FR2953066B1 - Montage en boitier pour composants electroniques assembles par clip - Google Patents

Montage en boitier pour composants electroniques assembles par clip

Info

Publication number
FR2953066B1
FR2953066B1 FR0958349A FR0958349A FR2953066B1 FR 2953066 B1 FR2953066 B1 FR 2953066B1 FR 0958349 A FR0958349 A FR 0958349A FR 0958349 A FR0958349 A FR 0958349A FR 2953066 B1 FR2953066 B1 FR 2953066B1
Authority
FR
France
Prior art keywords
clip
electronic components
case assembly
components assembled
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0958349A
Other languages
English (en)
Other versions
FR2953066A1 (fr
Inventor
Dominique Touzet
Pascal Coirault
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Tours SAS
Original Assignee
STMicroelectronics Tours SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Tours SAS filed Critical STMicroelectronics Tours SAS
Priority to FR0958349A priority Critical patent/FR2953066B1/fr
Priority to US13/510,598 priority patent/US20130017649A1/en
Priority to PCT/FR2010/052329 priority patent/WO2011064480A1/fr
Priority to CN201080053689.4A priority patent/CN102630339B/zh
Publication of FR2953066A1 publication Critical patent/FR2953066A1/fr
Application granted granted Critical
Publication of FR2953066B1 publication Critical patent/FR2953066B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49537—Plurality of lead frames mounted in one device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/37147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/3754—Coating
    • H01L2224/37599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR0958349A 2009-11-25 2009-11-25 Montage en boitier pour composants electroniques assembles par clip Expired - Fee Related FR2953066B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR0958349A FR2953066B1 (fr) 2009-11-25 2009-11-25 Montage en boitier pour composants electroniques assembles par clip
US13/510,598 US20130017649A1 (en) 2009-11-25 2010-10-29 Packaging for clip-assembled electronic components
PCT/FR2010/052329 WO2011064480A1 (fr) 2009-11-25 2010-10-29 Montage en boitier pour composants electroniques assembles par clip
CN201080053689.4A CN102630339B (zh) 2009-11-25 2010-10-29 将借助于夹具组装的电子部件安装在封装中

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0958349A FR2953066B1 (fr) 2009-11-25 2009-11-25 Montage en boitier pour composants electroniques assembles par clip

Publications (2)

Publication Number Publication Date
FR2953066A1 FR2953066A1 (fr) 2011-05-27
FR2953066B1 true FR2953066B1 (fr) 2011-12-30

Family

ID=42246257

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0958349A Expired - Fee Related FR2953066B1 (fr) 2009-11-25 2009-11-25 Montage en boitier pour composants electroniques assembles par clip

Country Status (4)

Country Link
US (1) US20130017649A1 (fr)
CN (1) CN102630339B (fr)
FR (1) FR2953066B1 (fr)
WO (1) WO2011064480A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160020177A1 (en) * 2014-06-13 2016-01-21 Ubotic Company Limited Radio frequency shielding cavity package
CN107785276A (zh) * 2017-10-17 2018-03-09 江苏捷捷微电子股份有限公司 一种提高两片式框架封装定位精度的制造方法
US10964628B2 (en) 2019-02-21 2021-03-30 Infineon Technologies Ag Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
US11515244B2 (en) 2019-02-21 2022-11-29 Infineon Technologies Ag Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
CN111524868B (zh) * 2020-03-25 2024-03-12 长电科技（宿迁）有限公司 一种引线框架和金属夹片的组合结构及铆接装片工艺
WO2023115320A1 (fr) * 2021-12-21 2023-06-29 Texas Instruments Incorporated Structure non linéaire pour connecter de multiples plots de fixation de puce
CN116230648A (zh) * 2023-01-06 2023-06-06 重庆万国半导体科技有限公司 一种半导体器件组及其制备方法与应用

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3531076A (en) * 1968-08-06 1970-09-29 Stackpole Carbon Co Electrical control device with clip engaging mounting bracket means
US4637670A (en) * 1984-04-23 1987-01-20 Amp Incorporated Dual in-line package carrier assembly
ES2019889B3 (es) * 1987-02-17 1991-07-16 Enami Seiki Kk Una construcción unida entre las láminas metálicas.
US5640762A (en) * 1988-09-30 1997-06-24 Micron Technology, Inc. Method and apparatus for manufacturing known good semiconductor die
US4891475A (en) * 1988-10-24 1990-01-02 United Technologies Automotive, Inc. Automotive beam selector switch system with flash-to-pass
US5088930A (en) * 1990-11-20 1992-02-18 Advanced Interconnections Corporation Integrated circuit socket with reed-shaped leads
US5076622A (en) * 1990-07-25 1991-12-31 Lectron Products, Inc. Fuel filler latch assembly
US6219908B1 (en) * 1991-06-04 2001-04-24 Micron Technology, Inc. Method and apparatus for manufacturing known good semiconductor die
US5188333A (en) * 1991-07-15 1993-02-23 Spinnaker Industries Inc. Support for air conditioning unit
US5255887A (en) * 1991-07-15 1993-10-26 Spinnaker Industries Inc. Support for air conditioning unit
JP3088193B2 (ja) * 1992-06-05 2000-09-18 三菱電機株式会社 Ｌｏｃ構造を有する半導体装置の製造方法並びにこれに使用するリードフレーム
JPH06188354A (ja) * 1992-12-21 1994-07-08 Mitsui High Tec Inc 半導体装置
US5391084A (en) * 1994-03-11 1995-02-21 Chatsworth Products, Inc. Grounding assembly for electrical distribution panels
US5506174A (en) * 1994-07-12 1996-04-09 General Instrument Corp. Automated assembly of semiconductor devices using a pair of lead frames
US5564932A (en) * 1994-11-14 1996-10-15 Castleman; Mark-Andrew B. Customizeable interconnect device for stacking electrical components of varying configuration
MY132693A (en) * 1995-12-06 2007-10-31 Frederick Untiedt Dalmain Building structure
DE19702717A1 (de) * 1997-01-25 1998-07-30 Bosch Gmbh Robert Elektrisches Schaltgerät und Verfahren zur Herstellung eines Magnetwinkels für ein solches
US5830781A (en) * 1997-04-22 1998-11-03 General Instrument Corp. Semiconductor device soldering process
TW409379B (en) * 1998-03-11 2000-10-21 Motorola Inc A semiconductor package and method for forming same
US6194653B1 (en) * 1998-03-24 2001-02-27 General Instrument Corporation Enclosure design having an integrated system of retention, electromagnetic interference containment and structural load distribution
US6149451A (en) * 1998-06-12 2000-11-21 Atl Technology, Inc. Cable connector latching device
TW389436U (en) * 1998-12-28 2000-05-01 Hon Hai Prec Ind Co Ltd Electrical connector
US6217361B1 (en) * 1999-02-26 2001-04-17 The Whitaker Corporation Zip socket having movable frame
US6227785B1 (en) * 1999-06-29 2001-05-08 Siemens Automotive Corporation Self-tightening clip
US6174178B1 (en) * 2000-03-14 2001-01-16 Tektronix, Inc. Retractable connector mechanism for signal connectors
TW468940U (en) * 2000-04-14 2001-12-11 Foxconn Prec Components Co Ltd Joggles of thermal dissipative device**941
TW558094U (en) * 2003-02-26 2003-10-11 Hon Hai Prec Ind Co Ltd Electrical connector assembly
TW573841U (en) * 2003-03-19 2004-01-21 Hon Hai Prec Ind Co Ltd Electrical connector assembly
US6998862B2 (en) * 2003-04-28 2006-02-14 Micron Technology, Inc. Test socket for semiconductor components having serviceable nest
CN100490140C (zh) * 2003-07-15 2009-05-20 飞思卡尔半导体公司 双规引线框
TWM244556U (en) * 2003-09-12 2004-09-21 Hon Hai Prec Ind Co Ltd Mounting apparatus for data storage devices
US20070056238A1 (en) * 2005-09-12 2007-03-15 Albracht Gregory P Cement and Composite Siding Attachment and Alignment System
WO2007055209A1 (fr) * 2005-11-11 2007-05-18 Mitsui High-Tec, Inc. Procede de fabrication de chassis de brochage stratifie et chassis de brochage stratifie
JP2007134584A (ja) * 2005-11-11 2007-05-31 Mitsui High Tec Inc 積層リードフレームの製造方法及びこの方法によって製造された積層リードフレーム
US20070114060A1 (en) * 2005-11-22 2007-05-24 International Business Machines Corporation EMC gasket with built-in chassis retention
US8288200B2 (en) * 2005-11-30 2012-10-16 Diodes Inc. Semiconductor devices with conductive clips
US20070151759A1 (en) * 2006-01-04 2007-07-05 International Business Machines Corporation Adhesive free EMC gasket with built-in chassis retention
US7828579B2 (en) * 2007-08-28 2010-11-09 Kingconn Technology Co., Ltd. Latch locking type connector
CN201112824Y (zh) * 2007-08-28 2008-09-10 富士康(昆山)电脑接插件有限公司 线缆连接器组件
US8193618B2 (en) * 2008-12-12 2012-06-05 Fairchild Semiconductor Corporation Semiconductor die package with clip interconnection
DE102009058616B4 (de) * 2009-12-17 2011-11-10 Harting Electronics Gmbh & Co. Kg Leiterplattensteckverbinder mit Verriegelungsvorrichtung

Also Published As

Publication number Publication date
CN102630339B (zh) 2016-01-06
US20130017649A1 (en) 2013-01-17
WO2011064480A1 (fr) 2011-06-03
CN102630339A (zh) 2012-08-08
FR2953066A1 (fr) 2011-05-27

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