GB0922363D0 - Cleaning the stack of float wafer - Google Patents

Cleaning the stack of float wafer

Info

Publication number
GB0922363D0
GB0922363D0 GB0922363A GB0922363A GB0922363D0 GB 0922363 D0 GB0922363 D0 GB 0922363D0 GB 0922363 A GB0922363 A GB 0922363A GB 0922363 A GB0922363 A GB 0922363A GB 0922363 D0 GB0922363 D0 GB 0922363D0
Authority
GB
United Kingdom
Prior art keywords
float
wafer
stack
cleaning
float wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0922363A
Other versions
GB2476315A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REC Wafer Norway AS
Original Assignee
REC Wafer Norway AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by REC Wafer Norway AS filed Critical REC Wafer Norway AS
Priority to GB0922363A priority Critical patent/GB2476315A/en
Publication of GB0922363D0 publication Critical patent/GB0922363D0/en
Priority to PCT/NO2010/000473 priority patent/WO2011078686A1/en
Publication of GB2476315A publication Critical patent/GB2476315A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
GB0922363A 2009-12-21 2009-12-21 Cleaning a stack of thin wafers Withdrawn GB2476315A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB0922363A GB2476315A (en) 2009-12-21 2009-12-21 Cleaning a stack of thin wafers
PCT/NO2010/000473 WO2011078686A1 (en) 2009-12-21 2010-12-20 Cleaning stack of wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0922363A GB2476315A (en) 2009-12-21 2009-12-21 Cleaning a stack of thin wafers

Publications (2)

Publication Number Publication Date
GB0922363D0 true GB0922363D0 (en) 2010-02-03
GB2476315A GB2476315A (en) 2011-06-22

Family

ID=41717354

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0922363A Withdrawn GB2476315A (en) 2009-12-21 2009-12-21 Cleaning a stack of thin wafers

Country Status (2)

Country Link
GB (1) GB2476315A (en)
WO (1) WO2011078686A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102319689A (en) * 2011-08-18 2012-01-18 浚鑫科技股份有限公司 Cleaning device
EP2703001A1 (en) 2012-08-26 2014-03-05 XAX Kft. Tumor vaccination

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6532976B1 (en) * 1995-07-10 2003-03-18 Lg Semicon Co., Ltd. Semiconductor wafer cleaning apparatus
TW310452B (en) 1995-12-07 1997-07-11 Tokyo Electron Co Ltd
JP2002110591A (en) * 2000-09-27 2002-04-12 Takata Corp Apparatus and method of cleaning wafers after wire saw
DE10215283B4 (en) 2002-04-05 2004-06-03 Astec Halbleitertechnologie Gmbh Device for receiving substrates
WO2008003502A1 (en) * 2006-07-06 2008-01-10 Rena Sondermaschinen Gmbh Apparatus and method for separating and transporting substrates
DE102006059810A1 (en) * 2006-12-15 2008-06-19 Rena Sondermaschinen Gmbh Apparatus and method for cleaning objects, in particular thin disks
DE102007054093B3 (en) 2007-11-13 2009-07-23 Rena Sondermaschinen Gmbh Apparatus and method for transporting flat goods in continuous systems
DE102008004548A1 (en) * 2008-01-15 2009-07-16 Rec Scan Wafer As Wafer batch cleaning
WO2009098042A1 (en) 2008-02-06 2009-08-13 Meyer Burger Ag Device for cleaning flat substrates
DE102008022282A1 (en) 2008-04-24 2009-10-29 Gebr. Schmid Gmbh & Co. Device and method for treating silicon wafers or flat objects

Also Published As

Publication number Publication date
GB2476315A (en) 2011-06-22
WO2011078686A1 (en) 2011-06-30

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)