GB1259249A - - Google Patents

Info

Publication number
GB1259249A
GB1259249A GB1259249DA GB1259249A GB 1259249 A GB1259249 A GB 1259249A GB 1259249D A GB1259249D A GB 1259249DA GB 1259249 A GB1259249 A GB 1259249A
Authority
GB
United Kingdom
Prior art keywords
grid
slot
crystal
slots
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691931335 external-priority patent/DE1931335C3/de
Application filed filed Critical
Publication of GB1259249A publication Critical patent/GB1259249A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
    • B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
GB1259249D 1969-06-20 1970-06-19 Expired GB1259249A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691931335 DE1931335C3 (de) 1969-06-20 Verfahren zum Abtrennen eines Körpers von einem scheibenförmigen Kristall und Vorrichtung zur Durchführung dieses Verfahrens

Publications (1)

Publication Number Publication Date
GB1259249A true GB1259249A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-01-05

Family

ID=5737534

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1259249D Expired GB1259249A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1969-06-20 1970-06-19

Country Status (9)

Country Link
US (1) US3694972A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5013510B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AT (1) AT315241B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CH (1) CH504783A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2046967B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1259249A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL (1) NL7008966A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
SE (1) SE351523B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
ZA (1) ZA704234B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2570636A1 (fr) * 1984-09-27 1986-03-28 Libbey Owens Ford Co Appareil et procede pour supporter une feuille dans une installation de decoupe par jet de fluide
FR2570637A1 (fr) * 1984-09-27 1986-03-28 Libbey Owens Ford Co Procede de decoupe de verre de diverses epaisseurs
FR2570638A1 (fr) * 1984-09-27 1986-03-28 Libbey Owens Ford Co Procede de decoupe par jet de fluide abrasif d'une feuille de verre renforce

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3778935A (en) * 1972-01-26 1973-12-18 Pennwalt Corp Abrading apparatus with rotary index table
CH566643A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-10-11 1975-09-15 Bbc Brown Boveri & Cie
US3888054A (en) * 1973-11-16 1975-06-10 Western Electric Co Method for abrasive cutting in a liquid
US3866357A (en) * 1974-06-06 1975-02-18 Pennwalt Corp Abrading apparatus
DE2522346C3 (de) * 1975-05-20 1978-10-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen von Halbleiterbauelementen
JPS61159371A (ja) * 1984-12-28 1986-07-19 Fuji Seiki Seizosho:Kk Ｉｃの基板用シリコンウェーハのブラスト装置
US5052155A (en) * 1989-08-10 1991-10-01 Emc Technology, Inc. Apparatus for the treatment of articles by high velocity impacting thereof with a particulate abrasive material
DE4235091C2 (de) * 1992-10-17 2001-09-06 Trumpf Sachsen Gmbh Flüssigkeits- und Abrasivmittelzuführung für eine Fluidstrahlschneidanlage
US6705925B1 (en) * 2000-10-20 2004-03-16 Lightwave Microsystems Apparatus and method to dice integrated circuits from a wafer using a pressurized jet
CN1703774A (zh) * 2002-09-13 2005-11-30 东和－英特康科技公司 基片的喷射分割
EP1873824B1 (en) * 2002-09-13 2009-03-11 Towa-Intercon Technology, Inc. Jet singulation of a substrate
US7153186B2 (en) * 2002-09-13 2006-12-26 Towa Intercon Technology, Inc. Jet singulation
DE10337920B4 (de) * 2003-08-18 2008-08-28 Schott Ag Verfahren zur Herstellung einer Mehrzahl von Bauteilen und Zwischenprodukt in Form eines Schichtverbundes
US20060180579A1 (en) * 2005-02-11 2006-08-17 Towa Intercon Technology, Inc. Multidirectional cutting chuck
JP4791787B2 (ja) * 2005-09-22 2011-10-12 Ｔｏｗａ株式会社 アブレイシブウォータジェットを使用した切断装置
JP2008284635A (ja) * 2007-05-16 2008-11-27 Disco Abrasive Syst Ltd ウォータジェット加工方法
JP2008307639A (ja) * 2007-06-14 2008-12-25 Disco Abrasive Syst Ltd ウォータジェット加工方法
JP6022862B2 (ja) * 2012-05-08 2016-11-09 株式会社不二製作所 硬質脆性基板の切り出し方法及び切り出し装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US587892A (en) * 1897-08-10 M a t iiia s w a l t e k
US1664159A (en) * 1926-04-23 1928-03-27 Elroy A Chase Apparatus for producing ornamental background on stone
GB794528A (en) * 1955-10-07 1958-05-07 William Howard Mead Improvements in receivers for particulate material
US3205104A (en) * 1961-07-10 1965-09-07 Litton Industries Inc Fabrication of interdigital delay lines
US3187412A (en) * 1963-04-26 1965-06-08 Gen Electric Method of mounting and aligning transducers on delay lines
US3262234A (en) * 1963-10-04 1966-07-26 Int Rectifier Corp Method of forming a semiconductor rim by sandblasting
US3453781A (en) * 1966-03-30 1969-07-08 Ibm Tailoring microminiature components
US3516204A (en) * 1967-08-21 1970-06-23 Pennwalt Corp Abrading apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2570636A1 (fr) * 1984-09-27 1986-03-28 Libbey Owens Ford Co Appareil et procede pour supporter une feuille dans une installation de decoupe par jet de fluide
FR2570637A1 (fr) * 1984-09-27 1986-03-28 Libbey Owens Ford Co Procede de decoupe de verre de diverses epaisseurs
FR2570638A1 (fr) * 1984-09-27 1986-03-28 Libbey Owens Ford Co Procede de decoupe par jet de fluide abrasif d'une feuille de verre renforce
GB2164879A (en) * 1984-09-27 1986-04-03 Libbey Owens Ford Co Ultra-high pressure abrasive jet cutting of glass

Also Published As

Publication number Publication date
DE1931335B2 (de) 1976-03-11
AT315241B (de) 1974-05-10
FR2046967B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-09-20
CH504783A (de) 1971-03-15
FR2046967A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1971-03-12
DE1931335A1 (de) 1970-12-23
ZA704234B (en) 1971-03-31
US3694972A (en) 1972-10-03
SE351523B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-11-27
JPS5013510B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1975-05-20
NL7008966A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1970-12-22

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees