GB1352317A - Method of making semi-conductor mounts - Google Patents

Method of making semi-conductor mounts

Info

Publication number
GB1352317A
GB1352317A GB1352317DA GB1352317A GB 1352317 A GB1352317 A GB 1352317A GB 1352317D A GB1352317D A GB 1352317DA GB 1352317 A GB1352317 A GB 1352317A
Authority
GB
United Kingdom
Prior art keywords
mount
shaped part
copper
blank
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GKN Floform Ltd
Original Assignee
GKN Floform Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GKN Floform Ltd filed Critical GKN Floform Ltd
Publication of GB1352317A publication Critical patent/GB1352317A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Forging (AREA)
GB1352317D 1970-03-06 1970-03-06 Method of making semi-conductor mounts Expired GB1352317A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1092970 1970-03-06

Publications (1)

Publication Number Publication Date
GB1352317A true GB1352317A (en) 1974-05-08

Family

ID=9976921

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1352317D Expired GB1352317A (en) 1970-03-06 1970-03-06 Method of making semi-conductor mounts

Country Status (2)

Country Link
FR (1) FR2081746B1 (enrdf_load_stackoverflow)
GB (1) GB1352317A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2700466A1 (de) * 1976-01-08 1977-08-18 Gkn Floform Ltd Verfahren zur herstellung einer halterung fuer halbleiterbauelemente

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3436805A (en) * 1965-08-09 1969-04-08 North American Rockwell Method of joining aluminum and ferrous members

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2700466A1 (de) * 1976-01-08 1977-08-18 Gkn Floform Ltd Verfahren zur herstellung einer halterung fuer halbleiterbauelemente

Also Published As

Publication number Publication date
FR2081746B1 (enrdf_load_stackoverflow) 1976-10-29
DE2109845B2 (de) 1977-02-24
FR2081746A1 (enrdf_load_stackoverflow) 1971-12-10
DE2109845A1 (de) 1971-09-23

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee