FR2823596B1 - Substrat ou structure demontable et procede de realisation - Google Patents

Substrat ou structure demontable et procede de realisation

Info

Publication number
FR2823596B1
FR2823596B1 FR0105129A FR0105129A FR2823596B1 FR 2823596 B1 FR2823596 B1 FR 2823596B1 FR 0105129 A FR0105129 A FR 0105129A FR 0105129 A FR0105129 A FR 0105129A FR 2823596 B1 FR2823596 B1 FR 2823596B1
Authority
FR
France
Prior art keywords
substrate
making same
dismountable structure
dismountable
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0105129A
Other languages
English (en)
French (fr)
Other versions
FR2823596A1 (fr
Inventor
Bernard Aspar
Hubert Moriceau
Marc Zussy
Olivier Rayssac
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0105129A priority Critical patent/FR2823596B1/fr
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to US10/468,223 priority patent/US7713369B2/en
Priority to JP2002581571A priority patent/JP4540933B2/ja
Priority to CNB028096819A priority patent/CN100355025C/zh
Priority to PCT/FR2002/001266 priority patent/WO2002084721A2/fr
Priority to KR1020037013311A priority patent/KR100933897B1/ko
Priority to EP02732806.1A priority patent/EP1378003B1/fr
Priority to AU2002304525A priority patent/AU2002304525A1/en
Priority to TW091107432A priority patent/TW577102B/zh
Publication of FR2823596A1 publication Critical patent/FR2823596A1/fr
Application granted granted Critical
Publication of FR2823596B1 publication Critical patent/FR2823596B1/fr
Priority to JP2009297080A priority patent/JP2010114456A/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/11—Separation of active layers from substrates
    • H10P95/112—Separation of active layers from substrates leaving a reusable substrate, e.g. epitaxial lift off
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • H10P90/1916—Preparing SOI wafers using bonding with separation or delamination along an ion implanted layer, e.g. Smart-cut
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1924—Preparing SOI wafers with separation/delamination along a porous layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/743—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7432—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
FR0105129A 2001-04-13 2001-04-13 Substrat ou structure demontable et procede de realisation Expired - Fee Related FR2823596B1 (fr)

Priority Applications (10)

Application Number Priority Date Filing Date Title
FR0105129A FR2823596B1 (fr) 2001-04-13 2001-04-13 Substrat ou structure demontable et procede de realisation
AU2002304525A AU2002304525A1 (en) 2001-04-13 2002-04-11 Detachable substrate or detachable structure and method for the production thereof
CNB028096819A CN100355025C (zh) 2001-04-13 2002-04-11 可拆除基片或可拆除结构及其生产方法
PCT/FR2002/001266 WO2002084721A2 (fr) 2001-04-13 2002-04-11 Substrat ou structure demontable et procede de realisation
KR1020037013311A KR100933897B1 (ko) 2001-04-13 2002-04-11 분리가능 기판 또는 분리가능 구조체 및 그 생산방법
EP02732806.1A EP1378003B1 (fr) 2001-04-13 2002-04-11 Procede de realisation d'un substrat ou structure demontable
US10/468,223 US7713369B2 (en) 2001-04-13 2002-04-11 Detachable substrate or detachable structure and method for the production thereof
JP2002581571A JP4540933B2 (ja) 2001-04-13 2002-04-11 薄層形成方法
TW091107432A TW577102B (en) 2001-04-13 2002-04-12 Method of preparing thin film for removable substrate and the thin film-substrate assembly obtained thereby
JP2009297080A JP2010114456A (ja) 2001-04-13 2009-12-28 剥離可能な基板または剥離可能な構造、およびそれらの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0105129A FR2823596B1 (fr) 2001-04-13 2001-04-13 Substrat ou structure demontable et procede de realisation

Publications (2)

Publication Number Publication Date
FR2823596A1 FR2823596A1 (fr) 2002-10-18
FR2823596B1 true FR2823596B1 (fr) 2004-08-20

Family

ID=8862351

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0105129A Expired - Fee Related FR2823596B1 (fr) 2001-04-13 2001-04-13 Substrat ou structure demontable et procede de realisation

Country Status (9)

Country Link
US (1) US7713369B2 (https=)
EP (1) EP1378003B1 (https=)
JP (2) JP4540933B2 (https=)
KR (1) KR100933897B1 (https=)
CN (1) CN100355025C (https=)
AU (1) AU2002304525A1 (https=)
FR (1) FR2823596B1 (https=)
TW (1) TW577102B (https=)
WO (1) WO2002084721A2 (https=)

Families Citing this family (122)

* Cited by examiner, † Cited by third party
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FR2823596B1 (fr) 2001-04-13 2004-08-20 Commissariat Energie Atomique Substrat ou structure demontable et procede de realisation
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CN1528009A (zh) 2004-09-08
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FR2823596A1 (fr) 2002-10-18
US7713369B2 (en) 2010-05-11
EP1378003A2 (fr) 2004-01-07
AU2002304525A1 (en) 2002-10-28
JP2010114456A (ja) 2010-05-20
EP1378003B1 (fr) 2017-11-08
KR100933897B1 (ko) 2009-12-28
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WO2002084721A3 (fr) 2003-11-06

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