FR2697715B1 - Double-sided printed circuit and electrical conduction assembly comprising such a printed circuit. - Google Patents
Double-sided printed circuit and electrical conduction assembly comprising such a printed circuit.Info
- Publication number
- FR2697715B1 FR2697715B1 FR9213018A FR9213018A FR2697715B1 FR 2697715 B1 FR2697715 B1 FR 2697715B1 FR 9213018 A FR9213018 A FR 9213018A FR 9213018 A FR9213018 A FR 9213018A FR 2697715 B1 FR2697715 B1 FR 2697715B1
- Authority
- FR
- France
- Prior art keywords
- printed circuit
- double
- electrical conduction
- conduction assembly
- sided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connection Or Junction Boxes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9213018A FR2697715B1 (en) | 1992-10-30 | 1992-10-30 | Double-sided printed circuit and electrical conduction assembly comprising such a printed circuit. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9213018A FR2697715B1 (en) | 1992-10-30 | 1992-10-30 | Double-sided printed circuit and electrical conduction assembly comprising such a printed circuit. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2697715A1 FR2697715A1 (en) | 1994-05-06 |
FR2697715B1 true FR2697715B1 (en) | 1994-12-30 |
Family
ID=9435030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9213018A Expired - Fee Related FR2697715B1 (en) | 1992-10-30 | 1992-10-30 | Double-sided printed circuit and electrical conduction assembly comprising such a printed circuit. |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2697715B1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19651187A1 (en) * | 1996-12-10 | 1998-06-18 | Mannesmann Vdo Ag | Device for the electrical and mechanical connection of two circuit boards arranged at a distance from one another and device with two circuit boards arranged at a distance from one another, which are connected by such a device |
FR2822632B1 (en) * | 2001-03-21 | 2004-01-23 | Sagem | ELECTRONIC BOARD AND CORRESPONDING CIRCUIT |
DE20211560U1 (en) * | 2002-07-12 | 2003-12-11 | Ghw Grote & Hartmann Gmbh | Printed circuit board element with a power supply device for electrical and electronic components arranged on the printed circuit board |
US6669273B1 (en) * | 2002-09-16 | 2003-12-30 | Visteon Global Technologies, Inc. | Vehicle instrument panel structure to support electronics packaging |
US7781927B2 (en) | 2006-10-13 | 2010-08-24 | Lg Innotek Co., Ltd. | Vibration motor |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1911779B2 (en) * | 1969-03-07 | 1971-10-21 | WIRING ARRANGEMENT FOR THE ELECTRICAL CONNECTION OF THE VARIOUS CONNECTION LEVELS | |
FR2068863A5 (en) * | 1969-11-03 | 1971-09-03 | Ass Ouvriers Instr Preci | |
US3977074A (en) * | 1975-02-06 | 1976-08-31 | General Motors Corporation | Double sided printed circuit board and method for making same |
JPS60109362U (en) * | 1983-12-28 | 1985-07-25 | アルプス電気株式会社 | Earth structure of multilayer printed circuit board |
DE8700932U1 (en) * | 1987-01-21 | 1987-03-19 | Schoeller & Co Elektronik Gmbh, 3552 Wetter | Rigid printed circuit with electrical connections |
FR2621774B1 (en) * | 1987-10-12 | 1990-02-16 | Dav | CIRCUIT PLATE FOR HIGH CURRENTS AND PREPARATION METHOD |
-
1992
- 1992-10-30 FR FR9213018A patent/FR2697715B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2697715A1 (en) | 1994-05-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20060630 |