FR2446582B1 - - Google Patents
Info
- Publication number
- FR2446582B1 FR2446582B1 FR7900780A FR7900780A FR2446582B1 FR 2446582 B1 FR2446582 B1 FR 2446582B1 FR 7900780 A FR7900780 A FR 7900780A FR 7900780 A FR7900780 A FR 7900780A FR 2446582 B1 FR2446582 B1 FR 2446582B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automatic Assembly (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7900780A FR2446582A1 (fr) | 1979-01-12 | 1979-01-12 | Positionnement de microcomposants, notamment pour les circuits a couches epaisses ou a couches minces |
| EP80400039A EP0014119A1 (fr) | 1979-01-12 | 1980-01-11 | Positionnement de microcomposants, notamment pour les circuits à couches épaisses ou à couches minces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7900780A FR2446582A1 (fr) | 1979-01-12 | 1979-01-12 | Positionnement de microcomposants, notamment pour les circuits a couches epaisses ou a couches minces |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2446582A1 FR2446582A1 (fr) | 1980-08-08 |
| FR2446582B1 true FR2446582B1 (US20100170793A1-20100708-C00006.png) | 1982-07-02 |
Family
ID=9220696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7900780A Granted FR2446582A1 (fr) | 1979-01-12 | 1979-01-12 | Positionnement de microcomposants, notamment pour les circuits a couches epaisses ou a couches minces |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0014119A1 (US20100170793A1-20100708-C00006.png) |
| FR (1) | FR2446582A1 (US20100170793A1-20100708-C00006.png) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE454643B (sv) * | 1983-06-13 | 1988-05-16 | Sincotron Aps | Sett och anordning for att pa ett kretskort montera elektroniska komponenter |
| US4626167A (en) * | 1984-03-22 | 1986-12-02 | Thomson Components-Mostek Corporation | Manipulation and handling of integrated circuit dice |
| DE3525866A1 (de) * | 1985-07-19 | 1987-01-29 | Jakob Herrmann | Vorrichtung fuer die pruefung und/oder bearbeitung von kleinbauteilen |
| US4669416A (en) * | 1986-06-25 | 1987-06-02 | Metoramic Sciences, Inc. | Composite carrier plate |
| US4868974A (en) * | 1987-09-01 | 1989-09-26 | Sumitomo Electric Industries, Ltd. | Chip mounting apparatus |
| US5337893A (en) * | 1992-07-22 | 1994-08-16 | Electro Scientific Industries, Inc. | High capacity carrier plate |
| CN107318255A (zh) * | 2017-07-19 | 2017-11-03 | 大连东软信息学院 | 一种可扩展电子元器件选择装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3608175A (en) * | 1969-12-29 | 1971-09-28 | Union Carbide Corp | System for the storage,transportation and feeding of electronic components |
-
1979
- 1979-01-12 FR FR7900780A patent/FR2446582A1/fr active Granted
-
1980
- 1980-01-11 EP EP80400039A patent/EP0014119A1/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP0014119A1 (fr) | 1980-08-06 |
| FR2446582A1 (fr) | 1980-08-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RE | Withdrawal of published application |