GB1277254A - Hermetically sealed package for use in electronic components - Google Patents

Hermetically sealed package for use in electronic components

Info

Publication number
GB1277254A
GB1277254A GB50245/69A GB5024569A GB1277254A GB 1277254 A GB1277254 A GB 1277254A GB 50245/69 A GB50245/69 A GB 50245/69A GB 5024569 A GB5024569 A GB 5024569A GB 1277254 A GB1277254 A GB 1277254A
Authority
GB
United Kingdom
Prior art keywords
metal
layers
bodies
sealed package
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB50245/69A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB1277254A publication Critical patent/GB1277254A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Thermistors And Varistors (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
GB50245/69A 1968-10-21 1969-10-13 Hermetically sealed package for use in electronic components Expired GB1277254A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP43076079A JPS5128829B1 (https=) 1968-10-21 1968-10-21

Publications (1)

Publication Number Publication Date
GB1277254A true GB1277254A (en) 1972-06-07

Family

ID=13594790

Family Applications (1)

Application Number Title Priority Date Filing Date
GB50245/69A Expired GB1277254A (en) 1968-10-21 1969-10-13 Hermetically sealed package for use in electronic components

Country Status (4)

Country Link
JP (1) JPS5128829B1 (https=)
DE (1) DE1952789C3 (https=)
FR (1) FR2023323A1 (https=)
GB (1) GB1277254A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4320438A (en) 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
GB2132411A (en) * 1982-11-12 1984-07-04 Hitachi Ltd Improvements in substrate structures
GB2209867A (en) * 1987-09-16 1989-05-24 Advanced Semiconductor Package Integrated circuit chip carrier
DE19548050A1 (de) * 1995-12-21 1997-06-26 Siemens Matsushita Components Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement -
CN113937067A (zh) * 2021-09-23 2022-01-14 中国电子科技集团公司第十三研究所 磁电阻随机存储器及其封装外壳和制备方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5615059U (https=) * 1979-07-11 1981-02-09
JPS5651846A (en) * 1979-10-04 1981-05-09 Fujitsu Ltd Ic package
DE3125360A1 (de) * 1981-06-27 1983-01-13 Robert Bosch Gmbh, 7000 Stuttgart "elektronisches bauelement"
DE3147790A1 (de) * 1981-12-03 1983-06-09 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungsmodul und verfahren zu seiner herstellung
DE3147789A1 (de) * 1981-12-03 1983-06-09 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungsmodul und verfahren zu seiner herstellung
US4750092A (en) * 1985-11-20 1988-06-07 Kollmorgen Technologies Corporation Interconnection package suitable for electronic devices and methods for producing same
DE3703280A1 (de) * 1987-02-04 1988-08-18 Licentia Gmbh Schaltungsanordnung mit einem oder mehreren integrierten schaltkreisen
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4320438A (en) 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
GB2132411A (en) * 1982-11-12 1984-07-04 Hitachi Ltd Improvements in substrate structures
GB2209867A (en) * 1987-09-16 1989-05-24 Advanced Semiconductor Package Integrated circuit chip carrier
GB2209867B (en) * 1987-09-16 1990-12-19 Advanced Semiconductor Package Method of forming an integrated circuit chip carrier
DE19548050A1 (de) * 1995-12-21 1997-06-26 Siemens Matsushita Components Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement -
CN113937067A (zh) * 2021-09-23 2022-01-14 中国电子科技集团公司第十三研究所 磁电阻随机存储器及其封装外壳和制备方法

Also Published As

Publication number Publication date
JPS5128829B1 (https=) 1976-08-21
DE1952789A1 (de) 1970-04-30
FR2023323A1 (https=) 1970-08-21
DE1952789B2 (de) 1971-09-30
DE1952789C3 (de) 1974-04-18

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees