GB2122809B - Integrated circuit interconnection bus structure - Google Patents

Integrated circuit interconnection bus structure

Info

Publication number
GB2122809B
GB2122809B GB8215942A GB8215942A GB2122809B GB 2122809 B GB2122809 B GB 2122809B GB 8215942 A GB8215942 A GB 8215942A GB 8215942 A GB8215942 A GB 8215942A GB 2122809 B GB2122809 B GB 2122809B
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
bus structure
interconnection bus
circuit interconnection
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8215942A
Other versions
GB2122809A (en
Inventor
Dennis John Rogers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB8215942A priority Critical patent/GB2122809B/en
Publication of GB2122809A publication Critical patent/GB2122809A/en
Application granted granted Critical
Publication of GB2122809B publication Critical patent/GB2122809B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
GB8215942A 1982-06-01 1982-06-01 Integrated circuit interconnection bus structure Expired GB2122809B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8215942A GB2122809B (en) 1982-06-01 1982-06-01 Integrated circuit interconnection bus structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8215942A GB2122809B (en) 1982-06-01 1982-06-01 Integrated circuit interconnection bus structure

Publications (2)

Publication Number Publication Date
GB2122809A GB2122809A (en) 1984-01-18
GB2122809B true GB2122809B (en) 1985-10-02

Family

ID=10530770

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8215942A Expired GB2122809B (en) 1982-06-01 1982-06-01 Integrated circuit interconnection bus structure

Country Status (1)

Country Link
GB (1) GB2122809B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH061313B2 (en) * 1985-02-06 1994-01-05 シャープ株式会社 Liquid crystal display
JPH0693480B2 (en) * 1985-03-29 1994-11-16 株式会社東芝 Semiconductor integrated circuit device
JPS63102342A (en) * 1986-10-20 1988-05-07 Mitsubishi Electric Corp Wiring structure of semiconductor integrated circuit device
DE68929068T2 (en) * 1988-04-22 1999-12-23 Fujitsu Ltd., Kawasaki Integrated semiconductor circuit arrangement of the "Masterslice" type
US5315130A (en) * 1990-03-30 1994-05-24 Tactical Fabs, Inc. Very high density wafer scale device architecture
US5252507A (en) * 1990-03-30 1993-10-12 Tactical Fabs, Inc. Very high density wafer scale device architecture

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1468346A (en) * 1973-02-28 1977-03-23 Mullard Ltd Devices having conductive tracks at different levels with interconnections therebetween

Also Published As

Publication number Publication date
GB2122809A (en) 1984-01-18

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee