GB1435208A - Electrodepositing copper-nickel alloys - Google Patents
Electrodepositing copper-nickel alloysInfo
- Publication number
- GB1435208A GB1435208A GB3719573A GB3719573A GB1435208A GB 1435208 A GB1435208 A GB 1435208A GB 3719573 A GB3719573 A GB 3719573A GB 3719573 A GB3719573 A GB 3719573A GB 1435208 A GB1435208 A GB 1435208A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- nickel
- voltage
- phase
- fluoborate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910045601 alloy Inorganic materials 0.000 title abstract 3
- 239000000956 alloy Substances 0.000 title abstract 3
- 229910000570 Cupronickel Inorganic materials 0.000 title abstract 2
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 title abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 6
- 229910052759 nickel Inorganic materials 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 229910002482 Cu–Ni Inorganic materials 0.000 abstract 1
- -1 as nickel fluoborate Chemical compound 0.000 abstract 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 abstract 1
- 239000004327 boric acid Substances 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 abstract 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 239000003792 electrolyte Substances 0.000 abstract 1
- HFQQZARZPUDIFP-UHFFFAOYSA-M sodium;2-dodecylbenzenesulfonate Chemical compound [Na+].CCCCCCCCCCCCC1=CC=CC=C1S([O-])(=O)=O HFQQZARZPUDIFP-UHFFFAOYSA-M 0.000 abstract 1
- 239000000080 wetting agent Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00316278A US3833481A (en) | 1972-12-18 | 1972-12-18 | Electroforming nickel copper alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1435208A true GB1435208A (en) | 1976-05-12 |
Family
ID=23228346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3719573A Expired GB1435208A (en) | 1972-12-18 | 1973-08-06 | Electrodepositing copper-nickel alloys |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3833481A (https=) |
| JP (1) | JPS4990234A (https=) |
| BE (1) | BE804107A (https=) |
| CA (1) | CA1019274A (https=) |
| DE (1) | DE2359924A1 (https=) |
| GB (1) | GB1435208A (https=) |
| IT (1) | IT995341B (https=) |
| NL (1) | NL7310599A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109252066A (zh) * | 2017-07-12 | 2019-01-22 | 钟表制作有限公司 | 由无磁性二元CuNi合金形成的钟表部件 |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IL76592A (en) * | 1985-10-06 | 1989-03-31 | Technion Res & Dev Foundation | Method for electrodeposition of at least two metals from a single solution |
| JP2670867B2 (ja) * | 1989-10-14 | 1997-10-29 | 同和鉱業株式会社 | アルミニウム合金素材のメッキ処理法 |
| MY111621A (en) * | 1993-12-16 | 2000-09-27 | Kiyokawa Plating Ind Co Ltd | Method for producing metal film resistor |
| TW317575B (https=) * | 1994-01-21 | 1997-10-11 | Olin Corp | |
| US5916695A (en) * | 1995-12-18 | 1999-06-29 | Olin Corporation | Tin coated electrical connector |
| US5780172A (en) * | 1995-12-18 | 1998-07-14 | Olin Corporation | Tin coated electrical connector |
| US6083633A (en) * | 1997-06-16 | 2000-07-04 | Olin Corporation | Multi-layer diffusion barrier for a tin coated electrical connector |
| US6547946B2 (en) * | 2000-04-10 | 2003-04-15 | The Regents Of The University Of California | Processing a printed wiring board by single bath electrodeposition |
| US6759142B2 (en) | 2001-07-31 | 2004-07-06 | Kobe Steel Ltd. | Plated copper alloy material and process for production thereof |
| US6992389B2 (en) * | 2004-04-28 | 2006-01-31 | International Business Machines Corporation | Barrier for interconnect and method |
| CN102393409A (zh) * | 2011-07-14 | 2012-03-28 | 徐志花 | 新型高效用于硝基苯检测的NiCu/Cu电化学传感器及其制备方法 |
| KR101649435B1 (ko) | 2012-04-19 | 2016-08-19 | 딥솔 가부시키가이샤 | 구리-니켈 합금 전기 도금 욕 및 도금 방법 |
| CN103484904A (zh) * | 2013-10-08 | 2014-01-01 | 昆山纯柏精密五金有限公司 | 一种铁基五金件的镀铜工艺 |
| JP6439172B2 (ja) | 2014-08-08 | 2018-12-19 | ディップソール株式会社 | 銅−ニッケル合金電気めっき浴 |
| CN113774442B (zh) * | 2021-09-23 | 2023-02-17 | 中冶赛迪技术研究中心有限公司 | 一种基于内生析出法的纳米复合镀层及其制备工艺 |
| CN115233265A (zh) * | 2022-08-18 | 2022-10-25 | 广东工业大学 | 一种提高电镀铜镍合金耐蚀性的方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1969553A (en) * | 1934-08-07 | Electrolyte for the deposition of | ||
| US1750092A (en) * | 1921-11-26 | 1930-03-11 | Crawford Robert Brace Penn | Electroplating process |
| DE576585C (de) * | 1931-05-13 | 1933-05-13 | Julius Winkler Jr | Verfahren zur Herstellung legierter galvanischer Niederschlaege |
| US2575712A (en) * | 1945-09-29 | 1951-11-20 | Westinghouse Electric Corp | Electroplating |
| US2951978A (en) * | 1957-05-29 | 1960-09-06 | Thor P Ulvestad | Reverse pulse generator |
| GB957808A (en) * | 1962-02-09 | 1964-05-13 | Ass Elect Ind | Electrodeposition of copper-nickel alloy |
-
1972
- 1972-12-18 US US00316278A patent/US3833481A/en not_active Expired - Lifetime
-
1973
- 1973-07-23 CA CA177,063A patent/CA1019274A/en not_active Expired
- 1973-07-31 NL NL7310599A patent/NL7310599A/xx not_active Application Discontinuation
- 1973-08-06 GB GB3719573A patent/GB1435208A/en not_active Expired
- 1973-08-28 BE BE135013A patent/BE804107A/xx unknown
- 1973-09-12 IT IT28841/73A patent/IT995341B/it active
- 1973-10-25 JP JP48119487A patent/JPS4990234A/ja active Pending
- 1973-12-01 DE DE2359924A patent/DE2359924A1/de not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109252066A (zh) * | 2017-07-12 | 2019-01-22 | 钟表制作有限公司 | 由无磁性二元CuNi合金形成的钟表部件 |
Also Published As
| Publication number | Publication date |
|---|---|
| NL7310599A (https=) | 1974-06-20 |
| BE804107A (nl) | 1973-12-17 |
| IT995341B (it) | 1975-11-10 |
| US3833481A (en) | 1974-09-03 |
| CA1019274A (en) | 1977-10-18 |
| DE2359924A1 (de) | 1974-06-20 |
| JPS4990234A (https=) | 1974-08-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |