FR2691441B1 - Moyen d'emballage de composants electroniques et mecanisme et procede d'alimentation en composants electroniques utilisant le moyen d'emballage de composants electroniques. - Google Patents
Moyen d'emballage de composants electroniques et mecanisme et procede d'alimentation en composants electroniques utilisant le moyen d'emballage de composants electroniques.Info
- Publication number
- FR2691441B1 FR2691441B1 FR9215298A FR9215298A FR2691441B1 FR 2691441 B1 FR2691441 B1 FR 2691441B1 FR 9215298 A FR9215298 A FR 9215298A FR 9215298 A FR9215298 A FR 9215298A FR 2691441 B1 FR2691441 B1 FR 2691441B1
- Authority
- FR
- France
- Prior art keywords
- electronic components
- packing
- supplying
- packaging
- packaging electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000007246 mechanism Effects 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000004806 packaging method and process Methods 0.000 title 1
- 238000012856 packing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0434—Feeding one by one by other means than belts with containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991110793U JPH0751834Y2 (ja) | 1991-12-18 | 1991-12-18 | 電子部品の自動供給装置 |
| JP4126812A JPH07112116B2 (ja) | 1992-04-20 | 1992-04-20 | 電子部品の自動供給装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2691441A1 FR2691441A1 (fr) | 1993-11-26 |
| FR2691441B1 true FR2691441B1 (fr) | 1995-06-09 |
Family
ID=26450324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9215298A Expired - Fee Related FR2691441B1 (fr) | 1991-12-18 | 1992-12-18 | Moyen d'emballage de composants electroniques et mecanisme et procede d'alimentation en composants electroniques utilisant le moyen d'emballage de composants electroniques. |
Country Status (4)
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3081400B2 (ja) * | 1993-01-18 | 2000-08-28 | 三洋電機株式会社 | 電子部品自動装着装置 |
| AT13042U1 (de) * | 2011-11-08 | 2013-05-15 | Gassner Gmbh | Vorrichtung und verfahren zur behandlung und zuführung von behälterverschlüssen |
| DE102019112258A1 (de) * | 2019-05-10 | 2020-11-12 | Homag Gmbh | Verpackung zum Verpacken von Verbrauchsmaterial und Verfahren zum Zuführen von Verbrauchsmaterial |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4033031A (en) * | 1976-04-22 | 1977-07-05 | Augat, Inc. | Method and machine for inserting electrical contacts into electrical interconnection boards |
| IT1210763B (it) * | 1986-05-27 | 1989-09-20 | Nitto Kogyo Kk | Apparecchiature per la separazione e l allineamento di chip |
| JPH0620910B2 (ja) * | 1987-04-20 | 1994-03-23 | 株式会社村田製作所 | 電子部品チツプ収納カセツト |
| US5143253A (en) * | 1988-09-02 | 1992-09-01 | Tdk Corporation | Chip packaging means and supply mechanism for supplying chips by using the chip packaging means |
-
1992
- 1992-12-17 GB GB9226271A patent/GB2262736B/en not_active Expired - Fee Related
- 1992-12-18 DE DE19924243083 patent/DE4243083A1/de not_active Withdrawn
- 1992-12-18 FR FR9215298A patent/FR2691441B1/fr not_active Expired - Fee Related
- 1992-12-18 TW TW81110197A patent/TW240369B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW240369B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1995-02-11 |
| FR2691441A1 (fr) | 1993-11-26 |
| GB9226271D0 (en) | 1993-02-10 |
| GB2262736A (en) | 1993-06-30 |
| GB2262736B (en) | 1995-06-21 |
| DE4243083A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-07-01 |
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| FR2691441B1 (fr) | Moyen d'emballage de composants electroniques et mecanisme et procede d'alimentation en composants electroniques utilisant le moyen d'emballage de composants electroniques. | |
| DE69101368D1 (de) | Vorrichtung zum Befüllen von Behältern. | |
| DE69202069D1 (de) | Vorrichtung zum Verpacken von Portionsverpackungen in Kisten. |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |
Effective date: 20060831 |