FR2386573A1 - Co:polyamide hot melt adhesives - prepd. from a mixt. of long and short chain di:carboxylic acids, polyoxyalkylene di:amine and piperazine (BE 4.10.78) - Google Patents
Co:polyamide hot melt adhesives - prepd. from a mixt. of long and short chain di:carboxylic acids, polyoxyalkylene di:amine and piperazine (BE 4.10.78)Info
- Publication number
- FR2386573A1 FR2386573A1 FR7809945A FR7809945A FR2386573A1 FR 2386573 A1 FR2386573 A1 FR 2386573A1 FR 7809945 A FR7809945 A FR 7809945A FR 7809945 A FR7809945 A FR 7809945A FR 2386573 A1 FR2386573 A1 FR 2386573A1
- Authority
- FR
- France
- Prior art keywords
- mixt
- piperazine
- hot melt
- melt adhesives
- prepd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/40—Polyamides containing oxygen in the form of ether groups
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A copolyamide contains stoichiometric amts. of gps. derived from a mixt. of satd. 2-7C aliphatic dicarboxylic acids (I) with satd. 8-14C aliphatic dicarboxylic acids (II), piperazine (III) and a polyoxyalkylenediamine of formula: H2NCH(Me)CH2- -OC(R)HCH2- m-OCH2C(Me)HNH2 (IV) (where R is H or Me and m is a positive whole number such that (IV) has a mol. wt. of 200-800). The equiv. ratio of (II):(I) is 0.5:0.5-0.9:0.1 (0.65:0.35-0.80:0.20) and the equiv. ratio of (III):(IV) is 0.7:0.3-0.95:0.05. The polyamides are hot melt adhesives having excellent adhesion and resistance to creep. They are esp. suitable for plasticised vinyl substrates as well as for textiles, polymers, metals, paper products, wood, glass, etc.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US78392977A | 1977-04-04 | 1977-04-04 | |
NLAANVRAGE7803929,A NL182666C (en) | 1977-04-18 | 1978-04-13 | ROD SEAL. |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2386573A1 true FR2386573A1 (en) | 1978-11-03 |
Family
ID=26645403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7809945A Withdrawn FR2386573A1 (en) | 1977-04-04 | 1978-04-04 | Co:polyamide hot melt adhesives - prepd. from a mixt. of long and short chain di:carboxylic acids, polyoxyalkylene di:amine and piperazine (BE 4.10.78) |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2386573A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002016472A1 (en) * | 2000-08-19 | 2002-02-28 | Henkel Kommanditgesellschaft Auf Aktien | Moulded parts made of polyamides which are free of dimeric acids |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2292754A1 (en) * | 1974-11-29 | 1976-06-25 | Texaco Development Corp | NEW THERMOPLASTIC ADHESIVE COMPOSITIONS |
-
1978
- 1978-04-04 FR FR7809945A patent/FR2386573A1/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2292754A1 (en) * | 1974-11-29 | 1976-06-25 | Texaco Development Corp | NEW THERMOPLASTIC ADHESIVE COMPOSITIONS |
DE2552455A1 (en) * | 1974-11-29 | 1976-08-12 | Texaco Development Corp | THERMOPLASTIC ADHESIVE COMPOUNDS AND METHOD FOR THEIR PRODUCTION |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002016472A1 (en) * | 2000-08-19 | 2002-02-28 | Henkel Kommanditgesellschaft Auf Aktien | Moulded parts made of polyamides which are free of dimeric acids |
US6960315B2 (en) | 2000-08-19 | 2005-11-01 | Henkel Kommanditgesellschaft Auf Aktien | Method for forming moldings from dimer fatty acid free polyamides |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name | ||
TP | Transmission of property | ||
ST | Notification of lapse |