FR2279307A1 - Procede de fixation d'un composant sur un support - Google Patents
Procede de fixation d'un composant sur un supportInfo
- Publication number
- FR2279307A1 FR2279307A1 FR7424533A FR7424533A FR2279307A1 FR 2279307 A1 FR2279307 A1 FR 2279307A1 FR 7424533 A FR7424533 A FR 7424533A FR 7424533 A FR7424533 A FR 7424533A FR 2279307 A1 FR2279307 A1 FR 2279307A1
- Authority
- FR
- France
- Prior art keywords
- adhesive
- filament
- ceramic substrate
- electronic component
- component fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09772—Conductors directly under a component but not electrically connected to the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7424533A FR2279307A1 (fr) | 1974-07-15 | 1974-07-15 | Procede de fixation d'un composant sur un support |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7424533A FR2279307A1 (fr) | 1974-07-15 | 1974-07-15 | Procede de fixation d'un composant sur un support |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2279307A1 true FR2279307A1 (fr) | 1976-02-13 |
FR2279307B1 FR2279307B1 (fr) | 1979-08-24 |
Family
ID=9141282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7424533A Granted FR2279307A1 (fr) | 1974-07-15 | 1974-07-15 | Procede de fixation d'un composant sur un support |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2279307A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4103267A (en) * | 1977-06-13 | 1978-07-25 | Burr-Brown Research Corporation | Hybrid transformer device |
EP0069824A1 (fr) * | 1978-05-10 | 1983-01-19 | Siemens Aktiengesellschaft | Procédé pour contacter le côté adhésif d'une électrode d'un dispositif électrique |
-
1974
- 1974-07-15 FR FR7424533A patent/FR2279307A1/fr active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4103267A (en) * | 1977-06-13 | 1978-07-25 | Burr-Brown Research Corporation | Hybrid transformer device |
FR2394878A1 (fr) * | 1977-06-13 | 1979-01-12 | Burr Brown Res Corp | Transformateur electrique pour circuit hybride |
EP0069824A1 (fr) * | 1978-05-10 | 1983-01-19 | Siemens Aktiengesellschaft | Procédé pour contacter le côté adhésif d'une électrode d'un dispositif électrique |
Also Published As
Publication number | Publication date |
---|---|
FR2279307B1 (fr) | 1979-08-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69201547D1 (de) | Silikon druckempfindliche Klebstoffe mit verbesserter Haftung an Substraten mit niedriger Oberflächenspannung. | |
GB2139115B (en) | Article comprising silicone resin coated, methacrylate-primed substrate | |
FI883075A0 (fi) | Lämpökovettuva silikoniseos sekä menetelmä alustan pinnoittamiseksi seoksella | |
KR900008918A (ko) | 배선기판과 그 제조방법, 박막 캐리어, 반도체 장치 및 그 장착구조와 반도체 장치장착 방법 | |
JPS56150830A (en) | Semiconductor device | |
DE59205177D1 (de) | Beschichtetes transparentes Substrat, Verwendung hiervon, Verfahren und Anlage zur Herstellung der Schichten, und Hafnium-Oxinitrid (HfOxNy) mit 1,5 x/y 3 und 2,6 n 2,8 | |
DE3369581D1 (en) | Time piece and method of manufacturing the same | |
DE69205171D1 (de) | Grundiermittel für Silikonsubstrate. | |
NO880797D0 (no) | Substrat for elektriske komponenter. | |
FR2279307A1 (fr) | Procede de fixation d'un composant sur un support | |
EP0125114A3 (en) | A method of coating a substrate with a silicone release coating | |
IT8223291A0 (it) | Procedimento e composizione per rivestire un substrato metallico con un film polimerico. | |
JPS51125138A (en) | Thermosetting adhesive composition showing tackiness at normal tempera tvre and conpition | |
JPS5365682A (en) | Driving circuit for thin film el element | |
DE3786362D1 (de) | Mit aufgeloesten metallpartikelaggregaten beschichtete substrate. | |
JPS5710951A (en) | Semiconductor device | |
JPS51119686A (en) | A method for forming a film on the metal surface | |
GB1467245A (en) | Method of securing component to a substrate | |
CA972226A (en) | Process for enhancing the adhesiveness of polyamides and for coating polyamide substrates with silicone rubbers | |
JPS5224467A (en) | Mounting method of electric element | |
JPS6436492A (en) | Postal card having lot and manufacture thereof | |
DE3767732D1 (de) | Beschichtete substrate. | |
FR2293852A1 (fr) | Dispositif de raccordement et de fixation pour un substrat en verre ou en ceramique sur lequel sont disposees des configurations de circuit realisees suivant la technique des circuits a couches | |
JPS5291195A (en) | Wiring sheet | |
JPS5247033A (en) | Releasable adhesive |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name | ||
TP | Transmission of property | ||
ST | Notification of lapse |