A patent/GB2148608B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB8328288D0 (en) | 1983-11-23 |
GB2148608A (en) | 1985-05-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |