GB1439365A - Heat sink assemblies - Google Patents
Heat sink assembliesInfo
- Publication number
- GB1439365A GB1439365A GB2955373A GB2955373A GB1439365A GB 1439365 A GB1439365 A GB 1439365A GB 2955373 A GB2955373 A GB 2955373A GB 2955373 A GB2955373 A GB 2955373A GB 1439365 A GB1439365 A GB 1439365A
- Authority
- GB
- United Kingdom
- Prior art keywords
- bars
- box
- sheet metal
- members
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
1439365 Heat sinks; electric component assemblies ROBAND ELECTRONICS Ltd 21 June 1973 29553/73 Headings H1K and H1R A heat sink assembly comprises a metal member thermally coupled to a heat dissipating electrical or electronic component, e.g. a transistor mounted on it and at least one sheet metal heat dissipating member of rectangular outline releasably secured to it with one edge engaging a rectilinear groove therein and another edge engaging a similar groove in the same or in another member. In the Fig. 1 arrangement sheet metal members 4 engage opposed grooves in members 1, 5 and a printed circuit board 3 is attached to portions 1a, 5a of the members and electrically contacts pins 2a extending from transistor 2 mounted on portion la, the assembly being held together by the nut and bolt on which spacers 7, 8 are threaded. A modified assembly comprises a member similar to 1 carrying the transistor and a channel form member the opposed edges of which fit into grooves 1c where they are held by grub screws. Another assembly of box form consists of four metal bars arranged at the corners of a rectangle and joined by sheet metal members constituting walls of the box. The sheet forming the bottom of the box carries the components and is bolted to or formed integral with two of the bars, three other sheets, which may carry switches and other controls, have flanged edges which engage grooves in the bars and are clamped thereto by screws, and_optional sheet metal members which may be perforated and form the ends of the box are screwed to the end faces of the bars.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2955373A GB1439365A (en) | 1973-06-21 | 1973-06-21 | Heat sink assemblies |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2955373A GB1439365A (en) | 1973-06-21 | 1973-06-21 | Heat sink assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1439365A true GB1439365A (en) | 1976-06-16 |
Family
ID=10293368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2955373A Expired GB1439365A (en) | 1973-06-21 | 1973-06-21 | Heat sink assemblies |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1439365A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2487629A1 (en) * | 1980-07-24 | 1982-01-29 | Westinghouse Electric Corp | PACKED SEMICONDUCTOR POWER CONTROL DEVICE WITH SEPARATE MOUNTING OF POWER SWITCHING DEVICE, AND ASSEMBLY METHOD |
US4974317A (en) * | 1988-09-12 | 1990-12-04 | Westinghouse Electric Corp. | Method of making for RF line replacable modules |
-
1973
- 1973-06-21 GB GB2955373A patent/GB1439365A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2487629A1 (en) * | 1980-07-24 | 1982-01-29 | Westinghouse Electric Corp | PACKED SEMICONDUCTOR POWER CONTROL DEVICE WITH SEPARATE MOUNTING OF POWER SWITCHING DEVICE, AND ASSEMBLY METHOD |
US4974317A (en) * | 1988-09-12 | 1990-12-04 | Westinghouse Electric Corp. | Method of making for RF line replacable modules |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |