GB0905032D0 - Thermal link system for a computer system and computer system comprising a thermal link system - Google Patents

Thermal link system for a computer system and computer system comprising a thermal link system

Info

Publication number
GB0905032D0
GB0905032D0 GB0905032A GB0905032A GB0905032D0 GB 0905032 D0 GB0905032 D0 GB 0905032D0 GB 0905032 A GB0905032 A GB 0905032A GB 0905032 A GB0905032 A GB 0905032A GB 0905032 D0 GB0905032 D0 GB 0905032D0
Authority
GB
United Kingdom
Prior art keywords
thermal link
computer system
computer
link system
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0905032A
Other versions
GB2463538B (en
GB2463538A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB0905032D0 publication Critical patent/GB0905032D0/en
Publication of GB2463538A publication Critical patent/GB2463538A/en
Application granted granted Critical
Publication of GB2463538B publication Critical patent/GB2463538B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
GB0905032A 2008-05-06 2009-03-25 Thermal link system for a computer system and computer system comprising a thermal link system Active GB2463538B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP08155711 2008-05-06

Publications (3)

Publication Number Publication Date
GB0905032D0 true GB0905032D0 (en) 2009-05-06
GB2463538A GB2463538A (en) 2010-03-24
GB2463538B GB2463538B (en) 2012-04-25

Family

ID=40640063

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0905032A Active GB2463538B (en) 2008-05-06 2009-03-25 Thermal link system for a computer system and computer system comprising a thermal link system

Country Status (1)

Country Link
GB (1) GB2463538B (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6072697A (en) * 1998-07-15 2000-06-06 Systems & Electronics, Inc. Modular heat sink stack
US6101094A (en) * 1998-12-18 2000-08-08 Sun Microsystems, Inc. Printed circuit board with integrated cooling mechanism
US6535387B2 (en) * 2001-06-28 2003-03-18 Intel Corporation Heat transfer apparatus
USD531965S1 (en) * 2004-10-28 2006-11-14 Mushkin, Inc. Memory card heat sink
US7800910B2 (en) * 2005-06-02 2010-09-21 Koninklijke Philips Electronics N V Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module
US7400505B2 (en) * 2006-10-10 2008-07-15 International Business Machines Corporation Hybrid cooling system and method for a multi-component electronics system
US7612446B2 (en) * 2006-11-22 2009-11-03 International Business Machines Corporation Structures to enhance cooling of computer memory modules

Also Published As

Publication number Publication date
GB2463538B (en) 2012-04-25
GB2463538A (en) 2010-03-24

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 20130402