GB0814780D0 - Latent heat storage body - Google Patents
Latent heat storage bodyInfo
- Publication number
- GB0814780D0 GB0814780D0 GBGB0814780.3A GB0814780A GB0814780D0 GB 0814780 D0 GB0814780 D0 GB 0814780D0 GB 0814780 A GB0814780 A GB 0814780A GB 0814780 D0 GB0814780 D0 GB 0814780D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat
- thermally conductive
- conductive structure
- thermal storage
- latent heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
- F28D20/023—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/006—Heat conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Abstract
A heat storage body 100 comprises a volume of a latent heat thermal storage material 120, such as a wax phase change material (PCM), in which one or more portions of an open cell thermally conductive structure 105 are arranged to distribute heat within the thermal storage material. Preferably, the thermally conductive structure comprises an open cell foam or a matrix grid or mesh structure of rods or wires. The thermally conductive structure may be made from a metal, such as aluminium or copper, or a non-metallic conductor, such as oriented graphite, ceramic or other refractory material. Preferably, the heat storage body comprises a container for enclosing the volume of the latent heat thermal storage material, where the container may take any required shape, for example, to at least partially enclose a heat producing component or to form a lid (310, fig. 3) or other thermally protective cover. In use, the thermally conductive structure acts as an efficient heat spreader within the latent heat thermal storage material so as to conduct heat effectively through the body of the material and ensure even melting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0814780A GB2462620A (en) | 2008-08-13 | 2008-08-13 | Latent heat storage body comprising a thermally conductive structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0814780A GB2462620A (en) | 2008-08-13 | 2008-08-13 | Latent heat storage body comprising a thermally conductive structure |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0814780D0 true GB0814780D0 (en) | 2008-09-17 |
GB2462620A GB2462620A (en) | 2010-02-17 |
Family
ID=39790699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0814780A Withdrawn GB2462620A (en) | 2008-08-13 | 2008-08-13 | Latent heat storage body comprising a thermally conductive structure |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2462620A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110114657A (en) * | 2016-12-28 | 2019-08-09 | 威拓股份有限公司 | Optical means for phase-change material |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9136202B2 (en) * | 2012-04-17 | 2015-09-15 | Qualcomm Incorporated | Enhanced package thermal management using external and internal capacitive thermal material |
BE1025065B1 (en) * | 2017-03-20 | 2018-10-19 | Etablissementen Franz Colruyt Naamloze Vennootschap | THERMOSTATIC BATTERY, CHARGING INSTALLATION FOR THERMOSTATIC BATTERIES AND METHOD OF USE OF THERMOSTATIC BATTERIES AND CHARGING INSTALLATIONS |
CN107084637B (en) * | 2017-05-19 | 2023-11-03 | 平湖阿莱德实业有限公司 | Unidirectional high-heat-conductivity intelligent energy storage block |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4268558A (en) * | 1977-07-01 | 1981-05-19 | Boardman Energy Systems, Inc. | Thermal storage material and process for making |
JPS56110895A (en) * | 1980-02-06 | 1981-09-02 | Matsushita Electric Ind Co Ltd | Heat and cold accumulation material |
EP0732743A3 (en) * | 1995-03-17 | 1998-05-13 | Texas Instruments Incorporated | Heat sinks |
US6037032A (en) * | 1997-09-02 | 2000-03-14 | Lockheed Martin Energy Research Corp. | Pitch-based carbon foam heat sink with phase change material |
DE10007848A1 (en) * | 2000-02-21 | 2001-08-23 | Thomas Freitag | Latent heat or cold store uses matrix of open-pore metal foam in which material capable of change of phase is stored |
US7002800B2 (en) * | 2002-01-25 | 2006-02-21 | Lockheed Martin Corporation | Integrated power and cooling architecture |
JP2004156793A (en) * | 2002-11-01 | 2004-06-03 | Ip:Kk | Heat storage device |
DE10332162A1 (en) * | 2003-07-15 | 2005-02-03 | Access Materials&Processes | Latent heat storage system employs a metal sponge in which a phase change material is embedded |
US7316262B1 (en) * | 2004-01-26 | 2008-01-08 | Rini Technologies, Inc. | Method and apparatus for absorbing thermal energy |
-
2008
- 2008-08-13 GB GB0814780A patent/GB2462620A/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110114657A (en) * | 2016-12-28 | 2019-08-09 | 威拓股份有限公司 | Optical means for phase-change material |
Also Published As
Publication number | Publication date |
---|---|
GB2462620A (en) | 2010-02-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Hu et al. | Experimental study on the thermal response of PCM-based heat sink using structured porous material fabricated by 3D printing | |
CN103339789B (en) | Battery housing structure | |
GB0814780D0 (en) | Latent heat storage body | |
JP2015529937A5 (en) | ||
EP2854190B1 (en) | Thermoelectric generator | |
TW200635992A (en) | Thermally conductive compositions and methods of making thereof | |
CN106717141B (en) | Temperature regulation using electromagnetic interference in-tank phase change materials | |
MX2011011847A (en) | Heat dissipation means for increasing power density in enclosed equipment. | |
RU2019105133A (en) | CATHODE UNIT FOR ALUMINUM PRODUCTION | |
JP2015175416A (en) | gas storage tank | |
Khedher et al. | Study of tree-shaped optimized fins in a heat sink filled by solid-solid nanocomposite phase change material | |
Rao et al. | Thermal properties of paraffin/nano-AlN phase change energy storage materials | |
CN202192871U (en) | Electric heating loose-leaf notebook | |
CN202291360U (en) | Feeding and heat preserving furnace of aluminum alloy die casting machine in cold chamber | |
EP2154462A1 (en) | Latent heat storage body | |
Di Napoli et al. | Micro–Macro Analysis of capacitor discharge sintering in copper–diamond bead | |
Fu et al. | Thermal management optimization for a wireless charging system of electric vehicle with phase change materials | |
Bertarelli et al. | Innovative MoC–graphite composite for thermal management and thermal shock applications | |
CN216668134U (en) | Drying box | |
RU2011105093A (en) | EXTINGUISHING PLATE FOR AN EXTINGUISHING CHAMBER | |
CN202071531U (en) | Electric heating book with plug | |
CN207678019U (en) | Electric hot tray | |
CN104882234A (en) | Power resistor of three-dimensional network structure and processing technique of power resistor | |
CN201895861U (en) | Heat storage device containing phase-change materials and thermal insulation system manufactured by heat storage device | |
CN204695886U (en) | Three-dimensional net structure power resistor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |