FR2433830B1 - - Google Patents
Info
- Publication number
- FR2433830B1 FR2433830B1 FR7919142A FR7919142A FR2433830B1 FR 2433830 B1 FR2433830 B1 FR 2433830B1 FR 7919142 A FR7919142 A FR 7919142A FR 7919142 A FR7919142 A FR 7919142A FR 2433830 B1 FR2433830 B1 FR 2433830B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/921,643 US4209355A (en) | 1978-07-26 | 1978-07-26 | Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2433830A1 FR2433830A1 (fr) | 1980-03-14 |
FR2433830B1 true FR2433830B1 (fr) | 1983-11-10 |
Family
ID=25445730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7919142A Granted FR2433830A1 (fr) | 1978-07-26 | 1979-07-25 | Procede de fabrication de ruban composite bossele pour le soudage en serie automatique de dispositifs semi-conducteurs |
Country Status (6)
Country | Link |
---|---|
US (1) | US4209355A (fr) |
JP (1) | JPS5519900A (fr) |
CA (1) | CA1124407A (fr) |
DE (1) | DE2926200A1 (fr) |
FR (1) | FR2433830A1 (fr) |
GB (1) | GB2025129B (fr) |
Families Citing this family (64)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4295912A (en) * | 1978-07-03 | 1981-10-20 | National Semiconductor Corporation | Apparatus and process for laminating composite tape |
US4283839A (en) * | 1978-07-26 | 1981-08-18 | Western Electric Co., Inc. | Method of bonding semiconductor devices to carrier tapes |
US4439918A (en) * | 1979-03-12 | 1984-04-03 | Western Electric Co., Inc. | Methods of packaging an electronic device |
US4355463A (en) * | 1980-03-24 | 1982-10-26 | National Semiconductor Corporation | Process for hermetically encapsulating semiconductor devices |
EP0059187A1 (fr) * | 1980-09-08 | 1982-09-08 | Mostek Corporation | Bande de vieillissement accelere a une seule couche pour circuit integre |
US4616412A (en) * | 1981-01-13 | 1986-10-14 | Schroeder Jon M | Method for bonding electrical leads to electronic devices |
FR2498814B1 (fr) * | 1981-01-26 | 1985-12-20 | Burroughs Corp | Boitier pour circuit integre, moyen pour le montage et procede de fabrication |
US4386389A (en) * | 1981-09-08 | 1983-05-31 | Mostek Corporation | Single layer burn-in tape for integrated circuit |
EP0102988B1 (fr) * | 1982-03-08 | 1988-09-21 | Motorola, Inc. | Assemblage de conducteurs a circuits integres |
US4396457A (en) * | 1982-03-17 | 1983-08-02 | E. I. Du Pont De Nemours And Company | Method of making bumped-beam tape |
GB2129612B (en) * | 1982-09-30 | 1987-05-07 | Sumitomo Metal Mining Co | Manufacture of carrier tapes |
US4551912A (en) * | 1983-06-30 | 1985-11-12 | International Business Machines Corporation | Highly integrated universal tape bonding |
US4607779A (en) * | 1983-08-11 | 1986-08-26 | National Semiconductor Corporation | Non-impact thermocompression gang bonding method |
US4560826A (en) * | 1983-12-29 | 1985-12-24 | Amp Incorporated | Hermetically sealed chip carrier |
US4754912A (en) * | 1984-04-05 | 1988-07-05 | National Semiconductor Corporation | Controlled collapse thermocompression gang bonding |
DE3522852C2 (de) * | 1985-06-26 | 1994-06-01 | Gao Ges Automation Org | Verfahren zur Herstellung eines Zwischenträgers für Halbleiterkörper |
US4810620A (en) * | 1985-06-26 | 1989-03-07 | National Semiconductor Corporation | Nickel plated tape |
US4707418A (en) * | 1985-06-26 | 1987-11-17 | National Semiconductor Corporation | Nickel plated copper tape |
GB2178895B (en) * | 1985-08-06 | 1988-11-23 | Gen Electric Co Plc | Improved preparation of fragile devices |
US4701363A (en) * | 1986-01-27 | 1987-10-20 | Olin Corporation | Process for manufacturing bumped tape for tape automated bonding and the product produced thereby |
US4709468A (en) * | 1986-01-31 | 1987-12-01 | Texas Instruments Incorporated | Method for producing an integrated circuit product having a polyimide film interconnection structure |
GB2211351B (en) * | 1986-02-28 | 1990-03-21 | Seiko Epson Corp | Method of forming an integrated circuit assembly or part thereof |
US4795694A (en) * | 1986-06-20 | 1989-01-03 | Siemens Aktiengesellschaft | Manufacture of fine structures for semiconductor contacting |
DE3785720T2 (de) * | 1986-09-25 | 1993-08-12 | Toshiba Kawasaki Kk | Verfahren zum herstellen eines filmtraegers. |
US4735678A (en) * | 1987-04-13 | 1988-04-05 | Olin Corporation | Forming a circuit pattern in a metallic tape by electrical discharge machining |
US5106784A (en) * | 1987-04-16 | 1992-04-21 | Texas Instruments Incorporated | Method of making a post molded cavity package with internal dam bar for integrated circuit |
JPH0740600B2 (ja) * | 1987-04-30 | 1995-05-01 | 三菱電機株式会社 | 半導体装置 |
JPH0526746Y2 (fr) * | 1987-07-14 | 1993-07-07 | ||
US4849857A (en) * | 1987-10-05 | 1989-07-18 | Olin Corporation | Heat dissipating interconnect tape for use in tape automated bonding |
US4827376A (en) * | 1987-10-05 | 1989-05-02 | Olin Corporation | Heat dissipating interconnect tape for use in tape automated bonding |
US5068712A (en) * | 1988-09-20 | 1991-11-26 | Hitachi, Ltd. | Semiconductor device |
JP2708191B2 (ja) | 1988-09-20 | 1998-02-04 | 株式会社日立製作所 | 半導体装置 |
US4967260A (en) * | 1988-05-04 | 1990-10-30 | International Electronic Research Corp. | Hermetic microminiature packages |
US4949161A (en) * | 1988-12-23 | 1990-08-14 | Micron Technology, Inc. | Interdigitized leadframe strip |
US5023202A (en) * | 1989-07-14 | 1991-06-11 | Lsi Logic Corporation | Rigid strip carrier for integrated circuits |
US5073521A (en) * | 1989-11-15 | 1991-12-17 | Olin Corporation | Method for housing a tape-bonded electronic device and the package employed |
JPH0413302U (fr) * | 1990-05-25 | 1992-02-03 | ||
DE4017863C1 (fr) * | 1990-06-02 | 1991-07-18 | Du Pont De Nemours (Deutschland) Gmbh, 4000 Duesseldorf, De | |
US5060052A (en) * | 1990-09-04 | 1991-10-22 | Motorola, Inc. | TAB bonded semiconductor device having off-chip power and ground distribution |
KR930010072B1 (ko) * | 1990-10-13 | 1993-10-14 | 금성일렉트론 주식회사 | Ccd패키지 및 그 제조방법 |
FR2678428B1 (fr) * | 1991-06-27 | 1993-09-03 | Bull Sa | Support et element de support de circuits integres et leur procede de fabrication. |
JPH07214507A (ja) * | 1994-06-13 | 1995-08-15 | Noda Corp | 建 材 |
US5545921A (en) | 1994-11-04 | 1996-08-13 | International Business Machines, Corporation | Personalized area leadframe coining or half etching for reduced mechanical stress at device edge |
JP2626621B2 (ja) * | 1995-04-21 | 1997-07-02 | 日本電気株式会社 | 半導体装置の製造方法 |
JP2894254B2 (ja) * | 1995-09-20 | 1999-05-24 | ソニー株式会社 | 半導体パッケージの製造方法 |
JPH08207009A (ja) * | 1995-11-17 | 1996-08-13 | Tomiyasu Honda | 積層板 |
JPH08207010A (ja) * | 1995-11-17 | 1996-08-13 | Tomiyasu Honda | 積層板 |
US6005287A (en) * | 1995-11-24 | 1999-12-21 | Nec Corporation | Semiconductor device, and lead frame used therefor |
JP3558459B2 (ja) * | 1996-02-08 | 2004-08-25 | 沖電気工業株式会社 | インナーリード接続方法 |
JPH08309705A (ja) * | 1996-03-11 | 1996-11-26 | Noda Corp | 建 材 |
US6277225B1 (en) * | 1996-03-13 | 2001-08-21 | Micron Technology, Inc. | Stress reduction feature for LOC lead frame |
JPH09312374A (ja) | 1996-05-24 | 1997-12-02 | Sony Corp | 半導体パッケージ及びその製造方法 |
FR2749974B1 (fr) * | 1996-06-13 | 1998-08-14 | Bull Sa | Procede de montage d'un circuit integre sur un support et support en resultant |
KR100216064B1 (ko) * | 1996-10-04 | 1999-08-16 | 윤종용 | 반도체 칩 패키지 |
JPH10150069A (ja) * | 1996-11-21 | 1998-06-02 | Sony Corp | 半導体パッケージ及びその製造方法 |
US5923081A (en) | 1997-05-15 | 1999-07-13 | Micron Technology, Inc. | Compression layer on the leadframe to reduce stress defects |
US6222136B1 (en) * | 1997-11-12 | 2001-04-24 | International Business Machines Corporation | Printed circuit board with continuous connective bumps |
JP2000173952A (ja) * | 1998-12-03 | 2000-06-23 | Fujitsu Quantum Device Kk | 半導体装置及びその製造方法 |
US6782610B1 (en) * | 1999-05-21 | 2004-08-31 | North Corporation | Method for fabricating a wiring substrate by electroplating a wiring film on a metal base |
DE10014620A1 (de) * | 2000-03-24 | 2001-09-27 | Andreas Plettner | Verfahren zur Herstellung eines Trägerbandes mit einer Vielzahl von elektrischen Einheiten, jeweils aufweisend einen Chip und Kontaktelemente |
US7005729B2 (en) * | 2002-04-24 | 2006-02-28 | Intel Corporation | Device packaging using tape automated bonding (TAB) strip bonded to strip carrier frame |
US20040108580A1 (en) * | 2002-12-09 | 2004-06-10 | Advanpack Solutions Pte. Ltd. | Leadless semiconductor packaging structure with inverted flip chip and methods of manufacture |
JP2006278837A (ja) * | 2005-03-30 | 2006-10-12 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板 |
KR102170192B1 (ko) | 2013-08-22 | 2020-10-26 | 삼성전자주식회사 | 본딩 방법, 본딩 장치, 그리고 기판 제조 방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3440027A (en) * | 1966-06-22 | 1969-04-22 | Frances Hugle | Automated packaging of semiconductors |
US3480836A (en) * | 1966-08-11 | 1969-11-25 | Ibm | Component mounted in a printed circuit |
US3689991A (en) * | 1968-03-01 | 1972-09-12 | Gen Electric | A method of manufacturing a semiconductor device utilizing a flexible carrier |
US3763404A (en) * | 1968-03-01 | 1973-10-02 | Gen Electric | Semiconductor devices and manufacture thereof |
DE2151765C2 (de) * | 1970-11-05 | 1983-06-16 | Honeywell Information Systems Italia S.p.A., Caluso, Torino | Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen |
US3781596A (en) * | 1972-07-07 | 1973-12-25 | R Galli | Semiconductor chip carriers and strips thereof |
US3838984A (en) * | 1973-04-16 | 1974-10-01 | Sperry Rand Corp | Flexible carrier and interconnect for uncased ic chips |
JPS501786A (fr) * | 1973-05-02 | 1975-01-09 | ||
DE2350026B2 (de) * | 1973-10-05 | 1979-07-26 | Robert Bosch Gmbh, 7000 Stuttgart | Verfahren zur Herstellung einer mit einem isolierenden Träger verbundenen Vielfach-Elektrodenanordnung |
US3968563A (en) * | 1975-03-27 | 1976-07-13 | E. I. Du Pont De Nemours And Company | Precision registration system for leads |
FR2311406A1 (fr) * | 1975-05-13 | 1976-12-10 | Honeywell Bull Soc Ind | Perfectionnements aux procedes de fabrication de supports de conditionnement de micro-plaquettes de circuits integres |
US4063993A (en) * | 1975-07-07 | 1977-12-20 | National Semiconductor Corporation | Method of making gang bonding interconnect tape for semiconductive devices |
-
1978
- 1978-07-26 US US05/921,643 patent/US4209355A/en not_active Expired - Lifetime
-
1979
- 1979-06-15 GB GB7920855A patent/GB2025129B/en not_active Expired
- 1979-06-29 DE DE19792926200 patent/DE2926200A1/de active Granted
- 1979-07-20 CA CA332,304A patent/CA1124407A/fr not_active Expired
- 1979-07-25 FR FR7919142A patent/FR2433830A1/fr active Granted
- 1979-07-26 JP JP9556079A patent/JPS5519900A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
GB2025129A (en) | 1980-01-16 |
DE2926200C2 (fr) | 1989-12-28 |
DE2926200A1 (de) | 1980-02-14 |
JPS5519900A (en) | 1980-02-12 |
GB2025129B (en) | 1982-12-01 |
FR2433830A1 (fr) | 1980-03-14 |
US4209355A (en) | 1980-06-24 |
CA1124407A (fr) | 1982-05-25 |
JPS647503B2 (fr) | 1989-02-09 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse | ||
ST | Notification of lapse | ||
ST | Notification of lapse |