FR2640404A1 - Method for manufacturing a grooved plate intended for fitting electronics cards (boards) and plate obtained by this method - Google Patents

Method for manufacturing a grooved plate intended for fitting electronics cards (boards) and plate obtained by this method Download PDF

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Publication number
FR2640404A1
FR2640404A1 FR8816213A FR8816213A FR2640404A1 FR 2640404 A1 FR2640404 A1 FR 2640404A1 FR 8816213 A FR8816213 A FR 8816213A FR 8816213 A FR8816213 A FR 8816213A FR 2640404 A1 FR2640404 A1 FR 2640404A1
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FR
France
Prior art keywords
plate
boards
manufacturing
intended
cards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR8816213A
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French (fr)
Inventor
Bertrand Auffray
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8816213A priority Critical patent/FR2640404A1/en
Publication of FR2640404A1 publication Critical patent/FR2640404A1/en
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627Liquid coolant without phase change
    • H05K7/20636Liquid coolant without phase change within sub-racks for removing heat from electronic boards

Abstract

Method for manufacturing a cold plate used for positioning electronics cards (boards) using its grooves. In order to improve the cooling of the electronics cards (boards) 4, using cold plates 1 in contact with the heat drain 40 of the cards (boards), a channel 2 is made in the plate 1 for making a heat-exchange liquid R flow through it. Application to electronics cards (boards) casings.

Description

Procédé de fabrication d'une plaque a rainures
destinée â positionner des cartes électroniques et
plaque obtenue par ce procédé.
Method of manufacturing a grooved plate
intended to position electronic cards and
plate obtained by this process.

La présente invention concerne un procédé de fabrication des plaques à rainures, dites aussi plaques froides, destinées à être utilisées deux par deux pour le positionnement de cartes électroniques dans un bac à carte, un châssis, une armoire... La présente invention concerne également les plaques froides obtenues par ce procédé. The present invention relates to a method of manufacturing grooved plates, also called cold plates, intended to be used in pairs for the positioning of electronic cards in a card tray, a chassis, a cabinet, etc. The present invention also relates to the cold plates obtained by this process.

Il est connu de disposer face à face, à une distance donnée, des plaques à rainures, de manière que leurs rainures soient parallèles et que deux rainures en regard puissent servir de glissières parallèles pour positionner une carte électronique. Deux cotés opposés de la carte sont respectivement glissés dans deux rainures en regard et, dans chaque rainure, les cartes sont plaquées contre l'un des flancs de la rainure à l'aide d'un guide-carte ; - ainsi, non seulement la carte est maintenue, mais en plus elle peut évacuer, vers les deux plaques, les calories produites par le fonctionnement de ses circuits électroniques. It is known to have facing plates, at a given distance, with grooved plates, so that their grooves are parallel and that two facing grooves can serve as parallel slides for positioning an electronic card. Two opposite sides of the card are respectively slid into two facing grooves and, in each groove, the cards are pressed against one of the sides of the groove using a card guide; - Thus, not only is the card maintained, but in addition it can evacuate, towards the two plates, the calories produced by the operation of its electronic circuits.

Ces plaques connues, qui peuvent être obtenues par fonderie ou par usinage, sont parfois insuffisantes pour évacuer les calories, d'où la nécessité de réduire la densité des circuits et donc d'augmenter le volume du matériel. Il est à noter qu'il est connu, pour améliorer l'évacuation de calories, de réaliser une ventilation des plaques froides par air pulsé, mais, pour être efficace, une telle ventilation nécessite que l'air circule facilement derrière les plaques, ce qui ne contribue pas à diminuer le volume du matériel. These known plates, which can be obtained by foundry or by machining, are sometimes insufficient to remove calories, hence the need to reduce the density of the circuits and therefore increase the volume of the material. It should be noted that it is known, to improve the evacuation of calories, to carry out a ventilation of the cold plates by forced air, but, to be effective, such ventilation requires that the air circulates easily behind the plates, this which does not help to decrease the volume of the material.

La présente invention a pour but d'éviter ou, pour le moins, de réduire ces inconvénients. The object of the present invention is to avoid or at least reduce these drawbacks.

Ceci est obtenu, en particulier, en réalisant les plaques de manière à pouvoir les refroidir au moyen d'une circulation de liquide.  This is obtained, in particular, by producing the plates so as to be able to cool them by means of a circulation of liquid.

Selon l'invention un procédé de fabrication d'une plaque à rainure destinée à positionner des cartes électroniques, est caractérisé en ce qu'il consiste à réaliser la plaque avec un conduit débouchant, à ses extrémités, hors de la plaque, ce conduit étant destiné à la circulation d'un liquide de refroidissement. According to the invention a method of manufacturing a grooved plate intended for positioning electronic cards, is characterized in that it consists in producing the plate with a conduit opening, at its ends, out of the plate, this conduit being intended for the circulation of a coolant.

La présente invention sera mieux comprise et d'autres caractéristiques apparaîtront à l'aide de la description ci-après et des figures sty rapportant qui représentent
- la figure 1, une vue partielle, en coupe, montrant une plaque réalisée selon l'invention, associée à deux cartes électroniques,
- la figure 2, un élément destiné à la fabrication d'une plaque selon l'invention,
- la figure 3, une plaque réalisée selon l'invention, vue de côté.
The present invention will be better understood and other characteristics will appear with the aid of the description below and of the related reporting figures which represent
FIG. 1, a partial view, in section, showing a plate produced according to the invention, associated with two electronic cards,
FIG. 2, an element intended for the manufacture of a plate according to the invention,
- Figure 3, a plate made according to the invention, side view.

Sur les différentes figures les éléments correspondants sont désignés par les mêmes symboles. In the various figures, the corresponding elements are designated by the same symbols.

La figure 1 montre, vue en coupe partielle, une plaque froide, 1, destinée à positionner des cartes électroniques. Figure 1 shows, partial sectional view, a cold plate, 1, for positioning electronic cards.

Cette plaque présente, sur l'un de ses côtés, des rainures parallèles, telles que 10 ; le plan de coupe est perpendiculaire à la plus grande dimension des rainures et, par là même, aux cartes électroniques, telles que 4, qui pénètrent, par l'un de leurs côtés, dans deux des trois rainures représentées.This plate has, on one of its sides, parallel grooves, such as 10; the cutting plane is perpendicular to the largest dimension of the grooves and, thereby, to electronic cards, such as 4, which penetrate, by one of their sides, in two of the three grooves shown.

Les cartes comportent, de part et d'autre d'un drain thermique 40, deux substrats, tels que 41, sur lesquels sont soudés des composants électroniques tels que 42. The cards comprise, on either side of a heat sink 40, two substrates, such as 41, on which electronic components such as 42 are welded.

Les drains tels que 40 sont plaqués contre l'un des flancs, 11, de la rainure dans laquelle ils ont pénétré, par un guide-carte tel que 3. Ces guide-carte, que l'on trouve dans le commerce, comportent un corps, 30, à section sensiblement en équerre, une lame ressort 31 solidaire du corps et une came 32 retenue prisonnière entre le corps et la lame ressort ; la came permet d'écal ter plus ou moins, selon sa position, les parties de la lame ressort 31 et du corps 30 entre lesquelles elle est interposée. The drains such as 40 are pressed against one of the sides, 11, of the groove in which they have penetrated, by a card guide such as 3. These card guides, which are commercially available, include a body, 30, of substantially square section, a leaf spring 31 secured to the body and a cam 32 held captive between the body and the leaf spring; the cam allows to spread more or less, depending on its position, the parts of the leaf spring 31 and of the body 30 between which it is interposed.

Avec un montage selon la figure I une partie des calories produites par les circuits des cartes électroniques, est évacuée en suivant un trajet du type : composant électronique 42, substrat 41, drain thermique 40, plaque froide 1, air ambiant. De plus il est à remarquer que la plaque 1 comporte un conduit 2 à travers lequel circule un liquide de refroidissement R dont le sens de circulation a été repéré par une flèche F; ainsi, au refroidissement par l'air ambiant s'ajoute un refroidissement par le liquide R. Dans l'exemple décrit, le liquide de refroidissement est de l'eau distillée, fournie à une température de 32 degrés Celsius et le circuit de refroidissement comporte un filtre ; de l'eau douce aurait également pu être utilisée dans l'exemple décrit, car, comme il va être vu ci-après, le conduit est en acier inoxydable. With an arrangement according to FIG. I, part of the calories produced by the circuits of the electronic cards is removed by following a path of the type: electronic component 42, substrate 41, heat sink 40, cold plate 1, ambient air. In addition, it should be noted that the plate 1 comprises a duct 2 through which circulates a cooling liquid R, the direction of circulation of which has been identified by an arrow F; thus, to cooling by ambient air is added cooling by liquid R. In the example described, the cooling liquid is distilled water, supplied at a temperature of 32 degrees Celsius and the cooling circuit comprises a filter ; fresh water could also have been used in the example described, because, as will be seen below, the duct is made of stainless steel.

La plaque 1 de la figure 1 est réalisée à partir d'un tube, 20, en acier inoxydable, de 4 mm de diamètre intérieur et 6 mm de diamètre extérieur. Ce tube est cintré pour donner un serpentin et est muni, à chacune de ses extrémités, d'un raccord, Al, A2. La figure 2 montre la pièce ainsi obtenue, qui va constituer le conduit 2 dont il a été question lors de la description de la figure 1 ; cette pièce est positionnée dans un moule de fonderie dont les parois intérieures reproduisent les parois extérieures de la plaque froide ; pour assurer le positionnement du serpentin des petites pattes en acier inoxydable maintiennent l'écartement entre les différentes parties du tube et le serpentin est placé dans le moule à l'aide de cales en aluminium qui fondent au moment de la coulée du métal de fonderie dans le moule.Après démoulage les flancs des rainures de la plaque ainsi obtenue sont rectifiées à la machine-outil, de manière à assurer un bon contact, et donc un bon échange thermique, entre la plaque froide et le drain des cartes électroniques.  The plate 1 of FIG. 1 is produced from a tube, 20, made of stainless steel, with an inside diameter of 4 mm and an outside diameter of 6 mm. This tube is bent to give a coil and is provided, at each of its ends, with a connector, Al, A2. Figure 2 shows the part thus obtained, which will constitute the conduit 2 which was discussed during the description of Figure 1; this part is positioned in a foundry mold whose interior walls reproduce the exterior walls of the cold plate; to ensure the positioning of the coil, small stainless steel legs maintain the spacing between the different parts of the tube and the coil is placed in the mold using aluminum shims which melt when the foundry metal is poured into After demolding, the sides of the grooves of the plate thus obtained are rectified with a machine tool, so as to ensure good contact, and therefore good heat exchange, between the cold plate and the drain of the electronic cards.

La figure 3 montre, vue de côté, une plaque froide, 1, ainsi obtenue. Sur cette figure le raccord A2 est caché par le raccord Al, par contre le conduit 2 a été représenté en traits interrompus, comme vu par transparence. Figure 3 shows, side view, a cold plate, 1, thus obtained. In this figure the connector A2 is hidden by the connector Al, on the other hand the conduit 2 has been shown in broken lines, as seen by transparency.

La présente invention n'est pas limitée aux exemples décrits, elle s'applique d'une façon plus générale à tous les procédés de fabrication d'une plaque froide à l'intérieur de laquelle il est prévu de faire circuler un liquide caloporteur et ceci quelle que soit la forme du circuit de refroidissement et le type de liquide caloporteur ; c'est ainsi par exemple que le conduit peut être réalisé comme indiqué sur la figure 2 mais, au lieu d'être pratiquement totalement noyé dans le reste de la plaque, comme indiqué sur la figure 3, il peut être intimement accolé contre le reste de la plaque, sur la face opposée aux rainures. Il est également possible d'envisager deux demi-plaques à assembler face contre face avec, sur chacune des faces en regard, une gorge destinée à constituer un demi-conduit et, de part et d'autre de cette gorge, deux gorges peu profondes destinées à recevoir un joint d'étanchéité.  The present invention is not limited to the examples described, it applies more generally to all the methods of manufacturing a cold plate inside which it is intended to circulate a heat transfer liquid and this whatever the shape of the cooling circuit and the type of coolant; this is how, for example, the duct can be made as shown in Figure 2 but, instead of being almost completely embedded in the rest of the plate, as shown in Figure 3, it can be intimately joined against the rest of the plate, on the face opposite the grooves. It is also possible to envisage two half-plates to be assembled face against face with, on each of the facing faces, a groove intended to constitute a half-duct and, on either side of this groove, two shallow grooves intended to receive a seal.

Claims (4)

REVENDICATIONS 1. Procédé de fabrication d'une plaque à rainures (1) destinée à positionner des cartes électroniques (4), caractérisé en ce qu'il consiste à réaliser la plaque avec un conduit (2) débouchant, å ses extrémités (Al, A2), hors de la plaque, ce conduit étant destiné à la circulation d'un liquide de refroidissement (R). 1. Method of manufacturing a grooved plate (1) intended to position electronic cards (4), characterized in that it consists in producing the plate with a conduit (2) opening out, at its ends (Al, A2 ), outside the plate, this duct being intended for the circulation of a cooling liquid (R). 2. Procédé selon la revendication 1. caractérisé en ce qu'il consiste à réaliser le conduit (2) à partir d'un tube creux (20), coudé en forme de serpentin, à fabriquer un moule pour obtenir la plaque (1) par fonderie, à positionner le tube dans le moule et à produire alors la plaque par fonderie. 2. Method according to claim 1. characterized in that it consists in producing the conduit (2) from a hollow tube (20), bent in the form of a serpentine, to manufacture a mold to obtain the plate (1) by foundry, positioning the tube in the mold and then producing the plate by foundry. 3. Procédé selon la revendication 2, caractérisé en ce qu'il consiste à rectifier l'intérieur des rainures (10) de la plaque (1) obtenue par fonderie, de manière à favoriser le contact et donc les échanges thermiques entre la plaque (1) et les cartes (4). 3. Method according to claim 2, characterized in that it consists in rectifying the interior of the grooves (10) of the plate (1) obtained by foundry, so as to promote contact and therefore the heat exchanges between the plate ( 1) and the cards (4). 4. Plaque à rainures pour le positionnement de cartes électroniques, caractérisée en ce qu'elle est obtenue à l'aide d'un procédé décrit dans l'une au moins des revendications précédentes.  4. Grooved plate for positioning electronic cards, characterized in that it is obtained using a method described in at least one of the preceding claims.
FR8816213A 1988-12-09 1988-12-09 Method for manufacturing a grooved plate intended for fitting electronics cards (boards) and plate obtained by this method Withdrawn FR2640404A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8816213A FR2640404A1 (en) 1988-12-09 1988-12-09 Method for manufacturing a grooved plate intended for fitting electronics cards (boards) and plate obtained by this method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8816213A FR2640404A1 (en) 1988-12-09 1988-12-09 Method for manufacturing a grooved plate intended for fitting electronics cards (boards) and plate obtained by this method

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FR2640404A1 true FR2640404A1 (en) 1990-06-15

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013180790A1 (en) 2012-05-11 2013-12-05 Raytheon Company Electronics enclosures with high thermal performance and related system and method
US9095078B2 (en) 2012-08-16 2015-07-28 International Business Machines Corporation Actively controlling coolant-cooled cold plate configuration

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3631325A (en) * 1970-06-15 1971-12-28 Sperry Rand Corp Card module and end wall treatment facilitating heat transfer and sliding
US4298904A (en) * 1979-12-17 1981-11-03 The Boeing Company Electronic conduction cooling clamp
EP0199621A1 (en) * 1985-04-16 1986-10-29 Socapex Thermal connector for a printed-circuit board clad with electronic components
US4720981A (en) * 1986-12-23 1988-01-26 American Standard Inc. Cooling of air conditioning control electronics

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3631325A (en) * 1970-06-15 1971-12-28 Sperry Rand Corp Card module and end wall treatment facilitating heat transfer and sliding
US4298904A (en) * 1979-12-17 1981-11-03 The Boeing Company Electronic conduction cooling clamp
EP0199621A1 (en) * 1985-04-16 1986-10-29 Socapex Thermal connector for a printed-circuit board clad with electronic components
US4720981A (en) * 1986-12-23 1988-01-26 American Standard Inc. Cooling of air conditioning control electronics

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013180790A1 (en) 2012-05-11 2013-12-05 Raytheon Company Electronics enclosures with high thermal performance and related system and method
EP2848106A4 (en) * 2012-05-11 2015-11-04 Raytheon Co Electronics enclosures with high thermal performance and related system and method
US9095078B2 (en) 2012-08-16 2015-07-28 International Business Machines Corporation Actively controlling coolant-cooled cold plate configuration
US9326429B2 (en) 2012-08-16 2016-04-26 International Business Machines Corporation Actively controlling coolant-cooled cold plate configuration

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