FR3034952B1 - Procede de fabrication d'un circuit flexible, circuit flexible obtenu par ce procede et carte a puce comportant un tel circuit flexible - Google Patents

Procede de fabrication d'un circuit flexible, circuit flexible obtenu par ce procede et carte a puce comportant un tel circuit flexible Download PDF

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Publication number
FR3034952B1
FR3034952B1 FR1553032A FR1553032A FR3034952B1 FR 3034952 B1 FR3034952 B1 FR 3034952B1 FR 1553032 A FR1553032 A FR 1553032A FR 1553032 A FR1553032 A FR 1553032A FR 3034952 B1 FR3034952 B1 FR 3034952B1
Authority
FR
France
Prior art keywords
flexible circuit
manufacturing
layer
chip card
card containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1553032A
Other languages
English (en)
Other versions
FR3034952A1 (fr
Inventor
Christophe Mathieu
Severine Dieu-Gomont
De Lopez Claire Laurens
Christophe Paul
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linxens Holding SAS
Original Assignee
Linxens Holding SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linxens Holding SAS filed Critical Linxens Holding SAS
Priority to FR1553032A priority Critical patent/FR3034952B1/fr
Publication of FR3034952A1 publication Critical patent/FR3034952A1/fr
Application granted granted Critical
Publication of FR3034952B1 publication Critical patent/FR3034952B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un circuit flexible. Il comprend la fourniture d'une feuille de matériau électriquement conducteur (11) et d'une couche de matériau diélectrique (50). Il comprend également la mise en contact de la couche de matériau diélectrique (50° directement avec la feuille de matériau électriquement conducteur (11) et la lamination de celles-ci. On incorpore en outre un renfort dans la couche de matériau diélectrique (50), celle-ci comprenant un matériau thermoplastique avec des propriétés d'adhérence réactivables sous la chaleur à une température supérieure à 100°C et préférentiellement supérieure à 120°C. L'invention concerne également un circuit flexible pour carte à puce fabriqué avec ce procédé et un module de carte à puce comportant un tel circuit flexible.
FR1553032A 2015-04-08 2015-04-08 Procede de fabrication d'un circuit flexible, circuit flexible obtenu par ce procede et carte a puce comportant un tel circuit flexible Expired - Fee Related FR3034952B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1553032A FR3034952B1 (fr) 2015-04-08 2015-04-08 Procede de fabrication d'un circuit flexible, circuit flexible obtenu par ce procede et carte a puce comportant un tel circuit flexible

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1553032A FR3034952B1 (fr) 2015-04-08 2015-04-08 Procede de fabrication d'un circuit flexible, circuit flexible obtenu par ce procede et carte a puce comportant un tel circuit flexible

Publications (2)

Publication Number Publication Date
FR3034952A1 FR3034952A1 (fr) 2016-10-14
FR3034952B1 true FR3034952B1 (fr) 2020-11-13

Family

ID=53274688

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1553032A Expired - Fee Related FR3034952B1 (fr) 2015-04-08 2015-04-08 Procede de fabrication d'un circuit flexible, circuit flexible obtenu par ce procede et carte a puce comportant un tel circuit flexible

Country Status (1)

Country Link
FR (1) FR3034952B1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2863747B1 (fr) * 2003-12-11 2006-03-24 Oberthur Card Syst Sa Fiabilisation des cartes dual interface par grille continue
US8789762B2 (en) * 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
FR3006549B1 (fr) * 2013-06-03 2016-10-14 Linxens Holding Procede de realisation d'un circuit electrique et circuit electrique realise par ce procede
US9335034B2 (en) * 2013-09-27 2016-05-10 Osram Sylvania Inc Flexible circuit board for electronic applications, light source containing same, and method of making

Also Published As

Publication number Publication date
FR3034952A1 (fr) 2016-10-14

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