FR2450503A1 - Housing for semiconductor device - has borosilicate glass seal with specified coefft. of thermal expansion for alloy leads to eyelet carrier - Google Patents
Housing for semiconductor device - has borosilicate glass seal with specified coefft. of thermal expansion for alloy leads to eyelet carrierInfo
- Publication number
- FR2450503A1 FR2450503A1 FR8004531A FR8004531A FR2450503A1 FR 2450503 A1 FR2450503 A1 FR 2450503A1 FR 8004531 A FR8004531 A FR 8004531A FR 8004531 A FR8004531 A FR 8004531A FR 2450503 A1 FR2450503 A1 FR 2450503A1
- Authority
- FR
- France
- Prior art keywords
- housing
- semiconductor device
- thermal expansion
- borosilicate glass
- glass seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
Abstract
Housing for a semiconductor device contains an eyelet carrier of Fe-Ni alloy (42% Ni, rest Fe). It has Fe-Ni-Co (29% Ni, 17% Co, rest Fe) leads hermetically sealed with a borosilicate glass. The glass pref. has a coefft. of thermal expansion of ca. 4.6 x 10-6 cm/cm degrees C. The integrity of the seal is maintained during temp. variations during mfr. and test. The housing, esp. a TO-5 housing, is reliable and capable of withstanding extreme thermal shock or heat cycles.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1675679A | 1979-03-02 | 1979-03-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2450503A1 true FR2450503A1 (en) | 1980-09-26 |
Family
ID=21778792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8004531A Pending FR2450503A1 (en) | 1979-03-02 | 1980-02-29 | Housing for semiconductor device - has borosilicate glass seal with specified coefft. of thermal expansion for alloy leads to eyelet carrier |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS55146949A (en) |
DE (1) | DE3007141A1 (en) |
FR (1) | FR2450503A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3618203A (en) * | 1969-08-25 | 1971-11-09 | Olin Mathieson | Method of making a glass or ceramic-to-composite metal seal |
US3689996A (en) * | 1966-05-19 | 1972-09-12 | Philips Corp | Manufacturing a plurality of semiconductor device headers |
US4128697A (en) * | 1977-04-22 | 1978-12-05 | Corning Glass Works | Hermetic glass-metal compression seal |
FR2427758A1 (en) * | 1978-06-03 | 1979-12-28 | Jenaer Glaswerk Schott & Gen | BOX FOR ELECTRICAL AND ELECTRONIC COMPONENTS |
-
1980
- 1980-02-26 DE DE19803007141 patent/DE3007141A1/en not_active Withdrawn
- 1980-02-28 JP JP2463080A patent/JPS55146949A/en active Pending
- 1980-02-29 FR FR8004531A patent/FR2450503A1/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3689996A (en) * | 1966-05-19 | 1972-09-12 | Philips Corp | Manufacturing a plurality of semiconductor device headers |
US3618203A (en) * | 1969-08-25 | 1971-11-09 | Olin Mathieson | Method of making a glass or ceramic-to-composite metal seal |
US4128697A (en) * | 1977-04-22 | 1978-12-05 | Corning Glass Works | Hermetic glass-metal compression seal |
FR2427758A1 (en) * | 1978-06-03 | 1979-12-28 | Jenaer Glaswerk Schott & Gen | BOX FOR ELECTRICAL AND ELECTRONIC COMPONENTS |
Also Published As
Publication number | Publication date |
---|---|
DE3007141A1 (en) | 1980-09-11 |
JPS55146949A (en) | 1980-11-15 |
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