GB1556546A - Wave soldering device - Google Patents

Wave soldering device

Info

Publication number
GB1556546A
GB1556546A GB06674/77A GB667477A GB1556546A GB 1556546 A GB1556546 A GB 1556546A GB 06674/77 A GB06674/77 A GB 06674/77A GB 667477 A GB667477 A GB 667477A GB 1556546 A GB1556546 A GB 1556546A
Authority
GB
United Kingdom
Prior art keywords
solder
nozzle
tub
collecting vessel
baffle plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB06674/77A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dr K Schleuniger and Co
Original Assignee
Dr K Schleuniger and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dr K Schleuniger and Co filed Critical Dr K Schleuniger and Co
Publication of GB1556546A publication Critical patent/GB1556546A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB06674/77A 1976-02-20 1977-02-17 Wave soldering device Expired GB1556546A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH207776A CH607622A5 (en) 1976-02-20 1976-02-20 Wave-soldering apparatus

Publications (1)

Publication Number Publication Date
GB1556546A true GB1556546A (en) 1979-11-28

Family

ID=4225358

Family Applications (1)

Application Number Title Priority Date Filing Date
GB06674/77A Expired GB1556546A (en) 1976-02-20 1977-02-17 Wave soldering device

Country Status (5)

Country Link
JP (1) JPS52102860A (enrdf_load_stackoverflow)
CH (1) CH607622A5 (enrdf_load_stackoverflow)
DE (1) DE2619342C3 (enrdf_load_stackoverflow)
FR (1) FR2341393A1 (enrdf_load_stackoverflow)
GB (1) GB1556546A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2146564A (en) * 1983-09-09 1985-04-24 Dolphin Machinery Soldering apparatus
US4724994A (en) * 1984-11-15 1988-02-16 Karl Flury Wave-soldering device
WO1995019864A1 (en) * 1994-01-19 1995-07-27 Electrovert Ltd. Gas shrouded solder wave with reduced solder splatter
CN119566452A (zh) * 2024-10-31 2025-03-07 昆山柏特电子有限公司 一种用于波峰焊的焊锡喷口结构及焊接系统

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2856460C3 (de) * 1978-12-28 1982-02-11 Gebr. Schmid GmbH & Co, 7290 Freudenstadt Vorrichtung zum Aufbringen einer Lotschicht auf eine Leiterplatte
CH660145A5 (de) * 1983-07-15 1987-03-31 Landis & Gyr Ag Verfahren zum schutz der oberflaeche eines loetbads.
DE3339887A1 (de) * 1983-11-04 1985-05-15 Klaus 6107 Reinheim Obermann Vorrichtung zum verzinnen von leiterplatten
EP0147000A1 (en) * 1983-12-15 1985-07-03 Hollis Automation Inc. Mass wave soldering system I
US4566624A (en) * 1983-12-16 1986-01-28 Hollis Automation, Inc. Mass wave soldering system
DE4041272C2 (de) * 1990-12-21 1996-12-05 Siemens Ag Wellenlötvorrichtung
JP3187849B2 (ja) * 1991-01-28 2001-07-16 ソニー株式会社 噴流はんだ槽
US5961285A (en) * 1996-06-19 1999-10-05 Ak Steel Corporation Method and apparatus for removing bottom dross from molten zinc during galvannealing or galvanizing
DE102006032051B4 (de) * 2006-07-10 2022-11-24 Endress+Hauser SE+Co. KG Wellenlötanlage zum Löten elektronischer Bauteile auf einer Leiterplatte
DE102007053857A1 (de) 2007-11-09 2009-05-14 Endress + Hauser Gmbh + Co. Kg Verfahren zum Betrieb einer Wellenlötanlage

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3726007A (en) * 1971-02-02 1973-04-10 Martin Marietta Corp Component side printed circuit soldering

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2146564A (en) * 1983-09-09 1985-04-24 Dolphin Machinery Soldering apparatus
US4651916A (en) * 1983-09-09 1987-03-24 Dolphin Machinery Limited Soldering apparatus
US4724994A (en) * 1984-11-15 1988-02-16 Karl Flury Wave-soldering device
WO1995019864A1 (en) * 1994-01-19 1995-07-27 Electrovert Ltd. Gas shrouded solder wave with reduced solder splatter
CN119566452A (zh) * 2024-10-31 2025-03-07 昆山柏特电子有限公司 一种用于波峰焊的焊锡喷口结构及焊接系统

Also Published As

Publication number Publication date
DE2619342B2 (de) 1978-09-14
FR2341393B1 (enrdf_load_stackoverflow) 1982-05-28
FR2341393A1 (fr) 1977-09-16
DE2619342C3 (de) 1979-05-03
JPS52102860A (en) 1977-08-29
DE2619342A1 (de) 1977-08-25
CH607622A5 (en) 1978-09-29

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee