FR3062771B1 - FORCED CONVECTION COOLED ELECTRONIC MODULE WITH AIR FLOW DISTRIBUTION GRID - Google Patents

FORCED CONVECTION COOLED ELECTRONIC MODULE WITH AIR FLOW DISTRIBUTION GRID Download PDF

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Publication number
FR3062771B1
FR3062771B1 FR1751040A FR1751040A FR3062771B1 FR 3062771 B1 FR3062771 B1 FR 3062771B1 FR 1751040 A FR1751040 A FR 1751040A FR 1751040 A FR1751040 A FR 1751040A FR 3062771 B1 FR3062771 B1 FR 3062771B1
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France
Prior art keywords
electronic
forced convection
electronic module
air flow
distribution grid
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Active
Application number
FR1751040A
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French (fr)
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FR3062771A1 (en
Inventor
Adrien Zanetti
Gaetan Tuyeras
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alstom Transport Technologies SAS
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Alstom Transport Technologies SAS
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Publication date
Application filed by Alstom Transport Technologies SAS filed Critical Alstom Transport Technologies SAS
Priority to FR1751040A priority Critical patent/FR3062771B1/en
Publication of FR3062771A1 publication Critical patent/FR3062771A1/en
Application granted granted Critical
Publication of FR3062771B1 publication Critical patent/FR3062771B1/en
Active legal-status Critical Current
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554Forced ventilation of a gaseous coolant
    • H05K7/20563Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1432Housings specially adapted for power drive units or power converters
    • H05K7/14325Housings specially adapted for power drive units or power converters for cabinets or racks

Abstract

Module électronique (10) refroidi par convection forcée, comprenant : - un tiroir électronique (12) comprenant une pluralité de cartes électroniques (30); - un soufflage d'air (14), disposé d'un premier côté longitudinal du tiroir électronique (12), - un conduit de distribution d'air (16) situé sous le tiroir électronique (12), le soufflage d'air (14) étant configuré pour souffler longitudinalement un flux d'air dans le conduit de distribution (16) ; - une grille de distribution (18) d'air montée dans le conduit de distribution d'air (16), comportant une pluralité de déflecteurs (42), les déflecteurs (42) étant séparés les uns des autres par des fentes (44) pour distribuer le flux d'air dans le tiroir électronique (12).An electronic module (10) cooled by forced convection, comprising: - an electronic spool (12) comprising a plurality of electronic boards (30); - an air blast (14), disposed on a first longitudinal side of the electronic spool (12), - an air distribution duct (16) located under the electronic spool (12), the blowing air ( 14) being configured to longitudinally blow a flow of air into the distribution duct (16); an air distribution grid (18) mounted in the air distribution duct (16), comprising a plurality of deflectors (42), the deflectors (42) being separated from one another by slots (44) for distributing the airflow in the electronic drawer (12).

FR1751040A 2017-02-08 2017-02-08 FORCED CONVECTION COOLED ELECTRONIC MODULE WITH AIR FLOW DISTRIBUTION GRID Active FR3062771B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1751040A FR3062771B1 (en) 2017-02-08 2017-02-08 FORCED CONVECTION COOLED ELECTRONIC MODULE WITH AIR FLOW DISTRIBUTION GRID

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1751040 2017-02-08
FR1751040A FR3062771B1 (en) 2017-02-08 2017-02-08 FORCED CONVECTION COOLED ELECTRONIC MODULE WITH AIR FLOW DISTRIBUTION GRID

Publications (2)

Publication Number Publication Date
FR3062771A1 FR3062771A1 (en) 2018-08-10
FR3062771B1 true FR3062771B1 (en) 2019-04-05

Family

ID=59153002

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1751040A Active FR3062771B1 (en) 2017-02-08 2017-02-08 FORCED CONVECTION COOLED ELECTRONIC MODULE WITH AIR FLOW DISTRIBUTION GRID

Country Status (1)

Country Link
FR (1) FR3062771B1 (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5274530A (en) * 1992-05-29 1993-12-28 Anderson William B Module for protecting and cooling computer chip die mounted on a thin film substrate and a chassis for conduction cooling of such modules
US6912131B2 (en) * 2003-08-27 2005-06-28 Lucent Technologies Inc. Electronic components card air deflector
US7259961B2 (en) * 2004-06-24 2007-08-21 Intel Corporation Reconfigurable airflow director for modular blade chassis
US7324336B2 (en) * 2005-09-27 2008-01-29 Lockheed Martin Corporation Flow through cooling assemblies for conduction-cooled circuit modules
US7394654B2 (en) * 2006-10-19 2008-07-01 Cisco Technology, Inc. Method and apparatus for providing thermal management in an electronic device
US8446725B2 (en) * 2010-08-05 2013-05-21 Alcatel Lucent Airflow control in an electronic chassis
JP2013086642A (en) * 2011-10-18 2013-05-13 Fuji Electric Co Ltd Vehicular power converter
JP5749192B2 (en) * 2012-02-13 2015-07-15 株式会社東芝 Vehicle drive control device
US20150271957A1 (en) * 2014-03-20 2015-09-24 Hamilton Sundstrand Corporation Cooling flow optimization

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Publication number Publication date
FR3062771A1 (en) 2018-08-10

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