FR2379910A1 - Dispositif semi-conducteur et procede pour son enrobage - Google Patents

Dispositif semi-conducteur et procede pour son enrobage

Info

Publication number
FR2379910A1
FR2379910A1 FR7803222A FR7803222A FR2379910A1 FR 2379910 A1 FR2379910 A1 FR 2379910A1 FR 7803222 A FR7803222 A FR 7803222A FR 7803222 A FR7803222 A FR 7803222A FR 2379910 A1 FR2379910 A1 FR 2379910A1
Authority
FR
France
Prior art keywords
cocoon
semiconductor component
semiconductor device
hand
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7803222A
Other languages
English (en)
French (fr)
Other versions
FR2379910B1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL7701284A external-priority patent/NL7701284A/xx
Priority claimed from NL7701283A external-priority patent/NL7701283A/xx
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2379910A1 publication Critical patent/FR2379910A1/fr
Application granted granted Critical
Publication of FR2379910B1 publication Critical patent/FR2379910B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C45/0408—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
    • C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C2045/0475—Injection moulding apparatus using movable moulds or mould halves continuously movable moulds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/04—Polysulfides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Molding Of Porous Articles (AREA)
FR7803222A 1977-02-08 1978-02-06 Dispositif semi-conducteur et procede pour son enrobage Granted FR2379910A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL7701284A NL7701284A (en) 1977-02-08 1977-02-08 Encapsulating transistors using epoxide! fluidised bed - producing inner protection which is encapsulated using injected foam thermoplastic inside mould (BE 7.8.78)
NL7701283A NL7701283A (nl) 1977-02-08 1977-02-08 Werkwijze voor het vervaardigen van geheel of ge- deeltelijk uit geschuimd thermoplastisch materiaal bestaande voorwerpen, voorwerpen vervaardigd volgens die werkwijze en inrichting voor het uitvoeren van de werkwijze.

Publications (2)

Publication Number Publication Date
FR2379910A1 true FR2379910A1 (fr) 1978-09-01
FR2379910B1 FR2379910B1 (enrdf_load_stackoverflow) 1984-05-04

Family

ID=26645284

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7803222A Granted FR2379910A1 (fr) 1977-02-08 1978-02-06 Dispositif semi-conducteur et procede pour son enrobage

Country Status (12)

Country Link
JP (1) JPS53112063A (enrdf_load_stackoverflow)
AR (1) AR214553A1 (enrdf_load_stackoverflow)
AT (1) ATA87478A (enrdf_load_stackoverflow)
AU (1) AU513092B2 (enrdf_load_stackoverflow)
BR (1) BR7800732A (enrdf_load_stackoverflow)
CA (1) CA1093704A (enrdf_load_stackoverflow)
DE (1) DE2804956A1 (enrdf_load_stackoverflow)
ES (1) ES466679A1 (enrdf_load_stackoverflow)
FR (1) FR2379910A1 (enrdf_load_stackoverflow)
GB (1) GB1594892A (enrdf_load_stackoverflow)
IT (1) IT1092425B (enrdf_load_stackoverflow)
SE (1) SE7801325L (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0406634A1 (de) * 1989-07-05 1991-01-09 Bayer Ag Verfahren zur Herstellung eines hochtemperaturbeständigen TSG- Schaumes aus Polyarylensulfiden

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2930760A1 (de) * 1979-07-28 1981-02-12 Itt Ind Gmbh Deutsche Verfahren zum umhuellen von halbleiterbauelementen mittels spritzgiessens
DE3019239A1 (de) * 1980-05-20 1981-11-26 SIEMENS AG AAAAA, 1000 Berlin und 8000 München Umhuellung fuer halbleiterbauelement
US4460537A (en) * 1982-07-26 1984-07-17 Motorola, Inc. Slot transfer molding apparatus and methods
JPS63112923U (enrdf_load_stackoverflow) * 1987-01-16 1988-07-20
JP2774906B2 (ja) * 1992-09-17 1998-07-09 三菱電機株式会社 薄形半導体装置及びその製造方法
US6046076A (en) * 1994-12-29 2000-04-04 Tessera, Inc. Vacuum dispense method for dispensing an encapsulant and machine therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0406634A1 (de) * 1989-07-05 1991-01-09 Bayer Ag Verfahren zur Herstellung eines hochtemperaturbeständigen TSG- Schaumes aus Polyarylensulfiden
US5114983A (en) * 1989-07-05 1992-05-19 Bayer Aktiengesellschaft Use of polyarylene sulphides for the production of a structural foam resistant to high temperatures, process for the preparation of this foam, and moldings obtainable by this process
US5126380A (en) * 1989-07-05 1992-06-30 Stahlke Kurt Rainer Use of polyarylene sulphides for the production of a structural foam resistant to high temperatures, process for the preparation of this foam, and mouldings obtainable by this process

Also Published As

Publication number Publication date
BR7800732A (pt) 1978-10-10
AR214553A1 (es) 1979-06-29
ATA87478A (de) 1982-07-15
CA1093704A (en) 1981-01-13
ES466679A1 (es) 1979-07-01
FR2379910B1 (enrdf_load_stackoverflow) 1984-05-04
JPS53112063A (en) 1978-09-30
AU3303878A (en) 1979-08-16
DE2804956A1 (de) 1978-08-10
IT1092425B (it) 1985-07-12
SE7801325L (sv) 1978-08-09
GB1594892A (en) 1981-08-05
AU513092B2 (en) 1980-11-13
JPS5722420B2 (enrdf_load_stackoverflow) 1982-05-13
IT7819995A0 (it) 1978-02-03

Similar Documents

Publication Publication Date Title
JPS55111151A (en) Integrated circuit device
KR860002141A (ko) 에프롬(EPROM; Erasable Programmable Read Only Memory)장치
KR950021435A (ko) 수지 봉지형 반도체 장치 및 그 제조 방법
KR0134790B1 (en) Arrangement for encasing a functional device and a process for production of same
ES2020207B3 (es) Elemento electrico con revestimiento de materia plastica y procedimiento para su fabricacion.
KR900002087B1 (en) Semiconductor intergruted circuit device
KR840005921A (ko) 전자 장치
KR890017802A (ko) 반도체 장치용 리드프레임
FR2379910A1 (fr) Dispositif semi-conducteur et procede pour son enrobage
EP0491433A3 (en) Method of forming conductive region on silicon semiconductor material, and silicon semiconductor device with such region
KR830009650A (ko) 반도체 장치
JPS5724563A (en) Semiconductor device
JPS5788752A (en) Lead frame and semiconductor device prepared by using the same
JPS5624958A (en) Lead frame for semiconductor device
JPS5635448A (en) Semiconductor device
EP0341504A3 (en) Plastic chip carrier package and method of preparation
JPS57114263A (en) Semiconductor device
JPS57159032A (en) Forming method for package of electronic timepiece
JPS5776869A (en) Semiconductor device
IE801542L (en) Encapsulating semiconductors.
JPS57164571A (en) Semiconductro integrated circuit device
GB2002967A (en) Integrated circuit assembly
JPS572537A (en) Semiconductor device
JPS57211782A (en) Semiconductor device
JPS57130436A (en) Sealing method of semiconductor device with resin

Legal Events

Date Code Title Description
ST Notification of lapse