FR2352480A7 - Vacuum tight enclosure for integrated microwave circuits - is constructed from iron-nickel-cobalt alloy and works in given frequency bands - Google Patents
Vacuum tight enclosure for integrated microwave circuits - is constructed from iron-nickel-cobalt alloy and works in given frequency bandsInfo
- Publication number
- FR2352480A7 FR2352480A7 FR7615381A FR7615381A FR2352480A7 FR 2352480 A7 FR2352480 A7 FR 2352480A7 FR 7615381 A FR7615381 A FR 7615381A FR 7615381 A FR7615381 A FR 7615381A FR 2352480 A7 FR2352480 A7 FR 2352480A7
- Authority
- FR
- France
- Prior art keywords
- enclosure
- constructed
- microwave circuits
- integrated microwave
- vacuum tight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
Abstract
A vacuum tight enclosure is constructed from an Fe-Ni-Co alloy and is intended esp. for use with hybrid and integrated microwave circuits working in the 'L' and 'K' bands. The enclosure design employs already well established soldering techniques and does not depend on critical quantities of solder or strict temperature control. The enclosure is in the form of a shallow and roughly rectangular box. Co-axial cable entry is through the end walls of the enclosure the centre conductor (4) entering through a glass to metal seal (5). The substrate (7) carrying the circuitry is soldered under vacuum at 340 deg.C, the cover plate (12) being soldered in plate at high speed using a graphite block as one electrode such that the overall enclosure temperature remains below 340 deg.C.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7615381A FR2352480A7 (en) | 1976-05-21 | 1976-05-21 | Vacuum tight enclosure for integrated microwave circuits - is constructed from iron-nickel-cobalt alloy and works in given frequency bands |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7615381A FR2352480A7 (en) | 1976-05-21 | 1976-05-21 | Vacuum tight enclosure for integrated microwave circuits - is constructed from iron-nickel-cobalt alloy and works in given frequency bands |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2352480A7 true FR2352480A7 (en) | 1977-12-16 |
Family
ID=9173468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7615381A Expired FR2352480A7 (en) | 1976-05-21 | 1976-05-21 | Vacuum tight enclosure for integrated microwave circuits - is constructed from iron-nickel-cobalt alloy and works in given frequency bands |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2352480A7 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4873615A (en) * | 1986-10-09 | 1989-10-10 | Amp Incorporated | Semiconductor chip carrier system |
FR2657222A1 (en) * | 1990-01-12 | 1991-07-19 | Egide Sa | Box for electronic components, especially hybrid components, with high breakdown voltages |
WO1992003031A1 (en) * | 1990-08-03 | 1992-02-20 | Matra Marconi Space (Uk) Limited | Packaging for hybrid circuits |
FR2672183A1 (en) * | 1991-01-24 | 1992-07-31 | Egide Sa | Method of producing a double-body case for electronic components |
-
1976
- 1976-05-21 FR FR7615381A patent/FR2352480A7/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4873615A (en) * | 1986-10-09 | 1989-10-10 | Amp Incorporated | Semiconductor chip carrier system |
FR2657222A1 (en) * | 1990-01-12 | 1991-07-19 | Egide Sa | Box for electronic components, especially hybrid components, with high breakdown voltages |
WO1992003031A1 (en) * | 1990-08-03 | 1992-02-20 | Matra Marconi Space (Uk) Limited | Packaging for hybrid circuits |
FR2672183A1 (en) * | 1991-01-24 | 1992-07-31 | Egide Sa | Method of producing a double-body case for electronic components |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |