FR2697715B1 - Double-sided printed circuit and electrical conduction assembly comprising such a printed circuit. - Google Patents

Double-sided printed circuit and electrical conduction assembly comprising such a printed circuit.

Info

Publication number
FR2697715B1
FR2697715B1 FR9213018A FR9213018A FR2697715B1 FR 2697715 B1 FR2697715 B1 FR 2697715B1 FR 9213018 A FR9213018 A FR 9213018A FR 9213018 A FR9213018 A FR 9213018A FR 2697715 B1 FR2697715 B1 FR 2697715B1
Authority
FR
France
Prior art keywords
printed circuit
double
electrical conduction
conduction assembly
sided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9213018A
Other languages
French (fr)
Other versions
FR2697715A1 (en
Inventor
Jean-Paul Viennois
Marc Beurier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dav SA
Original Assignee
Dav SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dav SA filed Critical Dav SA
Priority to FR9213018A priority Critical patent/FR2697715B1/en
Publication of FR2697715A1 publication Critical patent/FR2697715A1/en
Application granted granted Critical
Publication of FR2697715B1 publication Critical patent/FR2697715B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0382Continuously deformed conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0388Other aspects of conductors
    • H05K2201/0397Tab
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/09181Notches in edge pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/063Lamination of preperforated insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connection Or Junction Boxes (AREA)
FR9213018A 1992-10-30 1992-10-30 Double-sided printed circuit and electrical conduction assembly comprising such a printed circuit. Expired - Fee Related FR2697715B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9213018A FR2697715B1 (en) 1992-10-30 1992-10-30 Double-sided printed circuit and electrical conduction assembly comprising such a printed circuit.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9213018A FR2697715B1 (en) 1992-10-30 1992-10-30 Double-sided printed circuit and electrical conduction assembly comprising such a printed circuit.

Publications (2)

Publication Number Publication Date
FR2697715A1 FR2697715A1 (en) 1994-05-06
FR2697715B1 true FR2697715B1 (en) 1994-12-30

Family

ID=9435030

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9213018A Expired - Fee Related FR2697715B1 (en) 1992-10-30 1992-10-30 Double-sided printed circuit and electrical conduction assembly comprising such a printed circuit.

Country Status (1)

Country Link
FR (1) FR2697715B1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19651187A1 (en) * 1996-12-10 1998-06-18 Mannesmann Vdo Ag Device for the electrical and mechanical connection of two circuit boards arranged at a distance from one another and device with two circuit boards arranged at a distance from one another, which are connected by such a device
FR2822632B1 (en) * 2001-03-21 2004-01-23 Sagem ELECTRONIC BOARD AND CORRESPONDING CIRCUIT
DE20211560U1 (en) * 2002-07-12 2003-12-11 Ghw Grote & Hartmann Gmbh Printed circuit board element with a power supply device for electrical and electronic components arranged on the printed circuit board
US6669273B1 (en) * 2002-09-16 2003-12-30 Visteon Global Technologies, Inc. Vehicle instrument panel structure to support electronics packaging
US7781927B2 (en) 2006-10-13 2010-08-24 Lg Innotek Co., Ltd. Vibration motor

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1911779B2 (en) * 1969-03-07 1971-10-21 WIRING ARRANGEMENT FOR THE ELECTRICAL CONNECTION OF THE VARIOUS CONNECTION LEVELS
FR2068863A5 (en) * 1969-11-03 1971-09-03 Ass Ouvriers Instr Preci
US3977074A (en) * 1975-02-06 1976-08-31 General Motors Corporation Double sided printed circuit board and method for making same
JPS60109362U (en) * 1983-12-28 1985-07-25 アルプス電気株式会社 Earth structure of multilayer printed circuit board
DE8700932U1 (en) * 1987-01-21 1987-03-19 Schoeller & Co Elektronik Gmbh, 3552 Wetter Rigid printed circuit with electrical connections
FR2621774B1 (en) * 1987-10-12 1990-02-16 Dav CIRCUIT PLATE FOR HIGH CURRENTS AND PREPARATION METHOD

Also Published As

Publication number Publication date
FR2697715A1 (en) 1994-05-06

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20060630