GB1604004A - Method and apparatus for processing semi-conductor wafers - Google Patents

Method and apparatus for processing semi-conductor wafers Download PDF

Info

Publication number
GB1604004A
GB1604004A GB2439178A GB2439178A GB1604004A GB 1604004 A GB1604004 A GB 1604004A GB 2439178 A GB2439178 A GB 2439178A GB 2439178 A GB2439178 A GB 2439178A GB 1604004 A GB1604004 A GB 1604004A
Authority
GB
United Kingdom
Prior art keywords
wafer
electron beam
holder
layer
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2439178A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of GB1604004A publication Critical patent/GB1604004A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0277—Electrolithographic processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electron Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GB2439178A 1977-10-11 1978-05-30 Method and apparatus for processing semi-conductor wafers Expired GB1604004A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US84067477A 1977-10-11 1977-10-11

Publications (1)

Publication Number Publication Date
GB1604004A true GB1604004A (en) 1981-12-02

Family

ID=25282934

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2439178A Expired GB1604004A (en) 1977-10-11 1978-05-30 Method and apparatus for processing semi-conductor wafers

Country Status (6)

Country Link
JP (1) JPS5464477A (enrdf_load_stackoverflow)
CA (1) CA1118535A (enrdf_load_stackoverflow)
DE (1) DE2843310C2 (enrdf_load_stackoverflow)
FR (1) FR2406304A1 (enrdf_load_stackoverflow)
GB (1) GB1604004A (enrdf_load_stackoverflow)
NL (1) NL7810167A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7038204B2 (en) 2004-05-26 2006-05-02 International Business Machines Corporation Method for reducing proximity effects in electron beam lithography

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55162004A (en) * 1979-06-06 1980-12-17 Toshiba Corp Electric charge corpuscular ray irradiation unit
US4323638A (en) * 1980-08-18 1982-04-06 Bell Telephone Laboratories, Incorporated Reducing charging effects in charged-particle-beam lithography
JPS5744543U (enrdf_load_stackoverflow) * 1980-08-27 1982-03-11

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3390012A (en) * 1964-05-14 1968-06-25 Texas Instruments Inc Method of making dielectric bodies having conducting portions
DE1800212A1 (de) * 1968-10-01 1970-05-06 Telefunken Patent Verfahren zum Herstellen einer Halbleiteranordnung
DE1800193A1 (de) * 1968-10-01 1970-05-14 Telefunken Patent Verfahren zum Herstellen von Kontakten
US3710101A (en) * 1970-10-06 1973-01-09 Westinghouse Electric Corp Apparatus and method for alignment of members to electron beams
JPS5183788A (en) * 1974-12-12 1976-07-22 Du Pont Daioodo oyobi kanrendodenrookeiseisurukozotai

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7038204B2 (en) 2004-05-26 2006-05-02 International Business Machines Corporation Method for reducing proximity effects in electron beam lithography

Also Published As

Publication number Publication date
FR2406304B1 (enrdf_load_stackoverflow) 1983-01-07
JPS5464477A (en) 1979-05-24
CA1118535A (en) 1982-02-16
NL7810167A (nl) 1979-04-17
FR2406304A1 (fr) 1979-05-11
DE2843310C2 (de) 1983-06-01
DE2843310A1 (de) 1979-04-19
JPS6129534B2 (enrdf_load_stackoverflow) 1986-07-07

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930530