FR2906236B3 - STRUCTURE OF REINFORCED MICRO-ELECTROMECHANICAL SYSTEM HOUSING - Google Patents

STRUCTURE OF REINFORCED MICRO-ELECTROMECHANICAL SYSTEM HOUSING

Info

Publication number
FR2906236B3
FR2906236B3 FR0653915A FR0653915A FR2906236B3 FR 2906236 B3 FR2906236 B3 FR 2906236B3 FR 0653915 A FR0653915 A FR 0653915A FR 0653915 A FR0653915 A FR 0653915A FR 2906236 B3 FR2906236 B3 FR 2906236B3
Authority
FR
France
Prior art keywords
system housing
electromechanical system
reinforced micro
reinforced
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0653915A
Other languages
French (fr)
Other versions
FR2906236A3 (en
Inventor
Wan Hua Wu
Szu Chuan Pang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SIGURDMICROELECTRONICS CORP
Original Assignee
SIGURDMICROELECTRONICS CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SIGURDMICROELECTRONICS CORP filed Critical SIGURDMICROELECTRONICS CORP
Priority to FR0653915A priority Critical patent/FR2906236B3/en
Publication of FR2906236A3 publication Critical patent/FR2906236A3/en
Application granted granted Critical
Publication of FR2906236B3 publication Critical patent/FR2906236B3/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/097—Interconnects arranged on the substrate or the lid, and covered by the package seal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0154—Moulding a cap over the MEMS device
FR0653915A 2006-09-22 2006-09-22 STRUCTURE OF REINFORCED MICRO-ELECTROMECHANICAL SYSTEM HOUSING Expired - Fee Related FR2906236B3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0653915A FR2906236B3 (en) 2006-09-22 2006-09-22 STRUCTURE OF REINFORCED MICRO-ELECTROMECHANICAL SYSTEM HOUSING

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0653915A FR2906236B3 (en) 2006-09-22 2006-09-22 STRUCTURE OF REINFORCED MICRO-ELECTROMECHANICAL SYSTEM HOUSING

Publications (2)

Publication Number Publication Date
FR2906236A3 FR2906236A3 (en) 2008-03-28
FR2906236B3 true FR2906236B3 (en) 2008-08-08

Family

ID=39165801

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0653915A Expired - Fee Related FR2906236B3 (en) 2006-09-22 2006-09-22 STRUCTURE OF REINFORCED MICRO-ELECTROMECHANICAL SYSTEM HOUSING

Country Status (1)

Country Link
FR (1) FR2906236B3 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3026696B1 (en) * 2014-11-26 2021-03-03 STMicroelectronics Srl Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as mems pressure sensors
US9896330B2 (en) * 2016-01-13 2018-02-20 Texas Instruments Incorporated Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

Also Published As

Publication number Publication date
FR2906236A3 (en) 2008-03-28

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100531