FR2361747A1 - Composant a semi-conducteurs muni d'un boitier en forme de disque - Google Patents

Composant a semi-conducteurs muni d'un boitier en forme de disque

Info

Publication number
FR2361747A1
FR2361747A1 FR7724030A FR7724030A FR2361747A1 FR 2361747 A1 FR2361747 A1 FR 2361747A1 FR 7724030 A FR7724030 A FR 7724030A FR 7724030 A FR7724030 A FR 7724030A FR 2361747 A1 FR2361747 A1 FR 2361747A1
Authority
FR
France
Prior art keywords
semiconductor
semiconductor component
disc
housing
shaped case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7724030A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2361747A1 publication Critical patent/FR2361747A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

a. L'invention concerne un composant à semi-conducteurs, comprenant un boîtier composé par un fond métallique et par un couvercle métallique assembles mécaniquement entre eux à l'aide d'une matière isolante, boîtier dans lequel est monté l'élément semi-conducteur. b. Le couvercle a la forme d'un godet qui comporte un élément de fond et un élément de paroi; une électrode de l'élément semi-conducteur porte contre l'élément de fond; le fond du boîtier est pourvu d'une gorge dans laquelle pénètre l'élément de paroi; l'autre électrode de l'élément semi-conducteur porte contre la surface du fond du boîtier entourée par ladite gorge que l'on remplit avec une masse isolante en quantite suffisante pour que l'élément de paroi puisse y plonger. c. Application à la fabrication de composants à semi-conducteurs de types variés.
FR7724030A 1976-08-13 1977-08-04 Composant a semi-conducteurs muni d'un boitier en forme de disque Withdrawn FR2361747A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762636629 DE2636629A1 (de) 1976-08-13 1976-08-13 Halbleiterbauelement mit scheibenfoermigem gehaeuse

Publications (1)

Publication Number Publication Date
FR2361747A1 true FR2361747A1 (fr) 1978-03-10

Family

ID=5985435

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7724030A Withdrawn FR2361747A1 (fr) 1976-08-13 1977-08-04 Composant a semi-conducteurs muni d'un boitier en forme de disque

Country Status (5)

Country Link
JP (1) JPS6013308B2 (fr)
DE (1) DE2636629A1 (fr)
FR (1) FR2361747A1 (fr)
GB (1) GB1548109A (fr)
IT (1) IT1085732B (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2421464A1 (fr) * 1978-03-28 1979-10-26 Westinghouse Electric Corp Dispositif semi-conducteur encapsule
EP0450980A1 (fr) * 1990-04-06 1991-10-09 Motorola Semiconducteurs S.A. Améliorations pour ou concernant l'empaquetage de dispositifs semi-conducteurs
EP0567996A1 (fr) * 1992-04-28 1993-11-03 Mitsubishi Denki Kabushiki Kaisha Dispositif semi-conducteur et procédé pour son assemblage

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081327A (en) * 1990-03-28 1992-01-14 Cabot Corporation Sealing system for hermetic microchip packages

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR74228E (fr) * 1957-09-30 1960-11-07 Gen Motors Corp Transistor perfectionné
DE1564665A1 (de) * 1966-07-18 1969-12-11 Siemens Ag Halbleiteranordnung und Verfahren zum Herstellen einer solchen
FR2083557A1 (fr) * 1970-03-25 1971-12-17 Semikron Gleichrichterbau

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR74228E (fr) * 1957-09-30 1960-11-07 Gen Motors Corp Transistor perfectionné
DE1564665A1 (de) * 1966-07-18 1969-12-11 Siemens Ag Halbleiteranordnung und Verfahren zum Herstellen einer solchen
FR2083557A1 (fr) * 1970-03-25 1971-12-17 Semikron Gleichrichterbau

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2421464A1 (fr) * 1978-03-28 1979-10-26 Westinghouse Electric Corp Dispositif semi-conducteur encapsule
EP0450980A1 (fr) * 1990-04-06 1991-10-09 Motorola Semiconducteurs S.A. Améliorations pour ou concernant l'empaquetage de dispositifs semi-conducteurs
FR2660797A1 (fr) * 1990-04-06 1991-10-11 Motorola Semiconducteurs Boitier d'encapsulage perfectionne pour dispositif a semiconducteur.
EP0567996A1 (fr) * 1992-04-28 1993-11-03 Mitsubishi Denki Kabushiki Kaisha Dispositif semi-conducteur et procédé pour son assemblage
US5371386A (en) * 1992-04-28 1994-12-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of assembling the same

Also Published As

Publication number Publication date
IT1085732B (it) 1985-05-28
JPS5323274A (en) 1978-03-03
DE2636629A1 (de) 1978-02-16
GB1548109A (en) 1979-07-04
JPS6013308B2 (ja) 1985-04-06

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Legal Events

Date Code Title Description
ST Notification of lapse