GB2000909A - Solid-state integrated circuits - Google Patents

Solid-state integrated circuits

Info

Publication number
GB2000909A
GB2000909A GB7829205A GB7829205A GB2000909A GB 2000909 A GB2000909 A GB 2000909A GB 7829205 A GB7829205 A GB 7829205A GB 7829205 A GB7829205 A GB 7829205A GB 2000909 A GB2000909 A GB 2000909A
Authority
GB
United Kingdom
Prior art keywords
plates
substratum
circuits
chips
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB7829205A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NUMERIK KARL MARX VEB
Original Assignee
NUMERIK KARL MARX VEB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NUMERIK KARL MARX VEB filed Critical NUMERIK KARL MARX VEB
Publication of GB2000909A publication Critical patent/GB2000909A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Abstract

To produce an arrangement of plane or three-dimensional solid-state circuits of high integration from substratum plates and chips connected therewith, the unstructured or structured substratum plates (1) carry part circuits and function as carriers for implanted chips ofthe same thickness and the same material as the substratum plates, and the electric connection of the chips (2) with one another and into three-dimensional circuits is carried out without using wires or contact members. These highly integrated plates are stacked into three-dimensional multi-plane systems. <IMAGE>
GB7829205A 1977-07-07 1978-07-07 Solid-state integrated circuits Withdrawn GB2000909A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD19992777 1977-07-07

Publications (1)

Publication Number Publication Date
GB2000909A true GB2000909A (en) 1979-01-17

Family

ID=5509034

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7829205A Withdrawn GB2000909A (en) 1977-07-07 1978-07-07 Solid-state integrated circuits

Country Status (3)

Country Link
DE (1) DE2825661A1 (en)
FR (1) FR2397068A1 (en)
GB (1) GB2000909A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0149317A2 (en) * 1984-01-13 1985-07-24 Stc Plc Circuit packaging
US5847448A (en) * 1990-12-11 1998-12-08 Thomson-Csf Method and device for interconnecting integrated circuits in three dimensions

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0149317A2 (en) * 1984-01-13 1985-07-24 Stc Plc Circuit packaging
GB2153144A (en) * 1984-01-13 1985-08-14 Standard Telephones Cables Ltd Circuit packaging
EP0149317A3 (en) * 1984-01-13 1987-01-21 Stc Plc Circuit packaging
US5847448A (en) * 1990-12-11 1998-12-08 Thomson-Csf Method and device for interconnecting integrated circuits in three dimensions

Also Published As

Publication number Publication date
FR2397068A1 (en) 1979-02-02
DE2825661A1 (en) 1979-01-25

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)