GB0814780D0 - Latent heat storage body - Google Patents

Latent heat storage body

Info

Publication number
GB0814780D0
GB0814780D0 GBGB0814780.3A GB0814780A GB0814780D0 GB 0814780 D0 GB0814780 D0 GB 0814780D0 GB 0814780 A GB0814780 A GB 0814780A GB 0814780 D0 GB0814780 D0 GB 0814780D0
Authority
GB
United Kingdom
Prior art keywords
heat
thermally conductive
conductive structure
thermal storage
latent heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0814780.3A
Other versions
GB2462620A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems PLC
Original Assignee
BAE Systems PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BAE Systems PLC filed Critical BAE Systems PLC
Priority to GB0814780A priority Critical patent/GB2462620A/en
Publication of GB0814780D0 publication Critical patent/GB0814780D0/en
Publication of GB2462620A publication Critical patent/GB2462620A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F28D20/023Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029Heat sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005Thermal joints
    • F28F2013/006Heat conductive materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14Thermal energy storage

Abstract

A heat storage body 100 comprises a volume of a latent heat thermal storage material 120, such as a wax phase change material (PCM), in which one or more portions of an open cell thermally conductive structure 105 are arranged to distribute heat within the thermal storage material. Preferably, the thermally conductive structure comprises an open cell foam or a matrix grid or mesh structure of rods or wires. The thermally conductive structure may be made from a metal, such as aluminium or copper, or a non-metallic conductor, such as oriented graphite, ceramic or other refractory material. Preferably, the heat storage body comprises a container for enclosing the volume of the latent heat thermal storage material, where the container may take any required shape, for example, to at least partially enclose a heat producing component or to form a lid (310, fig. 3) or other thermally protective cover. In use, the thermally conductive structure acts as an efficient heat spreader within the latent heat thermal storage material so as to conduct heat effectively through the body of the material and ensure even melting.
GB0814780A 2008-08-13 2008-08-13 Latent heat storage body comprising a thermally conductive structure Withdrawn GB2462620A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0814780A GB2462620A (en) 2008-08-13 2008-08-13 Latent heat storage body comprising a thermally conductive structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0814780A GB2462620A (en) 2008-08-13 2008-08-13 Latent heat storage body comprising a thermally conductive structure

Publications (2)

Publication Number Publication Date
GB0814780D0 true GB0814780D0 (en) 2008-09-17
GB2462620A GB2462620A (en) 2010-02-17

Family

ID=39790699

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0814780A Withdrawn GB2462620A (en) 2008-08-13 2008-08-13 Latent heat storage body comprising a thermally conductive structure

Country Status (1)

Country Link
GB (1) GB2462620A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110114657A (en) * 2016-12-28 2019-08-09 威拓股份有限公司 Optical means for phase-change material

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9136202B2 (en) * 2012-04-17 2015-09-15 Qualcomm Incorporated Enhanced package thermal management using external and internal capacitive thermal material
BE1025065B1 (en) * 2017-03-20 2018-10-19 Etablissementen Franz Colruyt Naamloze Vennootschap THERMOSTATIC BATTERY, CHARGING INSTALLATION FOR THERMOSTATIC BATTERIES AND METHOD OF USE OF THERMOSTATIC BATTERIES AND CHARGING INSTALLATIONS
CN107084637B (en) * 2017-05-19 2023-11-03 平湖阿莱德实业有限公司 Unidirectional high-heat-conductivity intelligent energy storage block

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4268558A (en) * 1977-07-01 1981-05-19 Boardman Energy Systems, Inc. Thermal storage material and process for making
JPS56110895A (en) * 1980-02-06 1981-09-02 Matsushita Electric Ind Co Ltd Heat and cold accumulation material
EP0732743A3 (en) * 1995-03-17 1998-05-13 Texas Instruments Incorporated Heat sinks
US6037032A (en) * 1997-09-02 2000-03-14 Lockheed Martin Energy Research Corp. Pitch-based carbon foam heat sink with phase change material
DE10007848A1 (en) * 2000-02-21 2001-08-23 Thomas Freitag Latent heat or cold store uses matrix of open-pore metal foam in which material capable of change of phase is stored
US7002800B2 (en) * 2002-01-25 2006-02-21 Lockheed Martin Corporation Integrated power and cooling architecture
JP2004156793A (en) * 2002-11-01 2004-06-03 Ip:Kk Heat storage device
DE10332162A1 (en) * 2003-07-15 2005-02-03 Access Materials&Processes Latent heat storage system employs a metal sponge in which a phase change material is embedded
US7316262B1 (en) * 2004-01-26 2008-01-08 Rini Technologies, Inc. Method and apparatus for absorbing thermal energy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110114657A (en) * 2016-12-28 2019-08-09 威拓股份有限公司 Optical means for phase-change material

Also Published As

Publication number Publication date
GB2462620A (en) 2010-02-17

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)