FR2409535A1 - HEAT-RESISTANT "PHOTORESIST" COMPOSITION AND METHOD FOR PREPARING THE SAME - Google Patents

HEAT-RESISTANT "PHOTORESIST" COMPOSITION AND METHOD FOR PREPARING THE SAME

Info

Publication number
FR2409535A1
FR2409535A1 FR7832525A FR7832525A FR2409535A1 FR 2409535 A1 FR2409535 A1 FR 2409535A1 FR 7832525 A FR7832525 A FR 7832525A FR 7832525 A FR7832525 A FR 7832525A FR 2409535 A1 FR2409535 A1 FR 2409535A1
Authority
FR
France
Prior art keywords
composition
weight
parts
photoresist
resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7832525A
Other languages
French (fr)
Other versions
FR2409535B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13725677A external-priority patent/JPS6054666B2/en
Priority claimed from JP15561077A external-priority patent/JPS5950049B2/en
Priority claimed from JP15668777A external-priority patent/JPS6023341B2/en
Priority claimed from JP15748177A external-priority patent/JPS5950050B2/en
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK filed Critical Asahi Chemical Industry Co Ltd
Publication of FR2409535A1 publication Critical patent/FR2409535A1/en
Application granted granted Critical
Publication of FR2409535B1 publication Critical patent/FR2409535B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

L'INVENTION CONCERNE UNE NOUVELLE COMPOSITION PHOTORESIST. CETTE COMPOSITION COMPREND: 1.100 PARTIES EN POIDS D'UN POLYAMIDE-IMIDE AROMATIQUE SOLUBLE DANS UN SOLVANT POLAIRE ORGANIQUE COMPORTANT DES NOYAUX AROMATIQUES LIES A LEURS POSITIONS RESPECTIVES 1- ET 3-, ET COMPORTANT DES LIAISONS AMIDES ET DES GROUPES TERMINAUX NON SUBSTITUES OU PARTIELLEMENT SUBSTITUES PAR DES GROUPES CINNAMATE, ACRYLATE OU METHACRYLATE. 2.0,01 A 20 PARTIES EN POIDS D'UN COMPOSE PHOTOSENSIBLE; ET 3.0 A 100 PARTIES EN POIDS D'UN COMPOSE COMPORTANT DANS SA MOLECULE AU MOINS UNE DOUBLE LIAISON ETHYLENIQUEMENT INSATUREE. CETTE COMPOSITION PERMET DE FORMER DES PHOTORESIST AYANT UNE EXCELLENTE RESISTANCE A LA CHALEUR AINSI QU'UNE PROPRIETE D'ISOLATION EXCELLENTE.THE INVENTION RELATES TO A NEW PHOTORESIST COMPOSITION. THIS COMPOSITION INCLUDES: 1,100 PARTS BY WEIGHT OF AN AROMATIC POLYAMIDE-IMIDE SOLUBLE IN AN ORGANIC POLAR SOLVENT CONTAINING AROMATIC CORES LINKED TO THEIR RESPECTIVE 1- AND 3- POSITIONS, AND INCLUDING AMID BONDS AND NON-SUBSTITUTE OR PARTIAL TERMINAL GROUPS BY CINNAMATE, ACRYLATE OR METHACRYLATE GROUPS. 2.0.01 TO 20 PARTS BY WEIGHT OF A PHOTOSENSITIVE COMPOUND; AND 3.0 TO 100 PARTS BY WEIGHT OF A COMPONENT CONTAINING AT LEAST ONE DOUBLE ETHYLENICALLY UNSATURATED BOND. THIS COMPOSITION ALLOWS TO FORM PHOTORESISTS HAVING EXCELLENT HEAT RESISTANCE AS WELL AS AN EXCELLENT INSULATION PROPERTY.

FR7832525A 1977-11-17 1978-11-17 HEAT-RESISTANT "PHOTORESIST" COMPOSITION AND METHOD FOR PREPARING THE SAME Granted FR2409535A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP13725677A JPS6054666B2 (en) 1977-11-17 1977-11-17 Heat-resistant photoresist composition and method for producing the same
JP15561077A JPS5950049B2 (en) 1977-12-26 1977-12-26 Heat-resistant photoresist composition
JP15668777A JPS6023341B2 (en) 1977-12-27 1977-12-27 Heat-resistant photoresist composition and method for producing the same
JP15748177A JPS5950050B2 (en) 1977-12-28 1977-12-28 Heat-resistant photoresist composition and method for producing the same

Publications (2)

Publication Number Publication Date
FR2409535A1 true FR2409535A1 (en) 1979-06-15
FR2409535B1 FR2409535B1 (en) 1983-01-21

Family

ID=27472052

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7832525A Granted FR2409535A1 (en) 1977-11-17 1978-11-17 HEAT-RESISTANT "PHOTORESIST" COMPOSITION AND METHOD FOR PREPARING THE SAME

Country Status (3)

Country Link
DE (1) DE2849981A1 (en)
FR (1) FR2409535A1 (en)
GB (1) GB2008784B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2456339A1 (en) * 1979-05-11 1980-12-05 Minnesota Mining & Mfg POLYMERIZATION OF POLYAMIC ACIDS OR THEIR SALTS BY THE ACTION OF ULTRAVIOLET
EP0157139A2 (en) * 1984-02-28 1985-10-09 Bayer Ag Process for the phenol-free preparation of aromatic-aliphatic polyamide imides

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5614554A (en) * 1979-07-13 1981-02-12 Kanegafuchi Chem Ind Co Ltd Heat resistant resin composition
US8771924B2 (en) 2006-12-26 2014-07-08 Fujifilm Corporation Polymerizable composition, lithographic printing plate precursor and lithographic printing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2130183A1 (en) * 1971-03-13 1972-11-03 Agfa Gevaert Ag
FR2316257A1 (en) * 1975-06-18 1977-01-28 Ciba Geigy Ag POLYMERIC COMPOUNDS WHICH MAY BE CROSS-LINKED BY ELECTRIC RADIATION

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1181446A (en) * 1966-07-22 1970-02-18 Hitachi Chemical Co Ltd Process for producing Amide-Imide Resins
ZA716460B (en) * 1970-11-19 1972-07-26 Gen Electric Improved polyamideimides

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2130183A1 (en) * 1971-03-13 1972-11-03 Agfa Gevaert Ag
FR2316257A1 (en) * 1975-06-18 1977-01-28 Ciba Geigy Ag POLYMERIC COMPOUNDS WHICH MAY BE CROSS-LINKED BY ELECTRIC RADIATION

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2456339A1 (en) * 1979-05-11 1980-12-05 Minnesota Mining & Mfg POLYMERIZATION OF POLYAMIC ACIDS OR THEIR SALTS BY THE ACTION OF ULTRAVIOLET
EP0157139A2 (en) * 1984-02-28 1985-10-09 Bayer Ag Process for the phenol-free preparation of aromatic-aliphatic polyamide imides
EP0157139A3 (en) * 1984-02-28 1987-12-09 Bayer Ag Process for the phenol-free preparation of aromatic-aliphatic polyamide imides

Also Published As

Publication number Publication date
GB2008784A (en) 1979-06-06
FR2409535B1 (en) 1983-01-21
GB2008784B (en) 1982-04-15
DE2849981C2 (en) 1987-07-16
DE2849981A1 (en) 1979-05-23

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Legal Events

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