GB1419163A - Electronic circuit assemblies - Google Patents

Electronic circuit assemblies

Info

Publication number
GB1419163A
GB1419163A GB1780673A GB1780673A GB1419163A GB 1419163 A GB1419163 A GB 1419163A GB 1780673 A GB1780673 A GB 1780673A GB 1780673 A GB1780673 A GB 1780673A GB 1419163 A GB1419163 A GB 1419163A
Authority
GB
United Kingdom
Prior art keywords
electronic circuit
microcircuit
bonded
novolac
circuit assemblies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1780673A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1419163A publication Critical patent/GB1419163A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Die Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
GB1780673A 1972-05-31 1973-04-13 Electronic circuit assemblies Expired GB1419163A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25816772A 1972-05-31 1972-05-31

Publications (1)

Publication Number Publication Date
GB1419163A true GB1419163A (en) 1975-12-24

Family

ID=22979383

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1780673A Expired GB1419163A (en) 1972-05-31 1973-04-13 Electronic circuit assemblies

Country Status (5)

Country Link
JP (1) JPS521738B2 (https=)
DE (1) DE2315714A1 (https=)
FR (1) FR2186732A1 (https=)
GB (1) GB1419163A (https=)
IT (1) IT981202B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0064854A1 (en) * 1981-05-06 1982-11-17 Itt Industries, Inc. Component assembly including a rigid substrate
GB2136205A (en) * 1983-03-09 1984-09-12 Printed Circuits Int Semiconductor chip carrier and contact array package and method of construction

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584842B2 (ja) * 1975-01-06 1983-01-28 日本電信電話株式会社 機械「ろ」波器用変換子の製造方法
JPS5321771A (en) * 1976-08-11 1978-02-28 Sharp Kk Electronic parts mounting structure
JPS5491178A (en) * 1977-12-28 1979-07-19 Fujitsu Ltd Mounting method of semiconductor device
JPS5491180A (en) * 1977-12-28 1979-07-19 Fujitsu Ltd Mounting method of semiconductor device
JPS54121673A (en) * 1978-03-15 1979-09-20 Hitachi Ltd Insulator coating material and semiconductor device using the said material
JPS5582125A (en) * 1978-12-19 1980-06-20 Dainippon Toryo Co Ltd Preparation of resin particle

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0064854A1 (en) * 1981-05-06 1982-11-17 Itt Industries, Inc. Component assembly including a rigid substrate
GB2136205A (en) * 1983-03-09 1984-09-12 Printed Circuits Int Semiconductor chip carrier and contact array package and method of construction
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink

Also Published As

Publication number Publication date
FR2186732A1 (https=) 1974-01-11
IT981202B (it) 1974-10-10
JPS4931747A (https=) 1974-03-22
DE2315714A1 (de) 1973-12-20
JPS521738B2 (https=) 1977-01-18

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee