FR2365214A1 - Dispositif a diodes a semiconducteur pour la production ou pour la reception d'un rayonnement - Google Patents

Dispositif a diodes a semiconducteur pour la production ou pour la reception d'un rayonnement

Info

Publication number
FR2365214A1
FR2365214A1 FR7727201A FR7727201A FR2365214A1 FR 2365214 A1 FR2365214 A1 FR 2365214A1 FR 7727201 A FR7727201 A FR 7727201A FR 7727201 A FR7727201 A FR 7727201A FR 2365214 A1 FR2365214 A1 FR 2365214A1
Authority
FR
France
Prior art keywords
radiation
semiconductor diode
diode device
reception
generation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7727201A
Other languages
English (en)
French (fr)
Other versions
FR2365214B1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of FR2365214A1 publication Critical patent/FR2365214A1/fr
Application granted granted Critical
Publication of FR2365214B1 publication Critical patent/FR2365214B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/041—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass H10F
    • H01L25/042—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass H10F the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
FR7727201A 1976-09-15 1977-09-08 Dispositif a diodes a semiconducteur pour la production ou pour la reception d'un rayonnement Granted FR2365214A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2641540A DE2641540C2 (de) 1976-09-15 1976-09-15 Lumineszenzdiodenzeile zur Erzeugung eines sehr feinen Rasters von Lichtpunkten

Publications (2)

Publication Number Publication Date
FR2365214A1 true FR2365214A1 (fr) 1978-04-14
FR2365214B1 FR2365214B1 (enrdf_load_stackoverflow) 1982-11-19

Family

ID=5987987

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7727201A Granted FR2365214A1 (fr) 1976-09-15 1977-09-08 Dispositif a diodes a semiconducteur pour la production ou pour la reception d'un rayonnement

Country Status (7)

Country Link
AT (1) AT368321B (enrdf_load_stackoverflow)
CH (1) CH616277A5 (enrdf_load_stackoverflow)
DE (1) DE2641540C2 (enrdf_load_stackoverflow)
FR (1) FR2365214A1 (enrdf_load_stackoverflow)
IT (1) IT1084435B (enrdf_load_stackoverflow)
NL (1) NL7709752A (enrdf_load_stackoverflow)
SE (1) SE7709857L (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5659260A (en) * 1979-09-26 1981-05-22 Siemens Ag Charged latent image forming device for electronic printing
DE3048288A1 (de) * 1980-12-20 1982-07-29 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Anordnung aus wenigstens einem lichtemittierendem halbleiterbauelement
EP0074719B1 (en) * 1981-08-11 1986-03-12 Xerox Corporation Imaging device
DE3429107C2 (de) * 1983-08-08 1996-12-12 Canon Kk Bildaufzeichnungsgerät
DE3438949C2 (de) * 1983-10-25 1994-03-10 Canon Kk Druckvorrichtung
JPS612620U (ja) * 1984-06-11 1986-01-09 東芝ライテック株式会社 発光ダイオ−ドアレイ
US4929965A (en) * 1987-09-02 1990-05-29 Alps Electric Co. Optical writing head
KR910003735B1 (ko) * 1988-12-17 1991-06-10 삼성전자 주식회사 발광장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1572873A (enrdf_load_stackoverflow) * 1967-07-26 1969-06-27
FR2197201A1 (enrdf_load_stackoverflow) * 1972-08-10 1974-03-22 Sony Corp

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3290539A (en) * 1963-09-16 1966-12-06 Rca Corp Planar p-nu junction light source with reflector means to collimate the emitted light
JPS5223717B2 (enrdf_load_stackoverflow) * 1972-05-02 1977-06-25
US3911431A (en) * 1973-01-22 1975-10-07 Tokyo Shibaura Electric Co Light-emitting display device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1572873A (enrdf_load_stackoverflow) * 1967-07-26 1969-06-27
FR2197201A1 (enrdf_load_stackoverflow) * 1972-08-10 1974-03-22 Sony Corp

Also Published As

Publication number Publication date
DE2641540A1 (de) 1978-03-16
IT1084435B (it) 1985-05-25
DE2641540C2 (de) 1981-10-29
CH616277A5 (en) 1980-03-14
ATA526477A (de) 1982-01-15
FR2365214B1 (enrdf_load_stackoverflow) 1982-11-19
NL7709752A (nl) 1978-03-17
SE7709857L (sv) 1978-03-16
AT368321B (de) 1982-10-11

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